The present invention relates to a process for the long-term stabilization of polyamides and the use of a specific additive composition for the long-term stabilization of polyamides.

The present invention relates to a process for the long-term stabilization of polyamides and the use of a specific additive composition for the long-term stabilization of polyamides.

Biologically acceptable surgical barrier materials are comprised of a polyelectrolytic complex of chitosan and sodium alginate. The chitosan is deacetylated in an amount between about 40 to about 60% and has a molecular weight (Mw) between 50,000 and 375,000 g/mol. The barrier materials may be formed by mixing a two-component material system whereby one component comprises the chitosan and a second component comprises the sodium alginate and directing such a mixture (e.g., via air-assisted spray nozzle) toward a surgical site in need of the material. A polyelectrolytic complex of the chitosan and sodium alginate will thereby form in situ. Suitable ionic cross-linkers may be provided in the individual components, e.g., calcium chloride with the chitosan component and sodium tripolyphosphate with the sodium alginate component.

Biologically acceptable surgical barrier materials are comprised of a polyelectrolytic complex of chitosan and sodium alginate. The chitosan is deacetylated in an amount between about 40 to about 60% and has a molecular weight (Mw) between 50,000 and 375,000 g/mol. The barrier materials may be formed by mixing a two-component material system whereby one component comprises the chitosan and a second component comprises the sodium alginate and directing such a mixture (e.g., via air-assisted spray nozzle) toward a surgical site in need of the material. A polyelectrolytic complex of the chitosan and sodium alginate will thereby form in situ. Suitable ionic cross-linkers may be provided in the individual components, e.g., calcium chloride with the chitosan component and sodium tripolyphosphate with the sodium alginate component.

The present disclosure provides a conductive material, a method for manufacturing the conductive material and an electronic device, and relates to the technical field of new materials. The conductive material provided by the present disclosure includes: a first component and a second component. The first component includes a liquid metal having a melting point below room temperature, a coating material, and a first solvent. The coating material coats liquid metal droplets formed by the liquid metal. The second component includes a base resin and a conductive powder. The first component and the second component are weighed in proportion, and are uniformly mixed to obtain the conductive material. The technical solution of the present disclosure can obtain a wire having better flexibility.

The present disclosure provides a conductive material, a method for manufacturing the conductive material and an electronic device, and relates to the technical field of new materials. The conductive material provided by the present disclosure includes: a first component and a second component. The first component includes a liquid metal having a melting point below room temperature, a coating material, and a first solvent. The coating material coats liquid metal droplets formed by the liquid metal. The second component includes a base resin and a conductive powder. The first component and the second component are weighed in proportion, and are uniformly mixed to obtain the conductive material. The technical solution of the present disclosure can obtain a wire having better flexibility.

A resin composition, a light conversion layer and a light emitting device are provided. The resin composition includes a quantum dot (A), an alkali-soluble resin (B), an ethylenically unsaturated monomer (C), a photoinitiator (D), a solvent (E) and a phenyl-based compound (F). The phenyl-based compound (F) includes at least one of a compound represented by following Formula (F-1) and a compound represented by following Formula (F-2). Based on a total usage amount of the resin composition as 100 parts by weight, a usage amount of the phenyl-based compound (F) is 0.05 to 5 parts by weight. ##STR00001##
In Formula (F-1) and Formula (F-2), the definition of R.sup.1, R.sup.3, R.sup.4, Y, Z, m, n and p are the same as defined in the detailed description.

A resin composition, a light conversion layer and a light emitting device are provided. The resin composition includes a quantum dot (A), an alkali-soluble resin (B), an ethylenically unsaturated monomer (C), a photoinitiator (D), a solvent (E) and a phenyl-based compound (F). The phenyl-based compound (F) includes at least one of a compound represented by following Formula (F-1) and a compound represented by following Formula (F-2). Based on a total usage amount of the resin composition as 100 parts by weight, a usage amount of the phenyl-based compound (F) is 0.05 to 5 parts by weight. ##STR00001##
In Formula (F-1) and Formula (F-2), the definition of R.sup.1, R.sup.3, R.sup.4, Y, Z, m, n and p are the same as defined in the detailed description.

A method for producing a polyamide resin composition containing a crystalline polyamide resin (A) containing a polycaproamide resin as a main component, a semi-aromatic amorphous polyamide resin (B), an inorganic reinforcing material (C), a master batch of carbon black (D), and a copper compound (E); a dispersion liquid of the copper compound (E) has a concentration of 0.04% by mass to 1.0% by mass; and the crystalline polyamide resin (A) containing a polycaproamide resin as a main component, the semi-aromatic amorphous polyamide resin (B), the master batch of carbon black (D), and the dispersion liquid of the copper compound (E) are mixed in advance, followed by charging the mixture is into a hopper part of an extruder, and charging the inorganic reinforcing material (C) into the extruder by a side feed method.

A method for producing a polyamide resin composition containing a crystalline polyamide resin (A) containing a polycaproamide resin as a main component, a semi-aromatic amorphous polyamide resin (B), an inorganic reinforcing material (C), a master batch of carbon black (D), and a copper compound (E); a dispersion liquid of the copper compound (E) has a concentration of 0.04% by mass to 1.0% by mass; and the crystalline polyamide resin (A) containing a polycaproamide resin as a main component, the semi-aromatic amorphous polyamide resin (B), the master batch of carbon black (D), and the dispersion liquid of the copper compound (E) are mixed in advance, followed by charging the mixture is into a hopper part of an extruder, and charging the inorganic reinforcing material (C) into the extruder by a side feed method.