A filler-containing film has a structure in which fillers are held in a binder resin layer. The average particle diameter of the fillers is 1 to 50 μm, the total thickness of the resin layer is 0.5 times or more and 2 times or less the average particle diameter of the fillers, and the ratio Lq/Lp of, relative to the minimum inter-filler distance Lp at one end of the filler-containing film in a long-side direction, a minimum inter-filler distance Lq at the other end at least 5 m away from the one end in the film long-side direction is 1.2 or less. The fillers are preferably arranged in a lattice form.

A resin composition contains a thermosetting resin (A) and an inorganic filler (B). The inorganic filler (B) includes: a first filler (B1); and a second filler (B2) of a nanometer scale having a smaller particle size than the first filler (B1). The first filler (B1) includes an anhydrous magnesium carbonate filler (b1) and an alumina filler (b2). The proportion of the first filler (B1) relative to a total solid content in the resin composition is equal to or greater than 50% by volume and equal to or less than 90% by volume. The proportion of the second filler (B2) relative to the total solid content in the resin composition is equal to or greater than 0.1% by volume and equal to or less than 2.0% by volume.

The present invention relates to an improved process for preparing an aqueous dispersion of lignin and the use of said suspension in the preparation of a resin.

A circuit build-up film for wafer-level packaging (WLP) includes 40 to 60 parts by mass of a first epoxy resin, 15 to 30 parts by mass of a second epoxy resin, 25 to 50 parts by mass of a curing agent, 0.1 to 5 parts by mass of a curing accelerator, 5 to 20 parts by mass of an additive, 320 to 650 parts by mass of an inorganic filler, and 0.01 to 5 parts by mass of a silane coupling agent (SCA), where the additive is obtained by subjecting an epoxy resin to a reaction with a polyhydroxyl-terminated dendritic crosslinking agent. The build-up film shows prominent fluidity during heating and curing, and can completely fill gaps among wafers. A packaging process using the build-up film is simple. Regardless of the number of wafers, packaging can be completed through one procedure with the build-up film.

A filler-containing film has a structure in which fillers are held in a binder resin layer. The average particle diameter of the fillers is 1 to 50 μm, the total thickness of the resin layer is 0.5 times or more and 2 times or less the average particle diameter of the fillers, and the ratio Lq/Lp of, relative to the minimum inter-filler distance Lp at one end of the filler-containing film in a long-side direction, a minimum inter-filler distance Lq at the other end at least 5 m away from the one end in the film long-side direction is 1.2 or less. The fillers are preferably arranged in a lattice form.

An article (100) has a polyester film backing (110) and a primer layer (120) including a carboxylated styrene butadiene copolymer crosslinked with a polyfunctional aziridine disposed on a major surface of the polyester film backing (110). Another article includes a polyester backing (110), a primer layer (120) including a carboxylated styrene butadiene copolymer crosslinked with a polyfunctional aziridine disposed on a major surface of the polyester backing (110), and a phenolic layer (140) disposed on the primer layer (120) on a surface opposite the polyester backing (110). The phenolic layer (120) can include abrasive particles (160). Processes for making the articles are also described, as well as methods for abrading a workpiece and improving adhesion between a polyester film backing (110) and a phenolic layer (120) on the polyester backing (110).

[Problem] The purpose of the invention is to provide: a thermoplastic elastomer composition capable of providing molded articles that are lightweight, have better oil resistance than those provided by conventional cross-linked thermoplastic elastomers, and have hardness and mechanical properties such as tensile strength and tensile elongation that are equal to or superior to those provided by conventional cross-linked thermoplastic elastomers; and an ethylene/α-olefin/unconjugated polyene copolymer having little compression set at low temperature as well as flexibility and an excellent balance of rubber elasticity at low temperature and tensile strength at normal temperature. [Solution] Produced are: a thermoplastic elastomer composition obtained by dynamically crosslinking a mixture containing a crystalline olefin polymer (A), an ethylene/α-olefin (having 4-20 carbon atoms)/unconjugated polyene copolymer (1B) that satisfies specific requirements, and a phenol resin-based crosslinking agent (C); and an ethylene-α-olefin/unconjugated polyene copolymer (2B) that satisfies specific requirements.

Disclosed herein are processes for preparing a resin-extended rubber by mixing at least one thermoplastic resin with a resin-rubber-solvent cement comprising at least one conjugated diene monomer-containing rubber and the resin-extended rubber resulting from such processes. Also disclosed is a resin-extended rubber-solvent-cement comprising at least one conjugated diene monomer-containing rubber, at least one non-polar solvent, and at least one thermoplastic resin as well as a rubber composition comprising a resin-extended rubber.

To provide a thermosetting resin composition that has low elasticity, high heat resistance, high elongation under an ordinary temperature environment and a high temperature environment, high electric insulation reliability, and high adhesion strength to a metal foil, and is capable of providing a prepreg that is excellent in crack resistance; a prepreg including the thermosetting resin composition; a metal foil with a resin including the thermosetting resin composition and a metal foil laminated on each other; a laminate including the prepreg or the metal foil with a resin; a printed wiring board including the laminate; and a semiconductor package including the printed wiring board. Specifically, the thermosetting resin composition contains (A) a phenol-based resin, and the component (A) contains (A-1) a phenol-based resin having an aliphatic hydrocarbon group having 10 to 25 carbon atoms.

The present disclosure provides composites comprising an open cell foam and a small pore area material, methods for their preparation, articles of manufacture comprising them and methods for preparing the same.