This invention relates to a polyamide-imide precursor, a polyamide-imide obtained by imidizing the same, a polyamide-imide film, and an image display device including the film. The polyamide-imide precursor includes, in a molecular structure thereof, a first block, obtained by copolymerizing monomers including dianhydride and diamine, and a second block, obtained by copolymerizing monomers including an aromatic dicarbonyl compound and aromatic diamine. The dianhydride includes biphenyltetracarboxylic acid dianhydride (BPDA) and 2-bis(3,4-dicarboxyphenyl)hexafluoropropane dianhydride (6FDA), and the diamine includes bistrifluoromethylbenzidine (TFDB).

The present invention relates to a polyamide-imide precursor, a polyamide-imide obtained by imidizing the same, a polyamide-imide film, and an image display device including the film. The polyamide-imide precursor includes, in a molecular structure thereof, a first block, obtained by copolymerizing monomers including dianhydride and diamine, a second block, obtained by copolymerizing monomers including an aromatic dicarbonyl compound and the diamine, and a third block, obtained by copolymerizing monomers including the aromatic dicarbonyl compound and aromatic diamine. The dianhydride for forming the first block includes 2-bis(3,4-dicarboxyphenyl)hexafluoropropane dianhydride (6FDA), and the diamine for forming the first block and the second block includes 9,9-bis(3-fluoro-4-aminophenyl)fluorene (FFDA).

Dinadic phenyl amine reactive endcap monomers for application in high-temperature polymeric composites are described. The amine group of the endcap is directly reacted with a desired chemical backbone to provide the preferred rigidity and chemical resistance. The ability of the amine group to react with a wide variety of chemical backbones allows the tailoring of formulations for various application temperatures, mechanical properties, processes and resistances while retaining the high degree of crosslinking that yields excellent temperature stability, ease of processing and the necessary toughness. Polyimide oligomers comprising the reaction product of at least one dinadic phenyl amine endcap monomer and a chemical backbone, preferably with a molecular weight not exceeding about 1000-3000, suitable for high temperature composites are described. The dinadic phenyl amine endcaps may be reacted with an acid anhydride capped precursor to form polyimide resins suitable for high-temperature composites.

The present invention relates to a molding made of expanded bead foam, wherein at least one fiber (F) is partly within the molding, i.e. is surrounded by the expanded bead foam. The two ends of the respective fibers (F) that are not surrounded by the expanded bead foam thus each project from one side of the corresponding molding. The present invention further provides a panel comprising at least one such molding and at least one further layer (S1). The present invention further provides processes for producing the moldings of the invention from expanded bead foam or the panels of the invention and for the use thereof, for example as rotor blade in wind turbines.

Provided are a varnish for porous polyimide film production, providing an unburned composite film that is less likely to have a sea-island structure, and a method for producing a porous polyimide film using the same. The varnish according to the present invention comprises a resin including polyamide acid and/or polyimide, fine particles, and a solvent, and has a fine particle content of not less than 65% by volume relative to the total of the resin and the fine particles and a viscosity at 25° C. of not less than 550 mPa.Math.s. Preferably, the varnish further comprises a dispersant. The method for producing a porous polyimide film according to the present invention comprises: forming an unburned composite film using the varnish; burning the unburned composite film to obtain a polyimide-fine particle composite film; and removing the fine particles from the polyimide-fine particle composite film.

An addition reaction type polyimide resin molded body having a thickness of 5 mm or more, with a number of defects having a size of 0.5 mm or more present on the entire surface of the molded body being 1 per 100 cm.sup.2 or less. The addition reaction type polyimide resin molded body is formed by: holding a prepolymer of an addition reaction type polyimide resin at a temperature equal to or higher than a viscosity increase starting temperature of the addition reaction type polyimide resin and increasing a melt viscosity at a temperature lower by 10° C. than the viscosity increase starting temperature to 70 to 900 kPa.Math.s; grinding and mixing the addition reaction type polyimide resin to form a molding precursor; and shaping the molding precursor at a temperature equal to or higher than a heat-curing temperature of the addition reaction type polyimide resin.

The invention provides a composition for forming a coating film containing a phosphoric acid group-containing polymer capable of forming a film on a substrate by a simple process and capable of maintaining film properties under a solvent environment containing water, and a coating film which is a cured product of the composition. In particular, the composition for forming a coating film contains (a) a polymer (P) containing a hydroxyl group, and the hydroxyl group is derived only from a phosphoric acid group, (b) a polycarbodiimide (C) containing a structure represented by the following formula (c-1):

—N═C═N—  (c-1),

and (c) a solvent.

The present disclosure generally relates to systems and methods for composites, including short-fiber films and other composites. In certain aspects, composites comprising a plurality of aligned fibers are provided. The fibers may be substantially aligned, and may be present at relatively high densities within the composite. For example, the composite may include substantially aligned carbon fibers embedded within a thermoplastic substrate. The composites may be prepared, in some aspects, by dispersing fibers by neutralizing the electrostatic interactions between the fibers, for example using aqueous liquids containing the fibers that are able to neutralize the electrostatic interactions that typically occur between the fibers. The liquids may be applied to a substrate, and the fibers may be aligned using techniques such as shear flow and/or magnetism. Other aspects are generally directed to methods of using such composites, kits including such composites, or the like.

The present disclosure relates to composites, systems, and methods for making the same. In particular, the present disclosure relates to composites that are useful for thermal protection applications, and systems and methods for making the same.

A polyamic acid solution includes a dianhydride and a diamine. The dianhydride includes pyromellitic dianhydride, the diamine includes a benzimidazole, the molar ratio of dianhydride monomer to diamine monomer is in a range of from 0.85:1 to 0.99:1, and the polyamic acid solution has a solids content in a range of from 10 to 25 weight percent and a viscosity in a range of from 300 to 3000 poise.