Oxygen scavenging polymeric compositions that possess an improved oxygen scavenging capability and can be formed into transparent/translucent thin films are disclosed. A composition can include iron powder, ferrous sulfate heptahydrate (FeSO.sub.4.7H.sub.2O) and glycerol dispersed in polyethylene. Such compositions are useful for creating packaging films with improved oxygen scavenging capability.

A polymeric blend composition comprising: (a) from about 1 to about 99 wt. % of a polymer; and (b) from about 1 to about 75 wt. % poly alpha-1,3-glucan is disclosed. The addition of alpha-1,3-glucan as a polymer filler can increase the tensile modulus, tensile strength and oxygen barrier properties of the polymeric blend composition.

Provided are a white heat-curable epoxy resin composition capable of yielding a cured product that is tough and superior in initial reflection rate and heat resistance; and a semiconductor device with a light receiving element and other semiconductor elements being encapsulated by such cured product. The white heat-curable epoxy resin composition contains: (A) a prepolymer as a molten mixture of (A-1) an epoxy resin: a triazine derivative epoxy resin and/or an alicyclic epoxy compound having an epoxy group and an alicyclic structure in one molecule and being non-fluid at 25° C., (A-2) an acid anhydride having no carbon-carbon double bond and (A-3) an acrylic resin-based modifier having an epoxy group and a weight-average molecular weight of 1,000 to 30,000; (B) a white pigment containing a titanium oxide; (C) an inorganic filler; (D) a curing accelerator; and (E) an antioxidant.

Provided are a white heat-curable epoxy resin composition capable of yielding a cured product that is tough and superior in initial reflection rate and heat resistance; and a semiconductor device with a light receiving element and other semiconductor elements being encapsulated by such cured product. The white heat-curable epoxy resin composition contains: (A) a prepolymer as a molten mixture of (A-1) an epoxy resin: a triazine derivative epoxy resin and/or an alicyclic epoxy compound having an epoxy group and an alicyclic structure in one molecule and being non-fluid at 25° C., (A-2) an acid anhydride having no carbon-carbon double bond and (A-3) an acrylic resin-based modifier having an epoxy group and a weight-average molecular weight of 1,000 to 30,000; (B) a white pigment containing a titanium oxide; (C) an inorganic filler; (D) a curing accelerator; and (E) an antioxidant.

The invention relates to polycarbonate compositions with an improved thermal behaviour and improved slip characteristics, achieved by the use of oxidised, acid-modified polyethylene waxes.

The present invention provides a polyamide composition comprising (a) at least one polyamide mixture formed from (i) at least one polyamide 6,6, the amount of amine end groups (AEG) being greater than the amount of carboxylic acid end groups (CEG); and (ii) at least one high chain-length polyamide; (b) at least one reinforcing filler; (c) at least one heat stabilizer; (d) aluminum stearate; and optionally (e) at least one additive. The polyamide composition can be advantageously used to produce articles exhibiting enhanced chemical resistance, notably CaCl.sub.2 salt crack resistance, such as radiator end tank in an automobile.

The present invention provides polyamide compositions comprising (a) at least one polyamide mixture; (b) at least one reinforcing filler; (c) at least one heat stabilizer; and (d) at least one ionic lubricant, wherein the (a) at least one polyamide mixture is formed from (i) a polyamide 6,6, the amount of AEG being greater than the amount of CEG, and (ii) a blend of a first high chain-length polyamide having viscosity number (VN) of X.sub.1 and a second high chain-length polyamide having VN of X.sub.2, X.sub.1 being greater than X.sub.2. The polyamide composition can be advantageously used to produce articles exhibiting enhanced chemical resistance, notably CaCl.sub.2 salt crack resistance, such as radiator end tank in an automobile.

A polyamide resin composition for an extrusion-molded article exposed to high-pressure hydrogen gas contains: 70 to 99 parts by weight of a polyamide 6 resin (A); 1 to 30 parts by weight of an impact modifier (B); and 0.005 to 1 parts by weight of a metal halide (C) with respect to a total of 100 parts by weight of the polyamide 6 resin (A) and the impact modifier (B). The polyamide resin composition has a melt tension of 20 mN or more when measured at 260° C. and a take-up speed at strand break of 30 m/min or more when measured at 260° C.

A polyamide resin composition for an extrusion-molded article exposed to high-pressure hydrogen gas contains: 70 to 99 parts by weight of a polyamide 6 resin (A); 1 to 30 parts by weight of an impact modifier (B); and 0.005 to 1 parts by weight of a metal halide (C) with respect to a total of 100 parts by weight of the polyamide 6 resin (A) and the impact modifier (B). The polyamide resin composition has a melt tension of 20 mN or more when measured at 260° C. and a take-up speed at strand break of 30 m/min or more when measured at 260° C.

The invention relates to the use of at least one catalyst, at least one copper heat stabiliser and at least one oligo- or poly-carbodiimide with a matrix including at least one polyamide, in order to form a composition that has a good melt viscosity and is stable during transformation, in particular during extrusion.