A drum for a roller compactor has an outer shell providing an exterior peripheral compacting surface and an interior for housing an excitation system used to vibrate the drum. The outer shell includes a non-elastic polymer with embedded reinforcing fibers.

Provided is a phenolic resin foam laminate board in which a flexible surface material is arranged on at least upper and lower surfaces of a phenolic resin foam. The phenolic resin foam contains HCFO-1224yd(Z), has a density of not less than 20 kg/m.sup.3 and not more than 55 kg/m.sup.3, a closed cell ratio of 80% or more, an average cell diameter of not less than 60 ?m and not more than 200 ?m, a percentage of an area seeping out from the surface material is 30% or less, and content of HCFO-1224yd(Z) per space volume of 22.4?10.sup.?3 m.sup.3 in the phenolic resin foam is not less than 0.06 mol and not more than 0.35 mol.

The invention relates to cyanate ester resin blends containing resveratrol-based cyanate esters. At room temperature, the cyanate ester resin blend offers improved processability by remaining a liquid or forming a solid that melts at less than 70? C. The cyanate ester resin blend includes a resveratrol-based cyanate ester and a flexible cyanate ester having a configuration different than that of the resveratrol-based cyanate ester, where the resveratrol-based cyanate ester is no more than 80% of the total mass of the cyanate esters in the cyanate ester resin blend. A composite product can include the cyanate ester resin blend and a support material. When making the composite product, the support material is combined with the cyanate resin blend and cured at temperatures ranging from about 100? C. to about 300? C.

A method of forming panels. The method comprises mixing a composition comprising curable resin, microspheres and at least one additive in the presence of a catalyst. The method further comprises transferring the composition to a cuboid shaped mold and allowing the composition to cure in the cuboid shaped mold to form a cuboid shaped body of syntactic foam material. The method further comprises demolding the cuboid shaped body of syntactic foam material and cutting panels from the cuboid shaped body of syntactic foam material. The method further comprises drying the panels.

A resin composition for a semiconductor package according to an embodiment includes a resin composition that is a composite of a resin and a filler disposed in the resin, wherein the filler has a content in a range of 68 wt % to 76 wt % in the resin composition, wherein the filler includes a first filler group composed of fillers having a first diameter; a second filler group composed of fillers having a second diameter smaller than the first diameter; and a third filler group composed of fillers having a third diameter smaller than the second diameter, and contents of each of the first filler group, the second filler group, and the third filler group in the filler are different from each other.

A filler-containing film has a structure in which fillers are held in a binder resin layer. The average particle diameter of the fillers is 1 to 50 m, the total thickness of the resin layer is 0.5 times or more and 2 times or less the average particle diameter of the fillers, and the ratio Lq/Lp of, relative to the minimum inter-filler distance Lp at one end of the filler-containing film in a long-side direction, a minimum inter-filler distance Lq at the other end at least 5 m away from the one end in the film long-side direction is 1.2 or less. The fillers are preferably arranged in a lattice form.

The present invention relates to a method of continuously recycling thermoset plastic waste. The method includes crushing the thermoset plastic waste into pieces with a diameter size suitable for being fed into an extruder. The method also includes purifying the thermoset plastic waste by cleaning the thermoset plastic waste using a cleaning agent to remove contaminants from the thermoset plastic waste. The method also includes extruding the thermoset plastic waste by using supercritical solvent.

A prepreg including: a woven cloth substrate; and a semi-cured product of a resin composition. The resin composition contains: at least one of an (A1) component and an (A2) component, a (B) component; a (C1) component; and a (C2) component. The (A1) component is an epoxy resin having at least one of a naphthalene skeleton and a biphenyl skeleton. The (A2) component is a phenol resin having at least one of a naphthalene skeleton and a biphenyl skeleton. The (B) component is a high molecular weight polymer. The (C1) component is a first filler obtained by treating surfaces of a first inorganic filler with a first silane coupling agent represented by formula (c1). The (C2) component is a second filler obtained by treating surfaces of a second inorganic filler with a second silane coupling agent represented by formula (c2).

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The present invention relates to a method for degradation of a phenolic resin-containing material, characterized in that the phenolic resin-containing material is subjected to an aminolysis with a reagent containing at least one amino group, as well as a method for synthesis and degradation of a phenolic resin-containing material, characterized in that the phenolic resin-containing material is created by curing the starting components at a temperature of less than 140 C. and is subjected to aminolysis with a reagent containing at least one amino group for the purpose of degradation.

In addition the inventors have discovered a method for producing a novolak that can be partially or completely degraded by aminolysis, comprising the steps: (a) reacting a phenolic component with an aldehyde in the presence of (i) an acid, (ii) an amine curing agent and (iii) a triglyceride or a triglyceride mixture, and (b) curing the resin obtained according to (a) at a temperature of 180 C., preferably 140 C.

And finally, the invention relates to a method for reusing a phenolic resin-containing material comprising degradation of the material by aminolysis, wherein a liquid and optional components remaining in the solid state are formed, in the case of components remaining in the solid state, these components are separated from the liquid, the liquid is treated to remove volatile products, preferably under a reduced pressure and/or at an elevated temperature, forming a nonvolatile residue, mixing the nonvolatile residue with the starting materials required for synthesis of a phenolic resin or with one or more compounds selected from monomers, oligomers or polymers having at least two functional groups which react with amino groups and/or hydroxyl groups.

The present teachings contemplate a method comprising providing a first and second substrate, locating an initiator onto a surface of the first or second substrate, the initiator including a substance for initiating polymerization of a polymerizable adhesive, locating the polymerizable adhesive onto a surface of the first and second substrate, the adhesive including a monofunctional, difunctional, or multifunctional methylene malonate, or cyanoacrylate, and contacting first and second substrate.