The present invention relates to a method of activating an organic coating to enhance adhesion of the coating to a further coating and/or to other entities comprising applying a solvent and a surface chemistry and/or surface topography modifying agent to the organic coating.

The invention also relates to a coated substrate having an activated coating, wherein the adhesion of the coating to a further coating and/or other entities has been enhanced by application of a solvent and a surface chemistry and/or surface topography modifying agent to the coating.

The invention further relates to an activation treatment for an organic coating to enhance adhesion of the coating to a further coating and/or to other entities comprising a solvent and a surface chemistry and/or surface topography modifying agent and a method for the preparation of the activation treatment.

A substrate subject to degradation at temperatures above 100° C. is coated with a nanostructured ceramic coating having a thickness in excess of 100 nm, formed on a surface of the substrate, wherein a process temperature for deposition of the nanostructured coating does not exceed 90° C. The coating may be photocatalytic, photovoltaic, or piezoelectric. The coating, when moistened and exposed to ultraviolet light or sunlight, advantageously generates free radicals, which may be biocidal, deodorizing, or assist in degradation of surface deposits on the substrate after use. The substrate may be biological or organic, and may have a metallic or conductive intermediate layer.

A substrate subject to degradation at temperatures above 100° C. is coated with a nanostructured ceramic coating having a thickness in excess of 100 nm, formed on a surface of the substrate, wherein a process temperature for deposition of the nanostructured coating does not exceed 90° C. The coating may be photocatalytic, photovoltaic, or piezoelectric. The coating, when moistened and exposed to ultraviolet light or sunlight, advantageously generates free radicals, which may be biocidal, deodorizing, or assist in degradation of surface deposits on the substrate after use. The substrate may be biological or organic, and may have a metallic or conductive intermediate layer.

An object is to provide a surface treatment liquid which can firmly bond, while coating the surface of a treatment target with an extremely thin film, a coating whose hydrophilicity is unlikely to be lowered even when the coating is brought into contact with fats and the like to the surface of the treatment target and a surface treatment method using the surface treatment liquid described above. In a surface treatment liquid containing a resin (A) and a solvent (S), as the resin (A), a resin is used which includes a constituent unit (a1) that includes an organic group including a quaternary ammonium cation group and having a sulfonic acid anion group at a terminal and that is derived from an N-substituted (meth) acrylamide, and includes a reactive silyl group in at least one of molecular chain terminals, the concentration of the resin (A) in the surface treatment liquid is less than 2 mass % and the pH of the surface treatment liquid is 4 or less.

An object is to provide a surface treatment liquid which can firmly bond, while coating the surface of a treatment target with an extremely thin film, a coating whose hydrophilicity is unlikely to be lowered even when the coating is brought into contact with fats and the like to the surface of the treatment target and a surface treatment method using the surface treatment liquid described above. In a surface treatment liquid containing a resin (A) and a solvent (S), as the resin (A), a resin is used which includes a constituent unit (a1) that includes an organic group including a quaternary ammonium cation group and having a sulfonic acid anion group at a terminal and that is derived from an N-substituted (meth) acrylamide, and includes a reactive silyl group in at least one of molecular chain terminals, the concentration of the resin (A) in the surface treatment liquid is less than 2 mass % and the pH of the surface treatment liquid is 4 or less.

The present invention provides a resin plating method using an etching bath containing manganese as an active ingredient, the method being capable of maintaining stable etching performance even during continuous use. The resin plating method includes: an etching step, which uses a resin material-containing article as an object to be treated and etches the article using an acidic etching bath containing manganese; a catalyst application step, which uses palladium as a catalyst metal; and an electroless plating step; and the method further includes a step of maintaining the palladium concentration in the acidic etching bath at 100 mg/L or less.

The present invention provides a resin plating method using an etching bath containing manganese as an active ingredient, the method being capable of maintaining stable etching performance even during continuous use. The resin plating method includes: an etching step, which uses a resin material-containing article as an object to be treated and etches the article using an acidic etching bath containing manganese; a catalyst application step, which uses palladium as a catalyst metal; and an electroless plating step; and the method further includes a step of maintaining the palladium concentration in the acidic etching bath at 100 mg/L or less.

Disclosed is a method of manufacturing a surface-modified polymer film, including forming a hydroxyl group (—OH) on the surface of a polymer film by subjecting the polymer film to light irradiation and surface treatment with a photoacid generator. The polymer film can be introduced with a hydroxyl group (—OH) group using a photoacid generator, thereby modifying the surface of the polymer film without damage to the polymer film. Also, an organic electronic device including the surface-modified polymer film can be improved in electrical characteristics and stability.

Disclosed is a method of manufacturing a surface-modified polymer film, including forming a hydroxyl group (—OH) on the surface of a polymer film by subjecting the polymer film to light irradiation and surface treatment with a photoacid generator. The polymer film can be introduced with a hydroxyl group (—OH) group using a photoacid generator, thereby modifying the surface of the polymer film without damage to the polymer film. Also, an organic electronic device including the surface-modified polymer film can be improved in electrical characteristics and stability.

A polyimide-forming composition includes a particulate polyimide precursor composition having an average particle size of 0.1 to 100 micrometers wherein the polyimide precursor composition comprises a substituted or unsubstituted C.sub.4-40 bisanhydride, and a substituted or unsubstituted divalent C.sub.1-20 diamine; an aqueous carrier; and a surfactant. A method of manufacturing an article including a polyimide includes the steps of forming a preform comprising the polyimide-forming composition; and heating the preform at a temperature and for a period of time effective to imidize the polyimide precursor composition and form the polyimide. An article prepared by the method, and a layer or coating including a polyimide and a surfactant are also described.