Patent classifications
C08K3/014
POLYOLEFIN MICROPOROUS FILM AND PREPARATION METHOD THEREOF
The present invention relates to a separator film in a lithium battery, more specifically relates to a polyolefin microporous film and a preparation method thereof. The polyolefin microporous film has a porosity above 30% and below 65%, a median pore size above 10 nm and below 60 nm, a stress-strain (σ-ε) curve integral in Machine Direction (MD) and Transverse Direction (TD) directions simultaneously fulfilling the following definition:
E=∫.sub.0.sup.εσ(ε)dε>150 J/m.sup.2; and the largest pore size, the smallest pore size and the median pore size fulfilling the following definition: 0.9<P<1.2, wherein P=(the largest pore size−the smallest pore size)/the median pore size. The polyolefin microporous film according to the present invention has high tenacity, small pore sizes, concentrated distribution of pore sizes, great stability for coiling, and enabling high number of battery cycles. When used as a separator film, battery manufacturing safety and the service life of the battery being made can be increased.
Antidegradant blend
The present invention is directed to an antidegradant blend, comprising: at least one metal carboxylate; at least one inorganic phosphite; at least one phenolic antioxidant; and at least one organic phosphite antioxidant. As examples, the metal carboxylate may comprise a metal stearate, a metal lactate and/or a metal benzoate while the inorganic phosphite may comprise one or more metal hypophosphites.
THERMALLY CONDUCTIVE SILICONE HEAT DISSIPATION MATERIAL
A thermally conductive silicone heat dissipating material contains a silicone polymer, a thermally conductive inorganic filler, and a heat resistance improver. The thermally conductive inorganic filler has a BET specific surface area (A.sub.BET) of 0.3 m.sup.2/g or more and is surface treated with a surface treatment agent expressed by Si(OR′).sub.4 or R.sub.xSi(OR′).sub.4−x (where R represents a hydrocarbon group having 1 to 4 carbon atoms or an aromatic hydrocarbon group having 6 to 12 carbon atoms, R′ represents a hydrocarbon group having 1 to 4 carbon atoms, and x represents an integer of 1 to 2). The content of the thermally conductive inorganic filler is 100 to 10000 parts by mass with respect to 100 parts by mass of the silicone polymer. The thermally conductive inorganic filler having a large specific surface area and a small average particle size is surface treated with a silane coupling agent with a low molecular weight, so that the heat resistance of the thermally conductive silicone heat dissipating material is improved.
THERMALLY CONDUCTIVE SILICONE HEAT DISSIPATION MATERIAL
A thermally conductive silicone heat dissipating material contains a silicone polymer, a thermally conductive inorganic filler, and a heat resistance improver. The thermally conductive inorganic filler has a BET specific surface area (A.sub.BET) of 0.3 m.sup.2/g or more and is surface treated with a surface treatment agent expressed by Si(OR′).sub.4 or R.sub.xSi(OR′).sub.4−x (where R represents a hydrocarbon group having 1 to 4 carbon atoms or an aromatic hydrocarbon group having 6 to 12 carbon atoms, R′ represents a hydrocarbon group having 1 to 4 carbon atoms, and x represents an integer of 1 to 2). The content of the thermally conductive inorganic filler is 100 to 10000 parts by mass with respect to 100 parts by mass of the silicone polymer. The thermally conductive inorganic filler having a large specific surface area and a small average particle size is surface treated with a silane coupling agent with a low molecular weight, so that the heat resistance of the thermally conductive silicone heat dissipating material is improved.
HIGH STRENGTH AND HIGH THERMAL CONDUCTIVITY POLYETHYLENE THIN FILM HAVING A BIMODAL MOLECULAR WEIGHT
An optically clear, high strength, high modulus, and high thermal conductivity polyethylene thin film may be formed from a crystallizable polymer and an additive configured to interact with the crystallizable polymer to facilitate crystallite alignment and, in some examples, create a higher crystalline content within the polyethylene thin film. The polyethylene thin film may be characterized by a bimodal molecular weight distribution where the molecular weight of the additive may be less than approximately 5% of the molecular weight of the crystallizable polymer. Example crystallizable polymers may include high molecular weight polyethylene, high density polyethylene, and ultra-high molecular weight polyethylene. Example additives may include low molecular weight polyethylene and polyethylene oligomers. The polyethylene thin film may be characterized by a Young's modulus of at least approximately 10 GPa, a tensile strength of at least approximately 0.7 GPa, and a thermal conductivity of at least approximately 5 W/mK.
HIGH STRENGTH AND HIGH THERMAL CONDUCTIVITY POLYETHYLENE THIN FILM HAVING A BIMODAL MOLECULAR WEIGHT
An optically clear, high strength, high modulus, and high thermal conductivity polyethylene thin film may be formed from a crystallizable polymer and an additive configured to interact with the crystallizable polymer to facilitate crystallite alignment and, in some examples, create a higher crystalline content within the polyethylene thin film. The polyethylene thin film may be characterized by a bimodal molecular weight distribution where the molecular weight of the additive may be less than approximately 5% of the molecular weight of the crystallizable polymer. Example crystallizable polymers may include high molecular weight polyethylene, high density polyethylene, and ultra-high molecular weight polyethylene. Example additives may include low molecular weight polyethylene and polyethylene oligomers. The polyethylene thin film may be characterized by a Young's modulus of at least approximately 10 GPa, a tensile strength of at least approximately 0.7 GPa, and a thermal conductivity of at least approximately 5 W/mK.
Polyamide Composition
Described herein is a polyamide composition [composition (C)] including: from 0 to 30% wt of at least one polyamide [polyamide (A)]; and from above 30 to 99.99% wt of at least one branched polyamide different from polyamide (A).
Polyamide Composition
Described herein is a polyamide composition [composition (C)] including: from 0 to 30% wt of at least one polyamide [polyamide (A)]; and from above 30 to 99.99% wt of at least one branched polyamide different from polyamide (A).
POLYAMIDE MATERIALS HAVING IMPROVED LONG-TERM PERFORMANCE CHARACTERISTICS
The present invention relates to a process for the long-term stabilization of polyamides and the use of a specific additive composition for the long-term stabilization of polyamides.
POLYAMIDE MATERIALS HAVING IMPROVED LONG-TERM PERFORMANCE CHARACTERISTICS
The present invention relates to a process for the long-term stabilization of polyamides and the use of a specific additive composition for the long-term stabilization of polyamides.