Patent classifications
C
CHEMISTRY; METALLURGY
Load children
C08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
Load children
C08J
WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
Load children
2423/00
Characterised by the use of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Derivatives of such polymers
Load children Filter patents View analytics View as hierarchy Open in page
C08J2423/02
not modified by chemical after treatment
Load children Filter patents View analytics View as hierarchy Open in page
C08J2423/18
Homopolymers or copolymers of hydrocarbons having four or more carbon atoms
Load children Filter patents View analytics View as hierarchy Open in page

C08J2423/18

POLYAMIDE-BASED RESIN FOAM PARTICLE AND POLYAMIDE-BASED RESIN FOAM PARTICLE MOLDED ARTICLE
20260055249 · 2026-02-26 ·

A polyamide-based resin expanded bead comprising a polyamide-based resin as a base resin, wherein the expanded bead comprises a carbon nanotube, and the expanded bead has a closed cell ratio of 70% or more.