The present application discloses and claims a method to make a flexible ceramic fibers (Flexiramics™) and polymer composites. The resulting composite has an improved mechanical strength (tensile) when compared with the Flexiramics™ alone. Several different polymers can be used, both thermosets and thermoplastics. Flexiramics™ has unique physical characteristics and the composite materials can be used for numerous industrial and laboratory applications.

A decorative paper layer may include a base paper layer, an inkjet receiver coating and a pattern formed thereon by digitally applying inks from a set of a plurality of differently colored inks. At least one of the inks may include color pigments having an average particle diameter larger than 150. The inkjet receiver coating may include silica pigments, in which the silica particles are particles of precipitated silica and/or silica gel and/or have an average particle size which is at least 4 times larger than the average particle diameter of the color pigments and/or have an average particle size of 1 to 40 micrometer.

The present invention provides an amide acid oligomer which has specific composition and which is capable of providing a cured product having excellent physical properties, in particular, an excellent glass transition temperature, etc.

Provided are a sizing agent coated carbon fiber bundle that has excellent mechanical characteristics when used as a carbon fiber reinforced composite material, as well as excellent ease of handling; a method for manufacturing the same; and a prepreg and carbon fiber reinforced composite material of excellent mechanical characteristics, employing the fiber bundle. The carbon fiber bundle is coated with a sizing agent that includes a polyether aliphatic epoxy compound having two or more epoxy groups per molecule and/or a polyol aliphatic epoxy compound or a non-water-soluble compound having a glass transition temperature of −100-50° C., wherein the sizing agent coated carbon fiber bundle is characterized in that the flatness ratio (width/thickness) of the carbon fiber bundle cross section is 10-150, and a two edge part/center part sizing agent deposition ratio, obtained by dividing the carbon fiber bundle in the width direction along the fiber direction into three equal parts by mass, and computing the ratio from the ratio of the mass of the sizing agent to the mass of the carbon fiber bundle in the center part and in both end parts, is 1.05-1.5.

The present invention concerns a sizing composition for glass fibers comprising the following components: (a) A silane based coupling agent which is not an aminosilane; (b) A film former; (c) A borate; (d) A lubricant Characterized in that, at least 75 wt. % of the silane coupling agent present in the composition is dialkoxylated. It also concerns a glass fiber sized with the reaction product of said sizing composition, as well as a polymeric composite reinforced with such glass fibers.

Provided are a cellulose fiber containing cellulose II, the cellulose fiber having improved heat resistance, as well as a fiber reinforced resin composition, a method for producing the cellulose fiber, and a method for producing the fiber reinforced resin composition. The cellulose fiber contains the cellulose II having a content of an imidazolium salt of 1% by mass or less.

A carbon fiber bundle for resin reinforcement, wherein there are adhered by 0.1-5.0 mass % to a carbon fiber bundle in which multiple lengths of filament are bundled, a mixture created by mixing an organic polymer (A) having a mass-average molecular weight of 10000 or more and an organic compound (B) the thermal reduction rate specified in claim 1 of which is 5 mass % or more or an organic compound (B) the thermal reduction rate specified in claim 2 of which is 0.8 mass % or more, the amount of the organic polymer (A) adhered being 0.1 mass % or more.

This invention relates to a composition comprising a semisolid epoxy resin containing a curative dispersed therein. The curative has a particle size such that at least 90% of the particles have a size below 25 pm at ambient temperature of 21° C., wherein the composition further comprises a diluent containing a particulate filler. The composition is used as matrix in prepregs. The use of the diluent increases peel strength of the composition when brought into contact with metal or wood substrate.

The present invention related to a thermosetting resin composition for high frequency, the composition containing (a) a polyphenylene ether having two or more unsaturated substituent groups selected from the group consisting of the vinyl group and the allyl group at both ends of the molecular chain thereof, or an oligomer of said polyphenylene ether; (b) three or more different types of cross-linking curing agents; and (c) a flame retardant. The present invention may provide a printed circuit board for high frequency which simultaneously exhibits low dielectric loss characteristic and good moisture-absorption heat resistance, low thermal expansion characteristics, excellent thermal stability, excellent processability, and the like.

Provided are: a resin-containing sheet in which not only the mechanical strength of a cellulose nanofiber nonwoven fabric but also the flexural resistance of a substrate are improved; and a structure and a wiring board which include the same. The resin-containing sheet includes: a specific cellulose nanofiber nonwoven fabric (11); a fixing agent (2) which fixes together fibers (1) in the cellulose nanofiber nonwoven fabric (11); and a resin (3) which is in contact with the cellulose nanofiber nonwoven fabric (11) and the fixing agent (2), wherein the storage modulus of the fixing agent (2) is higher than that of the resin (3). The structure is obtained by tightly adhering the resin-containing sheet to a substrate. The wiring board includes this structure.