Curable polyimides and compositions thereof with very good dielectric properties are provided. Prepregs of these compositions laminated with copper foil to prepare copper clad laminates having Tg>150 C and Df<0.0025 are also provided.

Provided are a prepreg in which reinforcing fibers are impregnated with an epoxy resin composition containing an epoxy resin (A) and an epoxy resin curing agent (B) containing a reaction product (X) of a component (x1) and a component (x2) described below, a fiber-reinforced composite material that is a cured product of the prepreg, a method for producing the prepreg, and a method for producing a high-pressure gas storage tank.

(x1) At least one selected from the group consisting of meta-xylylenediamine and para-xylylenediamine

(x2) At least one selected from the group consisting of unsaturated carboxylic acids represented by General Formula (1) below and derivatives thereof.

##STR00001##

(In Formula (1), R.sup.1 and R.sup.2 each independently represent a hydrogen atom, an alkyl group having from 1 to 8 carbons, an aryl group having from 6 to 12 carbons, or an aralkyl group having from 7 to 13 carbons.)

A resin composition and uses of the same are provided. The resin composition includes the following components: (A) a cross-linking agent of the following formula (I):

##STR00001## (B) a polyphenylene ether resin, wherein the terminal ends of the polyphenylene ether resin are independently modified by a substituent with a carbon-carbon double bond; and (C) a catalyst, wherein, X in formula (I) is a C.sub.1 to C.sub.10 straight or branched alkylene, and the weight ratio of the polyphenylene ether resin (B) to the cross-linking agent (A) ranges from 0.5 to 5.

A resin composition is provided. The resin composition includes the following constituents: (A) an epoxy resin; (B) an amino group-containing hardener; and (C) a compound of formula (I), ##STR00001##
wherein, R.sup.11 to R.sup.16 and A1 to A2 in formula (I) are as defined in the specification, and the amount of the compound (C) of formula (I) is about 10 parts by weight to about 85 parts by weight per 100 parts by weight of the epoxy resin (A).

Resin compositions including at least two different inert fillers that are useful for preparing prepregs and laminates that are used in manufacturing printed circuit boards.

A sheet molding compound according to a first aspect of the present invention comprises: a thickened product of a resin composition comprising a vinyl ester resin, a thickener, a polymerization initiator, a polymerization inhibitor and isobornyl methacrylate; and a reinforcing fiber.

The epoxy resin composition for a prepreg according to an embodiment of the present invention contains (A) an epoxy resin, (B) a curing agent or a curing accelerator, (C) silica microparticles, and (D) core-shell rubber particles, the epoxy resin composition containing from 1 to 5 parts by mass of (C) the silica microparticles and from 2 to 10 parts by mass of (D) the core-shell rubber particles per 100 parts by mass of (A) the epoxy resin, and a mass ratio of (C) the silica microparticles to (D) the core-shell rubber particles, in terms of (C)/(D), being from 1/1 to 1/5.

The present invention provides recyclable copper clad laminates (CCLs) each including copper coil and a recyclable/degradable fiber composition, and printed circuit boards that are made of or include the CCLs of this invention. Also provided are method for recycling these CCLs and printed circuit boards.

An epoxy resin composition suitable for molding a fiber-reinforced plastic molded article is provided. The molded article has exceptional mechanical properties. In particular, a tubular molded article has high breaking strength. The epoxy resin composition contains components (A), (C), and (D), where component (A) is an epoxy resin of a particular formula, component (C) is an epoxy resin other than component (A) that is liquid at 25° C., and component (D) is a curing agent.

Pre-impregnated composite material (prepreg) that can be cured/molded to form aerospace composite parts. The prepreg includes carbon reinforcing fibers and an uncured resin matrix. The resin matrix includes an epoxy component that is a combination of a hydrocarbon epoxy novolac resin and a trifunctional epoxy resin and optionally a tetrafunctional epoxy resin. The resin matrix includes polyethersulfone as a toughening agent and a thermoplastic particle component.