Patent classifications
C08J2479/08
FIBER-REINFORCED RESIN BASE MATERIAL
A fiber-reinforced resin base material includes continuous reinforcing fibers or a reinforcing fiber base material in which discontinuous fibers are dispersed, the continuous reinforcing fibers or a reinforcing fiber base material being impregnated with a polyphenylene sulfide resin composition, wherein the fiber-reinforced resin base material has a glass-transition temperature, as measured by the DMA method (bending mode), of 115° C. or higher.
Polyester composition, polyester film, and magnetic recording medium
An object of the present invention is to more conveniently provide a copolyester for a polyester film which exhibits excellent dimensional stability and in particular excellent dimensional stability against environmental changes in, for example, temperature and humidity, and has a small film elongation percentage at 110° C. A copolyester of the present invention comprises: (A) an aromatic dicarboxylic acid component; (B) an alkylene glycol component; and (C1) a dimer acid component and/or (C2) a dimer diol component, wherein the copolyester contains, with reference to a molar number of a total dicarboxylic acid component, 0.5 to 3.5 mol % of the dimer acid component (C1) and/or 0.3 to 5.0 mol % of the dimer diol component (C2).
Fiber-reinforced polymer alloy substrate and molded article using same
A fiber-reinforced polymer alloy substrate, in which continuous reinforcing fibers are arranged in parallel and are impregnated with a polymer alloy, is characterized in that: a polymer alloy obtained by combining thermoplastic resins of at least two types is used as the polymer alloy; the fiber volume content is in the range of 40 to 70% by volume; and the dispersion parameter D of the fibers is 90% or more. In the obtained fiber-reinforced polymer alloy substrate, the reinforcing fibers are dispersed with high uniformity, and high mechanical properties and heat resistance are stably exhibited with low variation.
Polyamideimide copolymer and polyamideimide film comprising the same
The present invention relates to a polyamideimide copolymer and a colorless and transparent polyamideimide copolymer film. The polyamideimide copolymer according to the present invention enables to provide a polyamideimide film having improved UV shielding function while exhibiting excellent scratch resistance and mechanical properties.
METHOD FOR MANUFACTURING A NEW SOUND-ABSORBING AND NOISE-REDUCING MATERIAL BY USING POLYIMIDE FOAM SCRAPS
The invention discloses a method for manufacturing a new sound-absorbing and noise-reducing material by using polyimide foam scraps, cutting and processing the scraps generated in the process of polyimide foam production into particles of different sizes, drying red iron oxide or black iron oxide or titanium dioxide as inorganic additive, and then using each component in parts by weight, putting the inorganic additive into the mixer, and then putting the polyimide foam particles of different sizes into the mixer to mix, injecting the curing agent into the mixer to continue mixing, and finally adding the catalyst into the mixer to continue mixing, putting the mixed material into the mold evenly to form the film, leaving it for 10 hours, opening the mold, taking out the product, removing the burrs, and cutting the product according to customer needs, and packing it in a carton for storage.
Fabricating ionic/polyimtde membranes
Disclosed are polyimide blends and methods of making and using same. The disclosed polyimide blends are prepared by first blending an ionic polymer and a poly(amic acid) to form a poly(amic acid) precursor, followed by cyclization. This abstract is intended as a scanning tool for purposes of searching in the particular art and is not intended to be limiting of the present invention.
Thermosetting resin composition, prepreg, resin sheet, metal foil-clad laminate, and printed wiring board
A thermosetting resin composition containing a thermosetting resin (A), boron nitride (B), and a dispersant (C) with a pH of 8 or higher.
THERMOSETTING RESIN COMPOSITION, FILM ADHESIVE, PREPREG, AND PRODUCTION METHOD THEREOF
The present invention provides a thermosetting resin composition characterized by comprising a bismaleimide compound and a triazine compound having a diaminotriazine structure.
PROTON-CONDUCTIVE MEMBRANE
A proton-conductive membrane includes a hydrophobic organic polymer and a hydrophilic proton-conductive component. The hydrophilic proton-conductive component includes one of an urea-containing material and a complex formed from an acidic substance and a basic substance, and a combination thereof. The hydrophilic proton-conductive component is present in an amount ranging from 23 parts by weight to 70 parts by weight based on 100 parts by weight of the proton-conductive membrane.
MALEIMIDE COPOLYMER
A maleimide-based copolymer having superior dispersibility during melt extrusion and kneading. A maleimide-based copolymer having an average particle diameter of 75 μm or larger and a cumulative oversize at 1000 μm of lower than 5 mass %.