Provided are a slurry composition having a low thixotropy and a superior handling property; a cured product of this slurry composition; and a substrate, film and prepreg using such cured product, the substrate, film and prepreg exhibiting excellent mechanical properties and a low relative permittivity and dielectric tangent. The slurry composition has a thixotropic ratio of not higher than 3.0, and comprises: (A) a cyclic imide compound having, per molecule, at least one dimer acid backbone, at least one linear alkylene group having not less than 6 carbon atoms, and at least two cyclic imide groups; (B) spherical silica fine particles and/or alumina fine particles having an average particle size of 0.05 to 20 μm when measured by a laser diffraction method; (C) a silane coupling agent capable of reacting with the components (A) and (B); and (D) an organic solvent.

The present application provides a film containing: a compound (A) containing at least one selected from the group consisting of a maleimide compound and a citraconimide compound; an organic peroxide (B) containing at least one selected from the group consisting of organic peroxides represented by specific formulae; and an imidazole compound (C) represented by a specific formula.

Provided are a flexible window film and a display apparatus comprising same, the flexible window film having a substrate layer, a buffer layer and a hard coating layer that are sequentially layered, wherein the buffer layer comprises, in a thickness direction, a first area in which the amount of an amide group gradually increases from the interface between the hard coating layer and the buffer layer, and a second area in which the amount of an amide group gradually decreases from the interface between the substrate layer and the buffer layer.

The present invention provides a composition for forming a hard coat and a laminate using the same. The composition for forming a hard coat includes at least metal oxide fine particles; a hydrolysate of an organosilicon compound; an adhesion promoting component having an alkoxysilyl group; a curing catalyst; and a solvent, wherein by introducing, as the organosilicon compound, an organosilicon compound having a hydrocarbon group having (6 to 18) carbon atoms substituted with a glycidoxy group, and an organosilicon compound having a hydrocarbon group having (1 to 5) carbon atoms substituted with a glycidoxy group, even when applied to a flexible resin substrate, the composition for forming a hard coat has excellent adhesion and scratch resistance, and bending resistance (crack resistance) and surface hardness as well.

The purpose of the present invention is to provide: a polyimide film which is able to be formed at relatively low temperatures, while being less susceptible to coloring and having high transparency; and a polyamide acid or varnish for achieving this polyimide film. This polyimide film contains a polyimide which is a polymerization product of a tetracarboxylic acid dianhydride component and a diamine component. The tetracarboxylic acid dianhydride component contains from 60% by mole to 100% by mole of a tetracarboxylic acid dianhydride of a specific structure relative to the total amount of the tetracarboxylic acid dianhydride; and the diamine component contains from 30% by mole to 70% by mole of an alicyclic diamine and from 30% by mole to 70% by mole of an alkylene diamine relative to the total amount of the diamine component.

A thermoplastic polymer-based composite material and a preparation method thereof are provided. The thermoplastic polymer-based composite material is obtained by impregnating a reinforcing material with a mixture or oligomer of an epoxy resin, a bismaleimide resin, and a bifunctional amine (calculated based on active hydrogen), and then performing an in-situ polymerization. The thermoplastic polymer-based composite material has excellent impregnation effect, excellent secondary processing performance, relatively high heat resistance, excellent flame retardancy, and mechanical properties, and excellent comprehensive performance.

A resin composition includes a first prepolymer and a second prepolymer, the first prepolymer being prepared from a first mixture subjected to a prepolymerization reaction, the second prepolymer being prepared from a second mixture subjected to a prepolymerization reaction, wherein the first mixture includes a maleimide resin and a benzoxazine resin, and the second mixture includes a maleimide resin and a bis(trifluoromethyl)benzidine. The resin composition may be used to make various articles, such as a prepreg, a resin film, a laminate or a printed circuit board, and at least one of the following properties can be improved, including copper foil peeling strength, dissipation factor, ratio of thermal expansion, cure shrinkage and glass transition temperature.

Mesoporous poly (aryl ether ketone) articles are formed from blends of poly (aryl ether ketones) with pore forming additives by melt processing, and can be in the form of a monofilament, disc, film, microcapillary or other complex shapes. The method of formation provides for preparation of poly (aryl ether ketone) articles with high degree of surface area and uniform nanometer pore size. The preferred poly (aryl ether ketone)s are poly (ether ketone) and poly (ether ether ketone). The mesoporous articles formed by the method of the present invention are useful for a broad range of applications, including molecular separations and organic solvent filtration.

This disclosure relates to a dry film structure that includes a carrier substrate; and a dielectric film supported by the carrier substrate. The dielectric film includes at least one dielectric polymer and low amounts of metals.

A method for producing polyimide microparticles may comprise: combining a diamine and a dianhydride in a first dry, high boiling point solvent; reacting the diamine and the dianhydride to produce a mixture comprising poly(amic acid) (PAA) and the first dry, high boiling point solvent; emulsifying the mixture in a matrix fluid that is immiscible with the first dry, high boiling point solvent using an emulsion stabilizer to form a precursor emulsion that is an oil-in-oil emulsion; and heating the precursor emulsion during and/or after formation to a temperature sufficient to polymerize the PAA to form the polyimide microparticles.