A prepreg includes composition elements [A], [B], and [C] described below, [A] a reinforcing fiber, [B] a thermosetting resin, and [C] a thermoplastic resin. [C] is present on a surface of the prepreg, [B] contains a first curing agent [b1] and a second curing agent [b2], and the reinforcing fiber of [A] that crosses over a boundary surface between a resin region containing [B] and a resin region containing [C] and that is in contact with both resin regions is present.

The present disclosure provides a curable resin composition including a thermoset resin, an aliphatic polyketone as a toughener and a hardener. The curable resin composition may be combined with reinforcing fibers and then cured to form a fiber-reinforced composite article having a high glass transition temperature, excellent mechanical properties and low moisture absorption. The fiber-reinforced composite article may be used in various applications, such as in transport applications including aerospace, aeronautical, nautical and land vehicles.

The invention is targeted mainly at a process for the preparation of a semifinished product comprising a PAEK-based resin and reinforcing fibers, comprising the stages of: a. preparation of a dispersion comprising a PAEK-based resin in the pulverulent form dispersed in an aqueous phase comprising a surfactant; b. bringing the reinforcing fibers into contact with said aqueous dispersion; c. drying the fibers impregnated with dispersion; and d. heating the impregnated fibers to a temperature sufficient for the melting of the resin, so as to form a semifinished product,
characterized in that the surfactant is a thermally stable surfactant. It is furthermore targeted at the dispersion of use in said process. Finally, it is targeted at the semifinished products capable of being obtained and also at their use in the manufacture of composite materials.

A resin composition for wiring board material contains a thermosetting resin and a thermally expandable microcapsule, in which the relative dielectric constant (10 GHz) of a cured product of the resin composition is more than 1.0 and 2.2 or less.

A curable epoxy system useful in the production of composites capable of being used in various industries, including, for example, the aerospace industry. In particular, the present disclosure relates to a curable epoxy system comprising (i) an epoxy component selected from bisphenol C diglycidyl ether, one or more derivatives of bisphenol C diglycidyl ether, and combinations thereof, and (ii) 9,9-bis(4-amino-3-chlorophenyl)fluorene.

The present application relates to a fiber reinforced thermoplastic composite sheet and a method for preparing the same. The fiber reinforced thermoplastic composite sheet has on its surface a marble texture effect obtained by laminating cut pieces of a continuous fiber reinforced thermoplastic composite unidirectional tape, wherein the fibers and the resin used in the continuous fiber reinforced thermoplastic composite unidirectional tape have different colors. The thermoplastic composite sheet may be prepared using a simple and quick method, and meet individual requirements of surface appearance of the final product.

An object of the present invention is to provide an epoxy resin composition excellent in elastic modulus and strength, and a prepreg and a fiber reinforced composite material with the epoxy resin composition. The present invention is the epoxy resin composition including the following components [A] to [C] and satisfying the following conditions (1) to (3): [A]: epoxy resin [B]: aromatic diamine [C]: a compound having a boiling point of 130° C. or more and a molecular weight m of 50 or more and 250 or less, the compound having no epoxy group in the molecule and having substantially no curing ability of an epoxy resin

(1): at least a part of the component [C] satisfies that the sum of the polar component and the hydrogen bond component in the Hansen solubility parameters is 10.0 or more.

(2): at least a part of the component [C] satisfies that the Hansen solubility parameter distance L to the component [A] is 20.0 or less.

(3): the ratio H/E between the amount by mole, E, of the epoxy group of the component [A] and the amount by mole, C, of the component [C] satisfying both the condition (1) and the condition (2) is 0.01 or more and 0.20 or less.

(4): the viscosity at 70° C. for 2 hours is 5.0 times or less the initial viscosity at 70° C.

An object of the present invention is to provide an epoxy resin composition that can be preferably used for prepreg and fiber reinforced composite material applications and is excellent in elastic modulus, strength, and pot life.

The present invention is the epoxy resin composition including the following components [A] to [C] and satisfying the following conditions (1) to (3): [A]: epoxy resin [B]: polyamine curing agent, and [C]: a compound having a boiling point of 130° C. or more and a molecular weight m of 50 or more and 250 or less, the compound having no epoxy group in the molecule and having substantially no curing ability of an epoxy resin, and (1): at least a part of the component [C] has two or more alcoholic hydroxyl groups in the molecule. (2): the ratio C/E of the amount by mole, E, for epoxy groups of the component [A] to the amount by mole, C, of the component [C] satisfying the condition (1) is 0.01 or more and 0.20 or less. (3): the viscosity at 70° C. for 2 hours is 5.0 times or less the initial viscosity at 70° C.

A composition for fiber-reinforced resin that provides a fiber-reinforced resin with sufficient mechanical strength. The composition for fiber-reinforced resin contains at least one resin (A) selected from the group consisting of rosin resins, petroleum resins, terpene resins, and hydrides of cyclic ketone-aldehyde resins, and the resin (A) has a softening point of 80° C. to 180° C.

There are provided a thermosetting resin composition for a semiconductor package and a prepreg and a metal clad laminate using the same. More particularly, there are provided a thermosetting resin composition for a semiconductor package capable of improving desmear characteristics by using a cyanate based ester resin and a benzoxazine resin in a thermosetting resin composition based on an epoxy resin and improving chemical resistance by using a slurry type filler to have high heat resistance and reliability, and a prepreg and a metal clad laminate using the same.