A physically crosslinked, closed cell continuous multilayer foam structure comprising at least one polypropylene/polyethylene coextruded foam layer is obtained. The multilayer foam structure is obtained by coextruding a multilayer structure comprising at least one foam composition layer, irradiating the coextruded structure with ionizing radiation, and continuously foaming the irradiated structure.

(Co)polymer matrix composites including a porous (co)polymeric network; a nonvolatile diluent, and a multiplicity of thermally-conductive particles distributed within the (co)polymeric network; wherein the thermally-conductive particles are present in a range from 15 to 99 weight percent, based on the total weight of the (co)polymer matrix (including the thermally-conductive particles and the nonvolatile diluent). Optionally, the (co)polymer matrix composite volumetrically expands by at least 10% of its initial volume when exposed to a temperature of at least 135° C. Methods of making and using the (co)polymer matrix composites are also disclosed. The (co)polymer matrix composites are useful, for example, as heat dissipating or heat absorbing articles, as fillers, thermal interface materials, and thermal management materials, for example, in electronic devices, more particularly mobile handheld electronic devices, power supplies, and batteries.

(Co)polymer matrix composites including a porous (co)polymeric network; a nonvolatile diluent, and a multiplicity of thermally-conductive particles distributed within the (co)polymeric network; wherein the thermally-conductive particles are present in a range from 15 to 99 weight percent, based on the total weight of the (co)polymer matrix (including the thermally-conductive particles and the nonvolatile diluent). Optionally, the (co)polymer matrix composite volumetrically expands by at least 10% of its initial volume when exposed to a temperature of at least 135° C. Methods of making and using the (co)polymer matrix composites are also disclosed. The (co)polymer matrix composites are useful, for example, as heat dissipating or heat absorbing articles, as fillers, thermal interface materials, and thermal management materials, for example, in electronic devices, more particularly mobile handheld electronic devices, power supplies, and batteries.

Polymeric based closed cell foams, such as shape memory polymer foams, contain bubbles. Making these bubbles continuous is called reticulation. Disclosed are embodiments of a device and method to controllably reticulate polymer-based closed cell foams by puncturing the membranes of these polymer-based closed cell foams.

Polymeric based closed cell foams, such as shape memory polymer foams, contain bubbles. Making these bubbles continuous is called reticulation. Disclosed are embodiments of a device and method to controllably reticulate polymer-based closed cell foams by puncturing the membranes of these polymer-based closed cell foams.

An embodiment relates to a porous polyurethane polishing pad for use in a chemical mechanical planarization (CMP) process of semiconductors and a process for preparing the same. In the porous polyurethane polishing pad, the polishing performance (or polishing rate) thereof can be controlled by adjusting the size and distribution of pores in the polishing pad.

An embodiment relates to a porous polyurethane polishing pad for use in a chemical mechanical planarization (CMP) process of semiconductors and a process for preparing the same. In the porous polyurethane polishing pad, the polishing performance (or polishing rate) thereof can be controlled by adjusting the size and distribution of pores in the polishing pad.

A porous sound absorbing material having an average cell size of 100 to 600 μm and an apparent density of 40 to 140 kg/m.sup.3. A sound absorption method using this porous sound absorbing material.

A process can be used for producing foam panels, for the production of foam films, composed of a polymer having a glass transition temperature T.sub.g of at least 100° C. An average cell diameter of the foam panels measured according to the standard ASTM D 3576 is between 20 μm and 250 μm, and less than 20 cells having a diameter >260 μm are present per m.sup.2. The elongation at break of the foam is 4%-13% measured according to ASTM D 638.

A process can be used for producing foam panels, for the production of foam films, composed of a polymer having a glass transition temperature T.sub.g of at least 100° C. An average cell diameter of the foam panels measured according to the standard ASTM D 3576 is between 20 μm and 250 μm, and less than 20 cells having a diameter >260 μm are present per m.sup.2. The elongation at break of the foam is 4%-13% measured according to ASTM D 638.