C08J9/283

AEROGEL
20200277443 · 2020-09-03 ·

The present invention pertains to an aerogel having a thermal conductivity of 0.03 W/m.Math.K or less and a compressive elasticity modulus of 2 MPa or less at 25 C. under atmospheric pressure.

Aerogel

The present invention pertains to an aerogel having a thermal conductivity of 0.03 W/m.Math.K or less and a compressive elasticity modulus of 2 MPa or less at 25 C. under atmospheric pressure.

POROUS MATERIALS FROM COMPLEX BLOCK COPOLYMER ARCHITECTURES

Self-assembled porous block copolymer materials with a complex block copolymer architecture, methods of preparing, uses for separation and detection, and devices for using as such. The porous materials contain at least one of macro, meso, or micro pores, at least some of which are isoporous, and include at least one block copolymer with at least two chemically distinct blocks, which further comprises a complex architecture such as: multiple distinct monomers in or between blocks, branching, crosslinking, or ring architectures.

MACROPOROUS-STRUCTURED POLYMER AEROGELS

A macroporous-structured polymeric aerogel, and methods for making and using the same, having a polymeric matrix that includes macropores is disclosed.

LIGHT-BLOCKING ARTICLES WITH SPACER FUNCTIONAL COMPOSITION

A foamed, opacifying element useful as a light-blocking article has a substrate; an opacifying layer disposed on the substrate, and a functional composition disposed over the opacifying layer. The functional composition comprises: (i) glass particles such as hollow glass particles. The presence of the glass particles provides additional heat absorption for the foamed, opacifying elements that can be formed into light-blocking materials.

PROCESS FOR FOAMING POLYOLEFIN COMPOSITIONS USING A FLUORORESIN AS A NUCLEATING AGENT

A polyolefin composition is foamed by a process in which a nucleator is used, and the nucleator comprises 80% or more of unagglomerated fluororesin particles and/or agglomerates of fluororesin particles in which both the unagglomerated particles and the agglomerates are less than 1 m in size.

PROCESS FOR PREPARING A POROUS MATERIAL

The present invention is directed to a process for preparing a porous material, at least comprising the steps of providing a gel comprising a solvent (S), wherein the solvent (S) has a volume (V1), pressurizing the gel with carbon dioxide at a temperature and a pressure at which carbon dioxide solubilizes in the solvent (S) forming gas-expanded liquid (EL), wherein the gas-expanded liquid (EL) has a volume (V2) and (V2) is greater than (V1); removing supernatant liquid, and drying the gel. The present invention further is directed to the porous material obtained or obtainable according to the process as such as the use of the porous material according to the invention in particular for medical, biomedical and pharmaceutical applications or for thermal insulation.

Aerogel

The present invention pertains to an aerogel having a thermal conductivity of 0.03 W/m.Math.K or less and a compressive elasticity modulus of 2 MPa or less at 25 C. under atmospheric pressure.

Process for foaming polyolefin compositions using a fluororesin as a nucleating agent

A polyolefin composition is foamed by a process in which a nucleator is used, and the nucleator comprises 80% or more of unagglomerated fluororesin particles and/or agglomerates of fluororesin particles in which both the unagglomerated particles and the agglomerates are less than 1 m in size.

ADSORPTIVE TEMPORARY FIXING SHEET AND METHOD FOR MANUFACTURING SAME

Provided is an adsorption temporary fixing sheet having a sufficient shear adhesive strength in a direction parallel to its surface, and having a weak adhesive strength in a direction vertical to the surface. Also provided is a method of producing such adsorption temporary fixing sheet. The adsorption temporary fixing sheet includes a foam layer including an open-cell structure, wherein, when a silicon chip vertical adhesive strength of a surface of the foam layer after 20 hours at each of such different temperatures as 40 C., 23 C., or 125 C. is represented by V1 (N/1 cm), V2 (N/1 cm), or V3 (N/1 cm) and when a silicon chip shearing adhesive strength of the surface of the foam layer after 20 hours at each of the different temperatures (40 C., 23 C., or 125 C.) is represented by H1 (N/1 cm), H2 (N/1 cm), or H3 (N/1 cm), relationships of V1<H1, V2<H2, and V3<H3 are satisfied.