Patent classifications
C08J2423/16
Thermoplastic vulcanizates for foaming applications
The present disclosure relates to TPV compositions suitable for foaming, as well as foamed TPV compositions, methods of making the foregoing, and applications of various foamed TPV compositions. The TPV compositions comprise an at least partially vulcanized rubber component dispersed within a thermoplastic component comprising a thermoplastic resin and a propylene-based elastomer, oil, and optionally one or more additives. According to some aspects, the TPV composition may be made in part by preloading some portion of process oil prior to addition of the curative. TPV compositions provided herein are particularly suitable for foaming with thermo-expandable microsphere foaming agents.
POLYOLEFIN RESIN COMPOSITION AND PRODUCTION METHOD THEREOF
The present invention relates to a polyolefin resin composition containing at least: (A) 100 parts by mass of a polyolefin resin, (B) 0.01 to 5 parts by mass of a compound having at least one (meth)acrylate group, and one hydrogen bonding group or one (meth)acrylate group, and (C) 0.01 to 5 parts by mass of an organic peroxide.
Process for producing laminate, and laminate
To provide a laminate excellent in alkali resistance and interlaminar strength at high temperature, and a process for producing the laminate. A process for producing a laminate, comprising producing a non-crosslinked laminate having a layer of a first composition containing a copolymer having fluorine atoms and a layer of a second composition containing a non-fluorinated elastic polymer, and crosslinking the first composition and the second composition to produce a laminate having a first layer formed of a crosslinked product of the first composition and a second layer formed of a crosslinked product of the second composition, wherein when the first composition and the second composition contains a common crosslinking aid, the absolute value of the crosslinking rate difference between the first composition and the second composition is at most 0.30.
Composite, high-frequency circuit substrate prepared therefrom and process for preparing the same
The present invention relates to a composite, a high-frequency circuit substrate prepared therefrom and a process for preparing the same. Such composite includes (1) from 20 to 70 parts by weight of a thermosetting mixture, including (A) a thermosetting resin based on polybutadiene or a copolymer resin of polybutadiene and styrene having a molecular weight of 11,000 or less, being composed of carbon and hydrogen elements and containing 60% or more of vinyl groups, and (B) an ethylene-propylene rubber having a weight-average molecular weight of greater than 100,000 and less than 150,000 and a number-average molecular weight of greater than 60,000 and less than 100,000 and being in a solid state at room temperature; (2) from 10 to 60 parts by weight of a glass fiber cloth; (3) from 0 to 70 parts by weight of a powder filler; and (4) from 1 to 3 parts by weight of a curing initiator. The composite of the present invention has good solvent solubility and good process operability. The high-frequency circuit substrate made by using the composite has good high frequency dielectric properties and better thermal oxidative aging performance.
RESIN COMPOSITIONS
A resin composition, a shaped article, a fiber, a film and a sheet. The resin composition includes two or more kinds of polyolefin resins (A), and 0.05 to 10 mass % of an α-olefin (co)polymer (B) satisfying requirements (b-1) to (b-3): (b-1) A methyl group index is 40 to 60%. The methyl group index is a ratio of an integral of a peak observed in a range of 0.50 to 1.15 ppm to an integral of peaks observed in a range of 0.50 to 2.20 ppm in a .sup.1H-NMR spectrum of a solution of the (co)polymer (B) in deuterated chloroform, positions of the peaks being calculated relative to a solvent peak at 7.24 ppm assigned to CHCl.sub.3 in deuterated chloroform as a reference. (b-2) A weight average molecular weight determined by GPC is 1,500 to 20,000. (b-3) No melting point is observed from −100 to 150° C. in DSC.
ANTIDEGRADANT COMPOSITION, ANTIDEGRADANT MASTER BATCH AND RUBBER COMPOSITION
An antidegradant composition, an antidegradant master batch comprising the antidegradant composition and a rubber composition comprising the antidegradant composition or the antidegradant master batch. The antidegradant composition comprises antidegradant TMPPD and one or two selected from antidegradant N3100-B and an antidegradant N3100-C. The antidegradant composition and antidegradant master batch render a rubber compound and a rubber article excellent discoloration resistance, fatigue resistance, ozone resistance, and mechanical properties before and after thermal oxidative aging and enables the rubber compound to be used in the manufacture of all or part of the rubber matrix, especially as a tire sidewall rubber composition and a tire tread rubber composition.
MASTERBATCH FOR FOAM MOLDING AND APPLICATION THEREOF
A masterbatch for foam molding which contains a base resin and heat-expandable microspheres. The base resin contains EPDM and the masterbatch contains the heat-expandable microspheres in an amount ranging from higher than 300 parts by weight to 750 parts by weight to 100 parts by weight of the base resin and has a Moony viscosity ML 1+4 (100° C.) ranging from 15 to 90. Also disclosed is a method for producing a masterbatch for foam molding, a resin composition containing the masterbatch for foam molding, and a foam-molded product manufactured by molding the resin composition.
THERMOSETTING COMPOSITION, RESIN SHEET, METAL FOIL WITH RESIN, METAL-CLAD LAMINATE, AND PRINTED WIRING BOARD
A resin sheet includes a dried product or semi-cured product of a thermosetting composition, the thermosetting composition including an ethylene-propylene-diene copolymer as Component (A), and an inorganic filler that is surface-treated with a surface treatment agent having a polymerizable unsaturated bond as Component (B).
TUBE, AND POLYAMIDE RESIN COMPOSITION
Disclosed are: a tube containing a layer that contains 60 to 80% by mass of a semi-aromatic polyamide and 15 to 40% by mass of an elastomer modified with an unsaturated compound having at least one selected from a carboxy group and an acid anhydride group, wherein the layer has a phase-separated structure containing a phase (A) that contains the semi-aromatic polyamide, and a phase (B) that contains the elastomer, and the phase (A) is a continuous phase and the phase (B) is a disperse phase dispersed in the phase (A), and in a cross-sectional image of the layer as observed with an electron microscope, the average number of the phase (B) having a major axis diameter of 2 μm or more and existing per 100 square μm is 1/100 μm.sup.2 or less; and a polyamide resin composition prepared by melt-kneading a semi-aromatic polyamide and an elastomer modified with an unsaturated compound having at least one selected from a carboxy group and an acid anhydride group, wherein the total concentration of the carboxy group and the acid anhydride group in 1 g of the elastomer is 85 to 250 μeq/g.
Polyolefin-based resin film
A polyolefin-based resin film containing (a) 90 to 97 parts by weight of at least one polyolefin-based resin selected from a propylene-ethylene block copolymer and a propylene-α olefin random copolymer and (b) 3 to 10 parts by weight of an ethylene-propylene copolymer elastomer, wherein the propylene-α olefin random copolymer is present in an amount of 0 to 50% by weight relative to the total amount of the propylene-ethylene block copolymer and the propylene-α olefin random copolymer, and the polyolefin-based resin film has a thermal shrinkage ratio in a longitudinal direction of 3% or more and 20% or less, a thermal shrinkage ratio in a rectangular direction to a width direction of 1% or less, and a yield stress in the longitudinal direction of 150 MPa or more and 250 MPa or less.