Conventional atomic layer deposition technology is modified to increase its cost-effective viability for use in producing thinly coated flexible packaging film. In one embodiment a thinly coated flexible substrate, e.g., a polyolefin film, is made by a process comprising the steps of: (A) Dissolving a self-limiting precursor in a solvent to form a solution of dissolved self-limiting precursor in the solvent, (B) Applying the solution to a facial surface of a flexible polymer film so that at least a portion of the dissolved self-limiting precursor attaches to the facial surface of the film and the solution is at least partially depleted of self-limiting precursor, and (C) Curing the attached self-limiting precursor by contact with oxygen.

Conventional atomic layer deposition technology is modified to increase its cost-effective viability for use in producing thinly coated flexible packaging film. In one embodiment a thinly coated flexible substrate, e.g., a polyolefin film, is made by a process comprising the steps of: (A) Dissolving a self-limiting precursor in a solvent to form a solution of dissolved self-limiting precursor in the solvent, (B) Applying the solution to a facial surface of a flexible polymer film so that at least a portion of the dissolved self-limiting precursor attaches to the facial surface of the film and the solution is at least partially depleted of self-limiting precursor, and (C) Curing the attached self-limiting precursor by contact with oxygen.

Disclosed are an environment-friendly heat shielding film using a non-radioactive stable isotope and a manufacturing method therefor and, more specifically, an environment-friendly heat shielding film using a non-radioactive stable isotope and a manufacturing method therefor, wherein a heat shielding layer is formed on one surface of a substrate layer; the heat shielding layer is composed of stable isotopes as elements constituting a precursor and contains a non-radioactive stable isotope tungsten bronze compound having an oxygen-deficient .sup.(Y)A.sub.x.sup.(182,183,184,186)W.sub.1O.sub.(3-n) type hexagonal structure, thereby preventing the generation of radioactive materials, fundamentally blocking haze, and improving the visible light transmittance and the infrared light blocking rate; and the heat resistance and durability problems that may occur when the heat shielding layer is formed of the non-radioactive stable isotope tungsten bronze compound are solved by a passivation film.

Disclosed are an environment-friendly heat shielding film using a non-radioactive stable isotope and a manufacturing method therefor and, more specifically, an environment-friendly heat shielding film using a non-radioactive stable isotope and a manufacturing method therefor, wherein a heat shielding layer is formed on one surface of a substrate layer; the heat shielding layer is composed of stable isotopes as elements constituting a precursor and contains a non-radioactive stable isotope tungsten bronze compound having an oxygen-deficient .sup.(Y)A.sub.x.sup.(182,183,184,186)W.sub.1O.sub.(3-n) type hexagonal structure, thereby preventing the generation of radioactive materials, fundamentally blocking haze, and improving the visible light transmittance and the infrared light blocking rate; and the heat resistance and durability problems that may occur when the heat shielding layer is formed of the non-radioactive stable isotope tungsten bronze compound are solved by a passivation film.

A substrate is described having a treated contact surface comprising a carbon or silicon compound comprising from 1 to 30 atomic percent oxygen, from 0.1 to 30 atomic percent nitrogen, or both, each as measured by XPS. The treated contact surface has a biomolecule recovery percentage greater than the biomolecule recovery percentage of the surface before treatment according to the method.

A substrate is described having a treated contact surface comprising a carbon or silicon compound comprising from 1 to 30 atomic percent oxygen, from 0.1 to 30 atomic percent nitrogen, or both, each as measured by XPS. The treated contact surface has a biomolecule recovery percentage greater than the biomolecule recovery percentage of the surface before treatment according to the method.

The present invention relates to a continuous roll-to-roll process for improving the water tolerance of bio-based polymers, in particular cellulose nanofibrils (CNF) films. Furthermore, the invention provides a method, which combines surface modification/functionalization for improving water stability and wet strength, UV/Ozone treatment, corona treatment or plasma activation for purifying and activating the surface and thus increasing the reaction efficiency, and further hydrophobization of the surface of CNF film.

Durable and optically transparent superhydrophobic surfaces have a coating of ceramic nanoparticles attached to a transparent substrate that are bound to the substrate through a flexible linker and a fluorocarbon moiety is bound to the surface of the ceramic nanoparticles. The nanoparticles provide the topography required for superhydrophobic surfaces and the fluorocarbon attached to the surface renders the particles hydrophobic. The nanoparticles can be metal oxide nanoparticles of dimensions that do not scatter light and the flexible linker can be constructed by an agent that has a group for bonding to the substrate and a reactive group to form a bond with a complementary second reactive group attached to a second agent that has a group for bonding to the nanoparticles.

A method for effectively removing minute impurities of 1 μm or less in size that are present on a surface of an aluminum nitride single-crystal substrate without etching the surface includes scrubbing a surface of an aluminum nitride single-crystal substrate using a polymer compound material having lower hardness than an aluminum nitride single crystal, and an alkali aqueous solution having 0.01-1 mass % concentration of potassium hydroxide or sodium hydroxide, the alkali aqueous solution being absorbed in the polymer compound material.

A method for effectively removing minute impurities of 1 μm or less in size that are present on a surface of an aluminum nitride single-crystal substrate without etching the surface includes scrubbing a surface of an aluminum nitride single-crystal substrate using a polymer compound material having lower hardness than an aluminum nitride single crystal, and an alkali aqueous solution having 0.01-1 mass % concentration of potassium hydroxide or sodium hydroxide, the alkali aqueous solution being absorbed in the polymer compound material.