This invention relates to certain microporous articles comprising certain PEDEK-PEEK copolymers, to a method for making said microporous articles, in particular to a method of making microporous articles from a blend comprising said PEDEK-PEEK copolymer and at least one additional polymer, comprising processing said blend into a film and treating the film with a solvent for obtaining the microporous article.

A component comprising a first part and a second part, wherein a third part is positioned between the first and second parts, wherein: (iv) said first part comprises a polymeric material (A) which comprises a repeat unit of formula (XI) ##STR00001## wherein t1, and w1 independently represent 0 or 1 and v1 represents 0, 1 or 2; (v) said second part comprises a polymeric material (B) which comprises a repeat unit of formula (XI) ##STR00002## wherein t1, and w1 independently represent 0 or 1 and v1 represents 0, 1 or 2; and (vi) said third part comprises a polymeric material (C) which comprises a polymer having a repeat unit of formula
O-Ph-O-Ph-CO-Ph-I and a repeat unit of formula
O-Ph-Ph-O-Ph-CO-Ph-II wherein Ph represents a phenylene moiety.

In the case of producing a fiber-reinforced composite material having excellent impact resistance by using an automatic lay up device, to provide a prepreg that can be layed up without adhesion and deposition of a part of the reinforced fibers or matrix resin in the device.

A prepreg containing the following components [A] to [E], wherein 85% by mass or more of the component [E] is present in a range within 9% of the average thickness of the prepreg from each surface of the prepreg, a range within 7% of the average thickness of the prepreg from each surface of the prepreg is composed of a first resin composition containing the components [B] to [E], and the prepreg satisfies the following conditions (I) to (V): [A] a carbon fiber, [B] an epoxy resin having two or more glycidyl groups in one molecule, [C] an aromatic amine compound, [D] a thermoplastic resin having a polyarylether skeleton, [E] a particle wherein primary particles have a number average particle size of 5 to 50 m, the content ratio (% by mass) of a thermoplastic resin and a thermosetting resin of 95:5 to 70:30, and a size of a crack generated when the particle is immersed in methyl ethyl ketone and boiled and refluxed for 24 hours is 20 m or less and the number of the crack is 5 or less; Condition (I): the component [B] contains 80% by mass or more of an epoxy resin having a viscosity at 25 C. of 2.010.sup.4 mPa.Math.s or more, Condition (II): a molar ratio of the number of active hydrogens in the component [C] to the number of epoxy groups in the component [B] is 0.7 to 1.3, Condition (III): the prepreg contains 15 to 25% by mass of the component [D] with respect to 100% by mass of the component [B], Condition (IV): the prepreg contains 50 to 80% by mass of the component [E] with respect to 100% by mass of the component [B], Condition (V): a minimum value of loss tangent tan of the first resin composition in the temperature range of 12 to 25 C. is 1.0 or less.

The invention relates to an extrusion process for the production of expandable vinyl aromatic polymer granulate comprising mixing first and second additives with first and second polymer components, respectively, in dedicated mixers.

A problem to be solved by the present invention is to provide a prepreg and an integrally molded article, wherein the prepreg exhibits suitable flexibility and adhesiveness, excels in formability on a complicated mold face and adhesion to a mold face, causes no positional shift, and can be efficiently reinforced and stiffened at an intended position. A main object of the present invention is to provide a prepreg including (A) reinforcing fibers, (B) a thermosetting resin, and (C) a thermoplastic resin, wherein the (C) thermoplastic resin exists in at least a part of a face of the prepreg, and wherein the prepreg satisfies the condition [I], and satisfies the condition [II] or the condition [III]: [I]: the (B) thermosetting resin has a peak in the temperature range of more than 100 C. and 180 C. or less on a loss tangent (tan ) curve measured under isokinetic heating by dynamic mechanical analysis (DMA); [II]: on a loss angle curve obtained by measuring the prepreg isothermally by dynamic mechanical analysis (DMA), the loss angle curve has a point representing the maximum value, and has a point which represents a loss angle value 5 or more smaller than the maximum value, and which is on the earlier time side of the point representing the maximum value; and [III]: even if, on the loss angle curve obtained by measuring the prepreg isothermally by dynamic mechanical analysis (DMA), the loss angle curve has a point representing the maximum value, the loss angle curve does not have a point which represents a loss angle value 5 or more smaller than the maximum value, and which is on the earlier time side of the point representing the maximum value, or the loss angle curve does not have a point representing the maximum value, and has a descendingly behaving section in which the loss angle value becomes 5 or more smaller at a slope of 1.4/minute or more.

A curable epoxy composition includes an epoxy resin, a hydroxyl-terminated polyphenylene ether, and an oligomeric aromatic organophosphate ester flame retardant, wherein at least 60% of the oligomeric aromatic organophosphate ester flame retardant includes at least two hydroxy terminal groups, and the amount of each component of the composition is specified herein. The composition can be particularly useful in circuit material prepregs, thermoset epoxy compositions, and various articles. A method for the manufacture of a thermoset composition is also described.

A composition is composed mainly of: a component (I) (which is at least one selected from polyether ketone, polyether ether ketone, and polyether ketone ketone); a component (II) (which is polyphenylene sulfide); and, additionally if necessary, a component (III) (which is at least one selected from polyether imide, polyimide, polyamide imide, and polysulfone resins) and (IV) an inorganic filler. The composition is obtained using a conventional melt-kneading machine, for example, a single screw or twin screw extruder, Banbury mixer, or kneader in accordance with the melt-kneading method corresponding to the kneading machine. The resin composition for metal bonding has excellent metal bonding properties, and is applicable for use in automobile parts that require the composition to be bonded with metal and in electronic products such as laptop computers and mobile phones.

The invention relates to an extrusion process for the production of expandable vinyl aromatic polymer granulate comprising mixing first and second additives with first and second polymer components, respectively, in dedicated mixers.

A press-molded product includes: carbon fibers having a weight average fiber length of 1 mm or more; a polyamide-based resin (X); and a polyarylene ether-based resin (Y). The carbon fibers include carbon fiber bundles. The polyamide-based resin (X) and the polyarylene ether-based resin (Y) form a sea-island structure inside and outside the carbon fiber bundles. In the sea-island structure, one of the polyamide-based resin (X) and the polyarylene ether-based resin (Y) forms a sea phase and the other forms an island phase having a particle diameter Dr of 0.05 m or more and less than 50 m.

A thermosetting resin composition and a prepreg and a laminated board prepared therefrom. The thermosetting resin composition contains the following components in parts by weight: 50-150 parts of a cyanate; 30-100 parts of an epoxy resin; 5-70 parts of styrene-maleic anhydride; 20-100 parts of a polyphenyl ether; 30-100 parts of a halogen-free flame retardant; 0.05-5 parts of a curing accelerator; and 50-200 parts of a filler. The prepreg and laminated board prepared from the thermosetting resin composition have comprehensive performances such as a low dielectric constant, a low dielectric loss, an excellent flame retardance, heat resistance and moisture resistance, etc., and are suitable for use in a halogen-free high-frequency multilayer circuit board.