The present invention relates to a flame retardant particle having excellent flame retardancy or moisture resistance, a manufacturing method therefor, and a flame retardant Styrofoam using the same.

Disclosed herein are lignin-furfuryl alcohol compositions, lignin-furfuryl alcohol-resole (LFR) compositions comprising lignin-furfuryl alcohol composition and phenolic resoles and LFR foams derived from such LFR compositions. Disclosed herein are LFR foams comprising a polymeric phase defining a plurality of open cells and a plurality of closed cells, and a gas phase comprising one or more blowing agents disposed in at least a portion of the plurality of closed cells, wherein the polymeric phase is derived from LFR compositions.

A resin composition and the use thereof. The resin composition comprises the following components, in percentages by weight: 40-70% of a crosslinkable and curable resin and 30-60% of a filler. The filler is silicon dioxide prepared by means of an organosilicone hydrolysis method; the average particle size D50 of the silicon dioxide is 0.1-3 ?m; and the particle size ratio D100:D10 of the silicon dioxide is less than or equal to 2.5. By means of the composition, a prepared adhesive film and resin-coated copper foil have a higher elongation rate, a higher peel strength, low CTE, low D.sub.f, better drilling processability and higher electrical strength. A finer line processing capability can be achieved, which can be applied to a printed circuit board material of a multilayer laminate, in particular a printed circuit board material of a multilayer laminate of thin lines.

A stator compound including an acrylonitrile butadiene isoprene rubber (NBIR) terpolymer elastomeric base.

The technology discloses a halogen-free resin composition and a prepreg and a laminate used for a printed circuit. The resin composition comprises: alkyl phenol epoxy resin; benzoxazine resin, alkyl phenol novolac curing agent, and phosphorus-containing flame retardant. The alkyl phenol epoxy resin has many alkyl branched chains in its molecular structure, making the composition have excellent dielectric properties, a higher glass transition temperature, low water absorption, and good heat resistance. Mixing benzoxazine resin into the composition can further reduce dielectric constant, dielectric loss value and water absorption of the cured product. With an alkyl phenol novolac curing agent, the molecular structure will have many alkyls, excellent dielectric properties and low water absorption. A prepreg and a laminate used for printed circuit prepared using the resin composition have low dielectric constants, dielectric loss factors, and water absorption, high dimensional stability, high thermal resistance and good flame retardancy, processability and chemical resistance.

[Problem] The purpose of the invention is to provide: a thermoplastic elastomer composition capable of providing molded articles that are lightweight, have better oil resistance than those provided by conventional cross-linked thermoplastic elastomers, and have hardness and mechanical properties such as tensile strength and tensile elongation that are equal to or superior to those provided by conventional cross-linked thermoplastic elastomers; and an ethylene/-olefin/unconjugated polyene copolymer having little compression set at low temperature as well as flexibility and an excellent balance of rubber elasticity at low temperature and tensile strength at normal temperature.

[Solution] Produced are: a thermoplastic elastomer composition obtained by dynamically crosslinking a mixture containing a crystalline olefin polymer (A), an ethylene/-olefin (having 4-20 carbon atoms)/unconjugated polyene copolymer (1B) that satisfies specific requirements, and a phenol resin-based crosslinking agent (C); and an ethylene--olefin/unconjugated polyene copolymer (2B) that satisfies specific requirements.

The present disclosure provides an organic sulfur acid-free composition containing a benzoxazine, phenolic compound and nitrogen-containing heterocyclic compound. The organic sulfur acid-free composition, upon curing at temperatures as low as 130-140 C., renders void free cured articles having well balanced thermal, chemical and mechanical properties. The organic sulfur acid-free composition may be used in a variety of applications, such as in coatings, structural and non-structural composites and encapsulating systems for electronic and electrical components.

A method for manufacturing thermoplastic vulcanizates includes the steps of: subjecting rubber granules, thermoplastic pellets, a filler powder, a cross-linking auxiliary agent powder, a vulcanization accelerator powder, a vulcanizing agent powder, and an auxiliary agent powder to evenly mixing so as to obtain a first mixture; introducing the first mixture into an extruder; introducing, in whole or divided into two portions, a processing oil into the extruder to be evenly mixed with the first mixture so as to obtain a second mixture, the processing oil being present in an amount ranging from 130 parts by weight to 200 parts by weight based on 100 parts by weight of the rubber granules; and subjecting the second mixture to dynamic vulcanization in the extruder so as to obtain the thermoplastic vulcanizates.

A stator compound including an acrylonitrile butadiene isoprene rubber (NBIR) terpolymer elastomeric base.

A stator compound including an acrylonitrile butadiene isoprene rubber (NBIR) terpolymer elastomeric base.