To provide hollow particles excellent in pressure resistance. Hollow particles which comprise a shell containing a resin and a hollow portion surrounded by the shell, wherein a void ratio is 50% or more, and wherein a residual void ratio measured by a specific press test method is 30% or more.

Interpenetrated polyolefin network for use in recovering or containing hydrocarbons such as hydrocarbons contained in oil, are disclosed. Advantageously, the interpenetrated polyolefin networks absorb the hydrocarbon, including viscous hydrocarbons and crude oils, to form a gel that can be collected and processed by heat to release the collected hydrocarbons.

A resin composition and an article made therefrom are provided. The resin composition includes: (A) 100 parts by weight of a copolymer, the copolymer having a structural unit formed by a monomer of Formula (1) and a structural unit formed by a monomer of Formula (2), and the content of the structural unit formed by the monomer of Formula (2) in the copolymer is 55 wt % to 90 wt %; and (B) 1 part by weight to 15 parts by weight of a compound of Formula (3). The resin composition may be used to make various articles, such as a prepreg, a resin film, a laminate or a printed circuit board, and at least one of the following improvements can be achieved, including glass transition temperature, storage modulus decay rate, reflow warpage magnitude, percent of thermal expansion in Z-axis, dissipation factor and laminate appearance.

##STR00001##

Provided are a resin composition, a cured product, a prepreg, a metal foil-clad laminate, a resin composite sheet, a printed wiring board, and a semiconductor device. The resin composition contains 10 to 300 parts by mass of a polyphenylene ether compound (B) having an unsaturated carbon-carbon double bond at a terminal, and 10 to 300 parts by mass of a polymer having a structural unit represented by Formula (V), relative to 100 parts by mass of a resin (A) having a terminal group represented by Formula (T1) and having an indane skeleton.

##STR00001##

The present invention provides a resin composition containing (A) one or more selected from the group consisting of a maleimide resin having one or more N-substituted maleimide groups and a derivative of the maleimide resin, and (B) a compound having a vinyl benzyl group, in which the component (B) contains one or more selected from the group consisting of (B1) a compound having 3 or more vinyl benzyl groups bonded to an oxygen atom and (B2) a compound having one or more vinyl benzyl groups bonded to a carbon atom, and a prepreg, a laminate, a resin film, a printed wiring board, and a semiconductor package in which the resin composition is used.