A multilayer tape according to an embodiment of the present disclosure includes: an adhesive layer including an epoxy; and an electromagnetic interference (EMI) absorption layer disposed on the adhesive layer and including a thermoset epoxy resin and a plurality of magnetic metal particles which are distributed in the thermoset epoxy resin, and the magnetic metal particles include iron, and a ratio of a gross weight of the plurality of magnetic metal particles to a gross weight of the EMI absorption layer is higher than bout 40%, and a peel strength of the adhesive layer and the EMI absorption layer after the adhesive layer is cured is about 5 times or more greater than a peel strength of the adhesive layer and the EMI absorption layer before the adhesive layer is cured.

A modified nanocomposite material is provided, which includes an inorganic filler, a silicon dioxide, and a polymer matrix, in which the silicon dioxide is binding with a hydroxyl bond of the inorganic filler to form a silicon dioxide-inorganic filler, and the polymer matrix is dispersed over the silicon dioxide-inorganic filler. Another modified nanocomposite material is further provided, which includes an inorganic filler, a silicon dioxide, and a polymer matrix, in which the silicon dioxide is binding with a hydroxyl bond of the inorganic filler to form a silicon dioxide-inorganic filler, the organic modifier is associated with the silicon dioxide-inorganic filler and the polymer matrix is dispersed over the silicon dioxide-inorganic filler and the organic modifier.

A modified nanocomposite material is provided, which includes an inorganic filler, a silicon dioxide, and a polymer matrix, in which the silicon dioxide is binding with a hydroxyl bond of the inorganic filler to form a silicon dioxide-inorganic filler, and the polymer matrix is dispersed over the silicon dioxide-inorganic filler. Another modified nanocomposite material is further provided, which includes an inorganic filler, a silicon dioxide, and a polymer matrix, in which the silicon dioxide is binding with a hydroxyl bond of the inorganic filler to form a silicon dioxide-inorganic filler, the organic modifier is associated with the silicon dioxide-inorganic filler and the polymer matrix is dispersed over the silicon dioxide-inorganic filler and the organic modifier.

An optical laminate is provided where stable durability is secured even at a high temperature, particularly an ultrahigh temperature of about 100° C. or higher, a foaming phenomenon or the like in a pressure-sensitive adhesive layer is also suppressed or prevented, other physical properties required for the optical laminate are also excellent, and even in the case of being disposed adjacent to the electrode, corrosion of the relevant electrode or the like is not induced.

An optical laminate is provided where stable durability is secured even at a high temperature, particularly an ultrahigh temperature of about 100° C. or higher, a foaming phenomenon or the like in a pressure-sensitive adhesive layer is also suppressed or prevented, other physical properties required for the optical laminate are also excellent, and even in the case of being disposed adjacent to the electrode, corrosion of the relevant electrode or the like is not induced.

An optical laminate is provided where stable durability is secured even at a high temperature, particularly an ultrahigh temperature of about 100° C. or higher, a foaming phenomenon or the like in a pressure-sensitive adhesive layer is also suppressed or prevented, other physical properties required for the optical laminate are also excellent, and even in the case of being disposed adjacent to the electrode, corrosion of the relevant electrode or the like is not induced.

Golf balls having a single or dual-layered solid core are provided. In one embodiment, the golf ball has dimensions and properties that do not conform to the rules of the United States Golf Association (USGA). For example, the ball weight; ball size; ball spherical symmetry; ball initial velocity; and/or ball overall distance may fall outside of the USGA standards. The dual-layered core can have an inner core comprising a thermoplastic composition and surrounding outer core comprising a thermoset composition. In another embodiment, the dual-layered core has an inner core comprising a thermoplastic composition and outer core comprising a thermoset composition. The thermoplastic composition preferably comprises an ethylene acid copolymer ionomer and plasticizer. The thermoset composition preferably comprises polybutadiene rubber. The ball further includes a cover of at least one layer.

Golf balls having a single or dual-layered solid core are provided. In one embodiment, the golf ball has dimensions and properties that do not conform to the rules of the United States Golf Association (USGA). For example, the ball weight; ball size; ball spherical symmetry; ball initial velocity; and/or ball overall distance may fall outside of the USGA standards. The dual-layered core can have an inner core comprising a thermoplastic composition and surrounding outer core comprising a thermoset composition. In another embodiment, the dual-layered core has an inner core comprising a thermoplastic composition and outer core comprising a thermoset composition. The thermoplastic composition preferably comprises an ethylene acid copolymer ionomer and plasticizer. The thermoset composition preferably comprises polybutadiene rubber. The ball further includes a cover of at least one layer.

A thermal conductive silicone composition includes (A) 100 parts by mass of an organopolysiloxane having a kinematic viscosity at 25° C. of 10 to 500,000 mm.sup.2/s; (B) 10 to 2,000 parts by mass of a thermal conductive filler having an average particle size of 0.01 to 100 μm; and (C) 1,000 to 10,000 parts by mass of gallium or a gallium alloy having a melting point of −20 to 100° C. The resulting thermal conductive silicone composition has excellent thermal conduction property.

A thermal conductive silicone composition includes (A) 100 parts by mass of an organopolysiloxane having a kinematic viscosity at 25° C. of 10 to 500,000 mm.sup.2/s; (B) 10 to 2,000 parts by mass of a thermal conductive filler having an average particle size of 0.01 to 100 μm; and (C) 1,000 to 10,000 parts by mass of gallium or a gallium alloy having a melting point of −20 to 100° C. The resulting thermal conductive silicone composition has excellent thermal conduction property.