A resin composition contains a component (A) being a polyphenylene ether in which the hydroxy group at an end of the main chain thereof has been modified with an ethylenically unsaturated compound, a component (B) being at least one of triallyl isocyanurate and triallyl cyanurate, and a component (C) being an organic peroxide containing no benzene ring. The component (C) is contained with a proportion of 0.1% to 7% by mass relative to 100% by mass of the total mass of the components (A), (B), and (C).

An epoxy resin composition for a fiber-reinforced composite material includes: (a) one or more epoxy resins; (b) an aromatic diamine compound; (c) a dicyandiamide; (d) a urea compound; and (e) an amine adduct compound, blended in specific ranges.

Provided are a fiber-reinforced composite material excellent in heat resistance and strength properties, an epoxy resin composition to obtain the fiber-reinforced composite material, and a prepreg obtained by using the epoxy resin composition. Further provided are a fiber-reinforced composite material having less volatile matters during the curing time, and having excellent heat resistance and strength properties, an epoxy resin composition to obtain the fiber-reinforced composite material, and a prepreg obtained by using the epoxy resin composition. Provided are: an epoxy resin composition for a fiber-reinforced composite material, comprising an amine type epoxy resin [A], an aromatic amine curing agent [B], and a block copolymer [C] having a reactive group capable of reacting with an epoxy resin; a prepreg obtained by impregnating a reinforced fiber with the epoxy resin composition; and a fiber-reinforced composite material obtained by curing the prepreg. Further provided are: an epoxy resin composition comprising an epoxy resin [A] having two or more of four- or more-membered ring structures, and having either one of a glycidyl amino group directly bonded to the ring structure or a glycidyl ether group directly bonded to the ring structure, epoxy resin [B] having three or more of functional groups, a curing agent [C], and an elastomer component [D]; a prepreg obtained by impregnating a reinforced fiber with the epoxy resin composition; and a fiber-reinforced composite material obtained by curing the prepreg.

Provided is a resin material showing a high thermal conductivity and having high heat resistance while having a low dielectric constant and a low dielectric loss tangent. The material is a polyfunctional vinyl resin, which is represented by the following general formula (1):

##STR00001##

where R.sup.1s each independently represent a hydrocarbon group having 1 to 8 carbon atoms, R.sup.2s each independently represent a hydrogen atom or a dicyclopentenyl group, and at least one thereof represents a dicyclopentenyl group, Xs each independently represent a hydrogen atom or a vinyl group-containing aromatic group represented by the formula (1a), and at least one thereof represents a vinyl group-containing aromatic group, “n” represents a number of repetitions, and the average thereof is a number of from 1 to 5, and Ar represents an aromatic ring.

The present disclosure provides for aqueous, curable binder compositions, as well as articles and products comprising assemblies of matter comprising mineral fibers, synthetic fibers, natural fibers, cellulosic particles and sheet materials comprising the binder compositions disclosed herein.

The present invention relates to a process for the production of a fiber-reinforced composite material with a polyamide matrix.

Textile compositions comprising at least one filamentous fungus are disclosed, as are methods for making and using such textile compositions. Embodiments of the textile compositions generally include at least one of a plasticizer, a polymer, and a crosslinker, in addition to the filamentous fungus. The disclosed textile compositions are particularly useful as analogs or substitutes for conventional textile compositions, including but not limited to leather.

This invention relates to a composition comprising a semisolid epoxy resin containing a curative dispersed therein. The curative has a particle size such that at least 90% of the particles have a size below 25 pm at ambient temperature of 21° C., wherein the composition further comprises a diluent containing a particulate filler. The composition is used as matrix in prepregs. The use of the diluent increases peel strength of the composition when brought into contact with metal or wood substrate.

The present invention related to a thermosetting resin composition for high frequency, the composition containing (a) a polyphenylene ether having two or more unsaturated substituent groups selected from the group consisting of the vinyl group and the allyl group at both ends of the molecular chain thereof, or an oligomer of said polyphenylene ether; (b) three or more different types of cross-linking curing agents; and (c) a flame retardant. The present invention may provide a printed circuit board for high frequency which simultaneously exhibits low dielectric loss characteristic and good moisture-absorption heat resistance, low thermal expansion characteristics, excellent thermal stability, excellent processability, and the like.

Provided are: an epoxy resin composition having exceptional performance with regard to impregnating reinforcing fibers, enabling optimal control of resin flow during molding, and having exceptional in-plane shear strength; a cured epoxy resin product; and a prepreg. An epoxy resin composition comprising at least the following constituent elements [A], [B], and [C]: [A] an epoxy resin, [B] a polyether sulfone having a weight-average molecular weight of 2000-20000 g/mol, [C] a curing agent