Patent classifications
C08J2483/05
SILICONE FOAM COMPOSITIONS RAPIDLY CROSS-LINKABLE AT AMBIENT TEMPERATURES AND METHODS OF MAKING AND USING SAME
Provided are rapidly cross-linkable silicone foam compositions, kits, and methods for filling implanted medical devices in situ or in vivo, the implanted medical devices, including for example, body implants and tissue expanders, the compositions including a platinum divinyl disiloxane complex; a low viscosity vinyl terminated polydimethylsiloxane; a low viscosity hydride terminated polydimethylsiloxane; a silicone cross-linker; and a gas and/or gas-filled microcapsules, where the rapidly cross-linkable silicone foam composition has a viscosity of ≤150 cPs for ≥1 min. post-preparation and ≤300 cPs≤5 min. post-preparation, at ambient temperature.
Composition, foamed silicone elastomer formed therefrom, and methods of formation
A composition for forming a foamed silicone elastomer is disclosed. The composition comprises: A) an organopolysiloxane having at least two silicon-bonded ethylenically unsaturated groups per molecule; B) an organohydrogensiloxane having at least two silicon-bonded hydrogen atoms per molecule; C) a hydrosilylation catalyst; D) a chemical blowing agent; and E) a physical blowing agent. The hydrosilylation catalyst C) is present in a catalytically effective amount. The chemical blowing agent D) has at least one hydroxyl (OH) group, and is present in an amount to provide a OH content >0 and <500 parts per million (ppm). The physical blowing agent E) undergoes a phase change from a liquid to a gaseous state during exposure to atmospheric pressure and a temperature ≥0° C. The blowing agents D) and E) are different from one another. A foamed silicone elastomer, and methods of forming the composition and foamed silicone elastomer are also disclosed.
THERMALLY CONDUCTIVE COMPOSITION AND METHOD FOR PRODUCING THE SAME
A thermally conductive composition contains a base polymer, an adhesive polymer, and thermally conductive particles. A thermal conductivity of the thermally conductive composition is 0.3 W/m.Math.K or more. The thermally conductive particles include inorganic particles (a) with a specific surface area of 1 m.sup.2/g or less. The inorganic particles (a) are coated with the adhesive polymer. The production method includes a first mixing process of mixing the adhesive polymer and the inorganic particles (a) with a specific surface area of 1 m.sup.2/g or less so that the inorganic particles (a) are coated with the adhesive polymer, a second mixing process of adding and mixing the base polymer; and a curing process. Thus, the present invention provides a thermally conductive composition that has high thermal conductive properties, a high compression repulsive force, and less interfacial debonding resulting from stress, and a method for producing the thermally conductive composition.
Silicone foam compositions rapidly cross-linkable at ambient temperatures and methods of making and using same
Provided are rapidly cross-linkable silicone foam compositions, kits, and methods for filling implanted medical devices in situ or in vivo, the implanted medical devices, including for example, body implants and tissue expanders, the compositions including a platinum divinyl disiloxane complex; a low viscosity vinyl terminated polydimethylsiloxane; a low viscosity hydride terminated polydimethylsiloxane; a silicone cross-linker; and a gas and/or gas-filled microcapsules, where the rapidly cross-linkable silicone foam composition has a viscosity of ≤150 cPs for ≥1 min. post-preparation and ≤300 cPs≤5 min. post-preparation, at ambient temperature.
FOAMABLE SILICONE COMPOSITION
Foamable silicone compositions, containing (A) at least one organopolysiloxane containing at least two alkenyl groups bonded to silicon per molecule, (B) at least one organopolysiloxane containing at least two hydrogen atoms bonded to silicon per molecule, (C) at least one porogenic agent generating gaseous hydrogen in the presence of component (B), and (D) at least one hydrosilylation catalyst. Foams obtained by curing such foamable silicone compositions have excellent resilience, moderate hardness, good mechanical properties, and flame retardancy, suitable for the sealing of battery pack cases.
