An object of the present invention is to provide a resin composition that has a variety of properties required for a material for printed circuit boards such as high flame retardancy, and can attain a cured product having high moldability, high resistance against chemicals in a desmearing step, and a small coefficient of thermal expansion, a prepreg comprising the resin composition, a laminate including the prepreg, a metallic foil clad laminate including the prepreg, and a printed circuit board including the prepreg. A resin composition comprising an acrylic-silicone copolymer (A), a halogen-free epoxy resin (B), a cyanic acid ester compound (C) and/or a phenol resin (D), and an inorganic filler (E).

The present invention relates to a silicone foam that is produced in-situ at a wound site, e.g. in a wound cavity, through a multi-component system, based on a physical foaming process, wherein the gas required to form the foam structure is provided through the blowing agent independently of the curing reaction of the polyorganosiloxane components of the multi-component system. Therefore, in accordance with the present invention, the blowing agent is provided as a distinct entity of the multi-component system that is, in particular, not the result of any chemical reaction taking place in the multi-component system. The present invention also relates to a device for producing the foam and the corresponding negative pressure wound therapy kit.

A silicone release coating composition is disclosed. The silicone release coating composition comprises: (A) an organopolysiloxane having at least two alkenyl groups in a molecule; (B) an organopolysiloxane having at least two silicon-bonded hydrogen atoms in a molecule; (C) organic modified functional silica particles having an average particle size of 5 m to 15 m and a BET specific surface area of 600 m.sup.2/g to 800 m.sup.2/g; and (D) a hydrosilylation reaction catalyst. The silicone release coating composition can form a coating with a lower release force to sticky adhesive.

The invention relates to a crosslinkable composition X, comprising: at least one organopolysiloxane compound A comprising, per molecule, at least two C2-C6 alkenyl radicals bonded to silicon atoms; at least one organohydrogenopolysiloxane compound B comprising, per molecule, at least two hydrogen atoms bonded to an identical or different silicon atom; at least one catalyst C which is a complex corresponding to the following formula: [Fe(L1)2] in which: the symbol Fe represents iron at degree of oxidation II; the symbols L1, which may be identical or different, represent a ligand which is a -dicarbonylato anion or the enolate anion of a -dicarbonylated compound; optionally at least one adhesion promoter D; and optionally at least one charge E. The invention also relates to the use of the previously described catalyst C as silicone composition crosslinking catalyst, to a silicone composition crosslinking method, wherein it comprises heating the composition X to a temperature of between 70 and 200 C., and to the resulting crosslinked silicone material Y.

The present invention relates to a photocurable coating composition for forming a low refractive layer, a method for preparing an antireflection film using the photocurable coating composition, and an anti-reflective film prepared by using the photocurable coating composition. According to the present invention, a low refractive layer is formed of a photocurable coating composition containing two or more types of photo-polymerizable compounds, a photoinitiator, surface-treated hollow inorganic nanoparticles, and surface-treated solid inorganic nanoparticles.

The present invention relates to a polyphenyl ether resin composition and a use thereof in a high-frequency circuit substrate. The polyphenyl ether resin composition comprises a vinyl-modified polyphenyl ether resin and an organic silicon resin containing unsaturated double bonds and having a three-dimensional net structure. The high-frequency circuit substrate of the present invention has a high glass-transition temperature, a high thermal decomposition temperature, a high interlayer adhesive force, a low dielectric constant and a low dielectric loss tangent, and is very suitable as a circuit substrate of high-speed electronic equipment.

Provided are rapidly cross-linkable silicone foam compositions, kits, and methods for filling implanted medical devices in situ or in vivo, the implanted medical devices, including for example, body implants and tissue expanders, the compositions including a platinum divinyl disiloxane complex; a low viscosity vinyl terminated polydimethylsiloxane; a low viscosity hydride terminated polydimethylsiloxane; a silicone cross-linker; and a gas and/or gas-filled microcapsules, where the rapidly cross-linkable silicone foam composition has a viscosity of 150 cPs for 1 min. post-preparation and 300 cPs5 min. post-preparation, at ambient temperature.

Combining the features of a glassy polymeric membrane and a rubbery polymeric membrane into a multiple membrane system provides a system having the advantages of both of the types of membranes. The membranes may be in any order in the system and multiple glassy polymeric membranes and multiple rubbery polymeric membranes may be used

A barrier film including a substrate, a base (co)polymer layer applied on a major surface of the substrate, an oxide layer applied on the base (co)polymer layer, and a protective (co)polymer layer applied on the oxide layer. The protective (co)polymer layer is formed as the reaction product of a first (meth)acryloyl compound and a (meth)acryl-silane compound derived from a Michael reaction between a second (meth)acryloyl compound and an aminosilane. The first and second (meth)acryloyl compounds may be the same. In some embodiments, a multiplicity of alternating layers of the oxide layer and the protective (co)polymer layer may be used. An oxide layer can be applied over the top protective (co)polymer layer. The barrier films provide, in some embodiments, enhanced resistance to moisture and improved peel strength adhesion of the protective (co)polymer layer(s) to the underlying layers. A process of making, and methods of using the barrier film are also described.

Various embodiments disclosed related to modified elastomer surfaces and methods of making and using the same. In various embodiments, the present invention provides a method of modifying the surface of an elastomer. The method can include contacting a polymerizable composition and at least part of a surface of an elastomer. The polymerizable composition can include a free-radical polymerizable monomers, an organoborane-organonitrogen free-radical initiator, and an amine-reactive compound. The method can include at least partially polymerizing the polymerizable composition, to provide a polymerization product of the polymerizable composition on the surface of the elastomer.