Pre-impregnated composite material (prepreg) that can be cured/molded to form aerospace composite parts. The prepreg includes carbon reinforcing fibers and an uncured resin matrix. The resin matrix includes an epoxy component that is a combination of a hydrocarbon epoxy novolac resin and a trifunctional epoxy resin and a tetrafunctional epoxy resin. The resin matrix includes polyethersulfone as a toughening agent and a thermoplastic particle component that includes a mixture of polyamide particles and polyimide particles.

A polyimide precursor-containing aqueous composition contains at least one polymer material selected from the group consisting of a water-insoluble fibrous organic substance and a polyalkylene oxide having a viscosity-average molecular weight of 5 million or more, a polyimide precursor, particles, and water.

A process for PAI-based coating compositions. An embodiment of a method includes manufacturing a coating composition, the manufacturing of the coating composition including mixing a first solvent, the first being solvent being N-formyl morpholine (NFM), with a second solvent to form a first solution; dissolving polyamideimide or polyamide amic acid resin polymer (PAI) in the first solution; precipitating a PAI compound from a mixture of MEK and the first solution; and dissolving the PAI compound in a second solution to generate a coating solution.

In a first aspect, a polyimide film includes a polyimide derived from a dianhydride and a diamine. The dianhydride, the diamine or both the dianhydride and the diamine include an alicyclic monomer, an aliphatic monomer or both an alicyclic monomer and an aliphatic monomer. The polyimide film has an L* of at least 90, a b* of 1.25 or less, a yellowness index of 2.25 or less and a haze of less than 1% for a film thickness of 50 μm. In a second aspect, an electronic device includes the polyimide film of the first aspect.

The present invention relates to a polyimide film consisting essentially of a polyimide comprising a repeating unit represented by the following chemical formula (1):

##STR00001##

wherein the film has a YI (yellowness index) of 4 or less, a tensile modulus of elasticity of 4 GPa or more, and a load at break of 10 N or more.

A provided heat-resistant cushioning sheet is a sheet configured to be disposed between a thermocompression face of a thermocompression apparatus and a target in a thermocompression treatment of the target, and includes: a substrate including a fluorine resin; and a coating layer including a heat-resistant resin and disposed on a one principal surface side of the substrate. One exposed surface of the heat-resistant cushioning sheet is formed by the coating layer. The heat-resistant resin is a resin other than a fluorine resin and has a melting point of 280° C. or higher and/or a glass transition temperature of 210° C. or higher. The provided heat-resistant cushioning sheet is well adapted to expected further increases in treatment temperature and pressure.

The present invention provides a multilayer body of an inorganic substrate and a highly heat-resistant transparent film which has sufficient heat resistance and is able to be mechanically separated from the inorganic substrate after being subjected to various processes on the inorganic substrate since the adhesion between the highly heat-resistant transparent film and the inorganic substance is adequately weak. A multilayer body of a highly heat-resistant transparent film and an inorganic substrate, wherein: an adhesive is not substantially used; the peel strength between the highly heat-resistant transparent film and the inorganic substrate is 0.3 N/cm or less; and the CTE of the highly heat-resistant transparent film is 50 ppm/K or less.

The invention discloses a carbon nanotube/polyetherimide/thermosetting resin dielectric composite and a preparation method therefor. 100 parts by weight of polyetherimide and 1-7 parts by weight of carbon nanotube are mixed uniformly in an Haake torque melt cavity to obtain a carbon nanotubes/polyetherimide composite; 20 parts of the carbon nanotube/polyetherimide composite are dissolved in 100-150 parts of dichloromethane, then the mixed solution is added in 100 parts of molten thermocurable thermosetting resin, mixing, and heat preserving, stirring are performed until a mixture is formed in a uniform state, and curing and post-treating are performed to obtain a carbon nanotube/thermosetting resin dielectric composite, wherein the substrate thereof has a typical reverse phase structure, while the carbon nanotubes are dispersed in a polyetherimide phase. The composite has a relatively low percolation threshold, a high dielectric constant and a low dielectric loss. The preparation method of the present invention has a simple process and is suitable for large-scale production.

A resin composition, including resin and imidazole, is provided. The resin includes cyanate ester resin and bismaleimide resin, and the imidazole does not have acidic hydrogen.

The thermosetting resin composition, a prepreg containing same, a metal foil-clad laminate and a printed circuit board; the resin composition comprises the following components: a combination of a bismaleimide resin and a benzoxazine resin or a prepolymer of a bismaleimide resin and a benzoxazine resin, an epoxy resin and an active ester. A metal foil-clad laminate prepared by using the resin composition provided by the present invention has a high glass transition temperature, a low thermal expansion coefficient, a high high-temperature modulus, a high peel strength, a low dielectric constant, a low dielectric loss factor, as well as good heat resistance and good processability.