Organopolysiloxane composition
Provided is a hydrosilylation reactive composition and a method for producing a semi-cured product and a cured product using the hydrosilylation reactive composition, which exhibit sharp curability during the reaction while maintaining pot life and can provide a molecular design through the reaction control of the M.sup.H unit/D.sup.H unit. The composition comprises: (A) a compound containing at least one monovalent hydrocarbon group having an aliphatic unsaturated bond per molecule; (B) a compound containing at least two hydrogen atoms bonded to silicon atoms per molecule; (C) a first hydrosilylation catalyst; and (D) a second hydrosilylation catalyst which microencapsulates component (C) with a thermoplastic resin having a softening point within the temperature range of 50 to 200° C. and exhibits activity at temperatures higher than that of component (C). Also provided is a method for carrying out a hydrosilylation reaction at temperatures of two stages using the composition.
THERMALLY CONDUCTIVE SHEET
The present invention is a thermally conductive sheet comprising: a matrix comprising an organic polymer, and a carbon fiber X, the carbon fiber X being oriented in a thickness direction of the sheet, wherein a proportion of a carbon fiber (A) having a fiber length of 100 .Math.m or less is 40% or more and a proportion of a carbon fiber (B) having a fiber length of 200 .Math.m or more is 3 to 13% of the carbon fiber X. According to the present invention, a thermally conductive sheet in which the thermal resistance value is effectively reduced by polishing the surface, resulting in a sheet having a low thermal resistance value can be provided.
COMPOSITION, FOAMED SILICONE ELASTOMER FORMED THEREFROM, AND METHODS OF FORMATION
A composition for forming a foamed silicone elastomer is disclosed. The composition comprises: A) an organopolysiloxane having at least two silicon-bonded ethylenically unsaturated groups per molecule; B) an organohydrogensiloxane having at least two silicon-bonded hydrogen atoms per molecule; C) a hydrosilylation catalyst; D) a chemical blowing agent; and E) a physical blowing agent. The hydrosilylation catalyst C) is present in a catalytically effective amount. The chemical blowing agent D) has at least one hydroxyl (OH) group, and is present in an amount to provide a OH content >0 and <500 parts per million (ppm). The physical blowing agent E) undergoes a phase change from a liquid to a gaseous state during exposure to atmospheric pressure and a temperature ≥0° C. The blowing agents D) and E) are different from one another. A foamed silicone elastomer, and methods of forming the composition and foamed silicone elastomer are also disclosed.
ORGANOPOLYSILOXANE COMPOSITION
Provided is a hydrosilylation reactive composition and a method for producing a semi-cured product and a cured product using the hydrosilylation reactive composition, which exhibit sharp curability during the reaction while maintaining pot life and can provide a molecular design through the reaction control of the M.sup.H unit/D.sup.H unit. The composition comprises: (A) a compound containing at least one monovalent hydrocarbon group having an aliphatic unsaturated bond per molecule; (B) a compound containing at least two hydrogen atoms bonded to silicon atoms per molecule; (C) a first hydrosilylation catalyst; and (D) a second hydrosilylation catalyst which microencapsulates component (C) with a thermoplastic resin having a softening point within the temperature range of 50 to 200° C. and exhibits activity at temperatures higher than that of component (C). Also provided is a method for carrying out a hydrosilylation reaction at temperatures of two stages using the composition.
ORGANOPOLYSILOXANE COMPOSITION, AND HALF-CURED PRODUCT AND CURED PRODUCT PRODUCED FROM SAME
Provided is a hydrosilylation reactive composition that has a sufficient pot life at room temperature, that can be cured at low temperature by exposure to high energy radiation, and that produces a stable semi-cured product during the curing process, and to provide a semi-cured product and a cured product obtained using this hydrosilylation reactive composition. The composition comprises: (A) a compound containing at least one aliphatically unsaturated monovalent hydrocarbon group in the molecule; (B) a compound containing at least two hydrogen atoms bonded to silicon atoms in the molecule; (C) a first hydrosilylation catalyst exhibiting activity in the composition without exposure to high energy radiation; and (D) a second hydrosilylation catalyst not exhibiting activity unless exposed to high energy radiation, and exhibiting activity in the composition by exposure to high energy radiation.