An adhesive, and an encapsulated product and method of encapsulating an organic electronic device (OED) using the same are provided. The adhesive film serves to encapsulate the OED and includes a curable resin and a moisture absorbent, and the adhesive includes a first region coming in contact with the OED upon encapsulation of the OED and a second region not coming in contact with the OED. Also, the moisture absorbent is present at contents of 0 to 20% and 80 to 100% in the first and second regions, respectively, based on the total weight of the moisture absorbent in the adhesive.

The present invention provides cross-linking compounds having structures as set forth herein for cross-linking organic polymers. Further, polymer compositions include a cross-linking compound and an organic polymer, and in some embodiments the composition further includes a cross-linking reaction additive for controlling the cross-linking reaction rate. In alternate embodiments, the present invention provides cross-linking compositions including a cross-linking compound and a cross-linking reaction additive capable of forming a reactive intermediate oligomer for cross-linking an organic polymer. Further provided are methods of cross-linking organic polymers, organic polymers formed thereby, and molded articles formed from the cross-linked organic polymers. Additionally, methods for forming high glass transition temperature elastomeric materials and methods for forming extrusion-resistant and creep-resistant materials are provided.

The present invention discloses crosslinkable polymer compositions and additive manufacturing compositions incorporating such crosslinkable polymer compositions for use in additive manufacturing methods to prepare articles. The polymer compositions include at least one aromatic polymer and at least one crosslinking compound that is capable of crosslinking the at least one aromatic polymer.

An adhesive, and an encapsulated product and method of encapsulating an organic electronic device (OED) using the same are provided. The adhesive film serves to encapsulate the OED and includes a curable resin and a moisture absorbent, and the adhesive includes a first region coming in contact with the OED upon encapsulation of the OED and a second region not coming in contact with the OED. Also, the moisture absorbent is present at contents of 0 to 20% and 80 to 100% in the first and second regions, respectively, based on the total weight of the moisture absorbent in the adhesive.

Disclosed is an aqueous bonding composition comprising: (A) a saccharide; (B) a water-soluble synthetic resin; and (C) an inorganic acid ammonium salt, wherein the inorganic acid ammonium salt (C) comprises at least one selected from ammonium dihydrogen phosphate and ammonium chloride. The water-soluble synthetic resin (B) preferably comprises a polyvinyl alcohol-based compound. A wood-based material obtainable by using the aqueous bonding composition is also disclosed. The aqueous bonding composition is useful for improving performances such as bending strength, bending strength under wet condition, water-absorption thickness expansion coefficient, and peeling strength of a wood-based material in a balanced manner while the composition is capable of bonding at a comparatively low temperature and each component of the composition is excellent in compatibility.

Disclosed herein are novel materials and methods of forming those novel materials. The materials are synthesized from Poly(acrylic acid), a crosslinker; and a salt. The material can be further synthesized from sodium hydroxide. The crosslinker can be a covalent crosslinking agent such as N,N-methylenebisacrylamide. Examples of applicable salts are calcium chloride, lithium chloride, zinc chloride, sodium chloride, potassium chloride, barium chloride, cesium chloride, magnesium chloride, cobalt chloride, lithium bromide. In example, the Poly(acrylic acid) can be about 3 moles of Poly(acrylic acid), the crosslinker can be about 0.005 moles of N,N-methylenebisacrylamide, and the salt can be formed by the addition of about 0.003 moles of potassium persulfate.

The invention provides formulations and masterbatches of a polymeric material and XRF-identifiable markers, for producing transparent elements including a polymer and at least one XRF-identifiable marker for a variety of industrial uses.

There are provided a hydrogel having a highly strengthened self-supporting property, which can be prepared by simply mixing at room temperature, and a method for producing the hydrogel. A hydrogel-formable composition capable of forming a hydrogel having a self-supporting property characterized by comprising: a water-soluble organic polymer having an organic acid structure, an organic acid salt structure, or an organic acid anion structure; a silicate; a compound having a diphosphonic acid structure of Formula (I): ##STR00001##
wherein R.sub.1 and R.sub.2 each are independently specific substituents, X.sub.1 and X.sub.2 each are independently a single bond or a linking group, and n is an integer of 1 to 5; or a salt thereof; and a compound having or generating a positive charge of divalent or more, a hydrogel which is formed from the composition, and a method for producing the hydrogel.

A composition for producing a sheet material with a cellular structure, the composition including the following components: (a) about 5 to about 25 weight % gelatine, (b) about 25 to 60 weight % filler material, (c) about 15 to about 40 weight % water, and (d) a cellular structure promoting agent.

A film (1) includes hollow particles (10) and a binder (20). The hollow particles are made of a material having a refractive index of 1.15 to 2.70. The binder (20) is formed of at least a polysilsesquioxane and binds the hollow particles (10). The film (1) satisfies at least one of requirements Ib/Ia?0.7 and Ib/Ic?0.3. Ia is an absorbance derived from a hydrocarbon group not directly bonded to a silicon atom, the absorbance being determined by attenuated total reflection using a Fourier transform infrared spectrophotometer. Ib is an absorbance derived from a bond between a silicon atom and a non-reactive functional group. Ic is an absorbance derived from a bond between a silicon atom and a hydroxy group.