A thermal interface composition includes a polysiloxane component, a thermal conductive component, a curing agent, a curing accelerator, an organosilicon coupling agent, and a crosslinking agent having three or more epoxy groups. The polysiloxane component includes not lower than 50 wt % and lower than 100 wt % of a first polysiloxane and a second polysiloxane. The thermal conductive component includes not lower than 30 wt % and lower than 70 wt % of a first thermal conductive filler, not lower than 30 wt % and lower than 70 wt % of a second thermal conductive filler, and greater than 0 wt % and not greater than 40 wt % of a third thermal conductive filler. A method for preparing a thermal interface material is also disclosed.

Magnet wire improved partial discharge performance may include a conductor, a first layer of polymeric enamel insulation formed around the conductor, and a second layer of polymeric enamel insulation formed around the first layer. The second layer may be a semi-conductive layer that includes a base polymeric material and filler particles dispersed within the base polymeric material. Additionally, at least sixty percent by weight of the filler particles may be positioned in an outer half of a thickness of the second layer.

Magnet wire improved partial discharge performance may include a conductor, a first layer of polymeric enamel insulation formed around the conductor, and a second layer of polymeric enamel insulation formed around the first layer. The second layer may be a semi-conductive layer that includes a base polymeric material and filler particles dispersed within the base polymeric material. Additionally, at least sixty percent by weight of the filler particles may be positioned in an outer half of a thickness of the second layer.

Metallo supramolecular polymer conetworks (MSMC) of poly[r(alkyl).sub.a-N-(pyridin-s-yl) (meth)-acrylamide moiety].sub.m,n derivatives-complexed to a transition metal cation-linked by poly(dimethylsiloxane).sub.palkyl-(meth)-acrylate moiety derivatives, wherein a is 0 or 1 or 2, p is an integer selected from the group consisting of from 50 to 70 and of from 120 to 180, r is integer of from 0 to 4, and s is an integer of from 2 to 4, and m and n, independently, are integers of from 5 to 11. These MSMC can be used as film or coating on a substrate and are exhibiting self-healing and bacterial anti-adhesion properties.

Metallo supramolecular polymer conetworks (MSMC) of poly[r(alkyl).sub.a-N-(pyridin-s-yl) (meth)-acrylamide moiety].sub.m,n derivatives-complexed to a transition metal cation-linked by poly(dimethylsiloxane).sub.palkyl-(meth)-acrylate moiety derivatives, wherein a is 0 or 1 or 2, p is an integer selected from the group consisting of from 50 to 70 and of from 120 to 180, r is integer of from 0 to 4, and s is an integer of from 2 to 4, and m and n, independently, are integers of from 5 to 11. These MSMC can be used as film or coating on a substrate and are exhibiting self-healing and bacterial anti-adhesion properties.

A conductive paste composition according to the present disclosure contains silver-coated copper nanowires with a core-shell structure; a binder mixture containing a silicone resin binder and a hydrocarbon-based resin binder; and an organic solvent, such that the conductive paste composition has a low sheet resistance and may withstand a high temperature, thereby implementing excellent conductivity and electromagnetic wave shielding properties. Furthermore, the conductive paste may be widely used in various fields such as electromagnetic wave shielding, solar cell electrodes, electronic circuits.

A conductive paste composition according to the present disclosure contains silver-coated copper nanowires with a core-shell structure; a binder mixture containing a silicone resin binder and a hydrocarbon-based resin binder; and an organic solvent, such that the conductive paste composition has a low sheet resistance and may withstand a high temperature, thereby implementing excellent conductivity and electromagnetic wave shielding properties. Furthermore, the conductive paste may be widely used in various fields such as electromagnetic wave shielding, solar cell electrodes, electronic circuits.

The present invention particularly relates to synthesizing photo-initiators having poly-oligo-silsesquioxane (POSS) structure and realizing photo-polymerization by using these photo-initiators and simultaneous and in-situ synthesis of Ag nano-particles in polymer matrix comprising POSS structure and obtaining wrinkled surfaces as a result of self-arranging thereof.

The present invention particularly relates to synthesizing photo-initiators having poly-oligo-silsesquioxane (POSS) structure and realizing photo-polymerization by using these photo-initiators and simultaneous and in-situ synthesis of Ag nano-particles in polymer matrix comprising POSS structure and obtaining wrinkled surfaces as a result of self-arranging thereof.

Disclosed herein are method and design rules for making polyelemental systems with specific heterostructures, including tetra-phase nanopartides with as many as six junctions. In accordance with an embodiment, a method of making a tetra-phase polyelemental nanoparticle using tri-phase nanoparticle architectures can include selecting two or more triphase nanoparticle architectures, wherein the two or more tri-phase nanoparticle architectures are one or more striped tri-phase architectures, one or more pie-shaped tri-phase architectures, or combinations thereof; identifying from the selected two or more tri-phase nanoparticle architectures groups of metals for generating each of the two or more tri-phase nanoparticle architectures; contacting a tip coated with an ink to a substrate to form a nanoreactor, the ink comprising block copolymer and the metals from the groups of metals identified for generating each of the two or more tri-phase nanoparticle architectures; and annealing the nanoreactors under conditions sufficient to synthesize a tetra-phase polyelemental nanoparticle.