Patent classifications
C08K3/105
THERMOPLASTIC COMPOSITIONS AND SHAPED ARTICLES THEREOF
A thermoplastic composition comprising: a homopolycarbonate; a poly(carbonate siloxane) component present in an amount effective to provide 0.5-20 wt % total siloxane content; an antimicrobial agent comprising silver zirconium phosphate, silver phosphate glass, or a combination thereof; optionally, an additive composition; each based on the total weight of the composition which totals to 100 wt %.
THERMOPLASTIC COMPOSITIONS AND SHAPED ARTICLES THEREOF
A thermoplastic composition comprising: a homopolycarbonate; a poly(carbonate siloxane) component present in an amount effective to provide 0.5-20 wt % total siloxane content; an antimicrobial agent comprising silver zirconium phosphate, silver phosphate glass, or a combination thereof; optionally, an additive composition; each based on the total weight of the composition which totals to 100 wt %.
PLASTIC MODIFYING COMPOSITIONS AND ENHANCED CARBONATE COMPOSITIONS
The present invention provides certain aqueous plastic modifying compositions for use in the preparation of plastic forming mixtures used in the preparation and processing of polyethylene, polypropylene and polystyrene plastic products. The aqueous plastic modifying compositions provide certain plastic processing advantages and distinct final plastic product characteristics. The present invention further provides carbonate enhancing composition useful for preparing enhanced carbonate compositions, also of the present invention
Electroless gold plating bath
The present invention concerns an electroless gold plating bath comprising a) gold ions; b) sulfite ions; c) iodide ions; d) at least one phosphonate compound according to formula (1) ##STR00001## wherein each X is independently an alkanediyl group; R.sup.1, R.sup.2, R.sup.3 and each R.sup.4 are independently alkanediyl groups; M is independently hydrogen, a metal atom or a cation forming radical; each n is a rational number and selected in accordance with the valency of the respective M; and b is an integer ranging from 1 to 10.
The invention further is directed to the use of the bath and a method for depositing a gold layer on a surface of a substrate. The bath is particularly suitable in the manufacture of printed circuit boards, IC substrates, semiconducting devices, interposers made of glass and the like.
Electroless gold plating bath
The present invention concerns an electroless gold plating bath comprising a) gold ions; b) sulfite ions; c) iodide ions; d) at least one phosphonate compound according to formula (1) ##STR00001## wherein each X is independently an alkanediyl group; R.sup.1, R.sup.2, R.sup.3 and each R.sup.4 are independently alkanediyl groups; M is independently hydrogen, a metal atom or a cation forming radical; each n is a rational number and selected in accordance with the valency of the respective M; and b is an integer ranging from 1 to 10.
The invention further is directed to the use of the bath and a method for depositing a gold layer on a surface of a substrate. The bath is particularly suitable in the manufacture of printed circuit boards, IC substrates, semiconducting devices, interposers made of glass and the like.
Resin Composition, and Molded Article and Multilayer Structure Each Comprising Same
The present invention relates to a resin composition comprising an ethylene-vinyl alcohol copolymer (A) with an ethylene unit content of 20 mol % or more and 60 mol % or less, a divalent metal hydroxide (B) and a monovalent metal compound (C), wherein a content of the divalent metal hydroxide (B) is 5 ppm or more and 5000 ppm or less, and a mass ratio (C/B) of the amount of the monovalent metal compound (C) in terms of the monovalent metal atom to the amount of the divalent metal hydroxide (B) in terms of the divalent metal atom is 0.025 to 100. Thus, there is provided a resin composition containing an ethylene-vinyl alcohol copolymer having excellent long run property during melt molding and excellent color phase in long-term melt molding.
Resin Composition, and Molded Article and Multilayer Structure Each Comprising Same
The present invention relates to a resin composition comprising an ethylene-vinyl alcohol copolymer (A) with an ethylene unit content of 20 mol % or more and 60 mol % or less, a divalent metal hydroxide (B) and a monovalent metal compound (C), wherein a content of the divalent metal hydroxide (B) is 5 ppm or more and 5000 ppm or less, and a mass ratio (C/B) of the amount of the monovalent metal compound (C) in terms of the monovalent metal atom to the amount of the divalent metal hydroxide (B) in terms of the divalent metal atom is 0.025 to 100. Thus, there is provided a resin composition containing an ethylene-vinyl alcohol copolymer having excellent long run property during melt molding and excellent color phase in long-term melt molding.
SELF-SINTERED THERMAL INTERFACE MATERIALS
Self-sintering thermal interface material is prepared from a polymer matrix and a filler. The polymer matrix may be a water or hydrogen peroxide or other water-contained solvent solution such as ammonia or alcohol containing a water soluble resin and fumed silica or an alcohol or other solvent solution containing at least one water insoluble resin and fumed silica. The filler contains i) gallium alkali metal or gallium metal, ii) one or more micro/nano-sized metallic fillers, and iii) dielectric fillers.
SELF-SINTERED THERMAL INTERFACE MATERIALS
Self-sintering thermal interface material is prepared from a polymer matrix and a filler. The polymer matrix may be a water or hydrogen peroxide or other water-contained solvent solution such as ammonia or alcohol containing a water soluble resin and fumed silica or an alcohol or other solvent solution containing at least one water insoluble resin and fumed silica. The filler contains i) gallium alkali metal or gallium metal, ii) one or more micro/nano-sized metallic fillers, and iii) dielectric fillers.
PHOTONIC SINTERED NANOINK, PHOTONIC SINTERING METHOD, AND CONDUCTIVE NANOSTRUCTURE
Provided is photo-sintering nano ink. The photo-sintering nano ink includes a photo-sintering precursor including a conductive nano particle and an oxide film surrounding the conductive nano particle, polymer binder resin, and an adhesive.