This disclosure relates to a dielectric film forming composition that includes a plurality of (meth)acrylate containing compounds, at least one fully imidized polyimide polymer, and at least one solvent.

A resin composition comprises: an unsaturated bond-containing polyphenylene ether resin; a maleimide resin of Formula (1); and a compound of Formula (2) or Formula (3). The resin composition may be used to make various articles, such as a prepreg, a resin film, a laminate or a printed circuit board, and at least one of the following improvements can be achieved, including prepreg viscosity variation ratio, stickiness resistance, amount of void after lamination, multi-layer board thermal resistance, glass transition temperature, ratio of thermal expansion, copper foil peeling strength and dissipation factor.

A prepreg consisting cf a fiber reinforcement material and a resin composition containing a bismaleimide resin is molded through a first heating step in which the prepreg is held at a temperature (T.sub.1) equal to or higher than a temperature at which the resin composition exhibits a viscosity of 100 (Pa.Math.s) and equal to or lower than a temperature at which the resin composition exhibits the minimum viscosity for 30 minutes or more, followed by being held at a temperature equal to or higher than a curing temperature of the bismaleimide resin.

Provided is a method for preparing a carbon nanotube/polymer composite material, including: coating a nano-silicon oxide film on the surface of a porous polymer by vacuum coating; depositing a metal catalyst nano-film on the nano-silicon oxide film by vacuum sputtering; growing a carbon nanotube array in situ on the surface of the porous polymer by plasma enhanced chemical vapor deposition to obtain a carbon nanotube/polymer porous material; and impregnating the carbon nanotube/polymer porous material with a polymer and curing to obtain the carbon nanotube/polymer composite material. By using a heat-resistant polymer having a high heat-resistant temperature and a PECVD technique, a carbon nanotube array directly grows in situ on the surface of a polymer at a low temperature, which thereby overcomes the defects of the composites previously prepared, in which carbon nanotubes are difficult to be homogeneously dispersed and the interfacial bonding force in the composites is weak.

An allyl-containing resin is provided. The allyl-containing resin comprises a repeating unit comprising a structural unit represented by the following formula (I): ##STR00001## wherein, R.sub.1 to R.sub.3 in formula (I) are as defined in the specification; the Fourier transform infrared spectrum of the allyl-containing resin has a signal intensity “a” from 1650 cm.sup.−1 to 1630 cm.sup.−1 and a signal intensity “b” from 1620 cm.sup.−1 to 1560 cm.sup.−1, and 0<a/b≤1.20; and the quantitative .sup.1H-NMR spectrum of the allyl-containing resin has a signal intensity “c” from 3.2 ppm to 6.2 ppm and a signal intensity “d” from 6.6 ppm to 7.4 ppm, and 0<c/d≤1.20.

The present invention relates to a prepreg including a fiber base material layer containing a fiber base material, a first resin layer formed on one surface of the fiber base material layer, and a second resin layer formed on the other surface of the fiber base material layer, wherein the first resin layer is a layer obtained through layer formation of a resin composition (I) containing, as a main component of resin components, an epoxy resin (A), and the second resin layer is a layer obtained through layer formation of a resin composition (II) containing, as a main component of resin components, an amine compound (B) having at least two primary amino groups in one molecule thereof and a maleimide compound (C) having at least two N-substituted maleimide groups in one molecule thereof; a laminated sheet obtained by using the prepreg; a printed wiring board; a coreless board; a semiconductor package; and a method of producing a coreless board.

The present invention relates to a resin composition having a high flow property, low thermal expansion characteristics, and excellent mechanical properties, and a prepreg and a metal clad laminate formed from the same.

A low cost, high selectivity asymmetric polyimide/polyethersulfone (PES) blend hollow fiber membrane, a method of making the membrane and its use for a variety of liquid, gas, and vapor separations such as deep desulfurization of gasoline and diesel fuels, ethanol/water separations, pervaporation dehydration of aqueous/organic mixtures, CO.sub.2/CH.sub.4, CO.sub.2/N.sub.2, H.sub.2/CH.sub.4, He/CH.sub.4, O.sub.2/N.sub.2, H.sub.2S/CH.sub.4, olefin/paraffin, iso/normal paraffins separations, and other light gas mixture separations. The polyimide/PES blend hollow fiber membrane is fabricated from a blend of a polyimide polymer and PES and showed surprisingly unique gas separation property with higher selectivities than either the polyimide hollow fiber membrane without PES polymer or the PES hollow fiber membrane without PES polymer for gas separations such as for H.sub.2/CH.sub.4, He/CH.sub.4, H.sub.2S/CH.sub.4, CO.sub.2/CH.sub.4 separations.

A resin composition including an inorganic filler (B) having an aluminosilicate (A) having a silicon atom content of from 9 to 23% by mass, an aluminum atom content of from 21 to 43% by mass, and an average particle diameter (D50) of from 0.5 to 10 μm; and any one or more thermosetting compounds selected from the group consisting of an epoxy resin (C), a cyanate compound (D), a maleimide compound (E), a phenolic resin (F), an acrylic resin (G), a polyamide resin (H), a polyamideimide resin (I), and a thermosetting polyimide resin (J), wherein a content of the inorganic filler (B) is from 250 to 800 parts by mass based on 100 parts by mass of resin solid content.

A resin composition includes 20 parts by weight to 45 parts by weight of a phosphorus-containing bismaleimide and 100 parts by weight of a thermosetting resin, wherein the phosphorus-containing bismaleimide has a structure of Formula (I); the thermosetting resin is selected from a vinyl-containing polyphenylene ether resin, a maleimide resin, a polyolefin resin, a prepolymer of maleimide resin, and a combination thereof. The resin composition may be used to make a prepreg, a resin film, a laminate or a printed circuit board, and at least one of the following properties can be improved, including flame retardancy, outgassing properties, arc resistance, copper foil peeling strength, X-axis coefficient of thermal expansion, glass transition temperature and water absorption rate. ##STR00001##