An adhesive, and an encapsulated product and method of encapsulating an organic electronic device (OED) using the same are provided. The adhesive film serves to encapsulate the OED and includes a curable resin and a moisture absorbent, and the adhesive includes a first region coming in contact with the OED upon encapsulation of the OED and a second region not coming in contact with the OED. Also, the moisture absorbent is present at contents of 0 to 20% and 80 to 100% in the first and second regions, respectively, based on the total weight of the moisture absorbent in the adhesive.

The present disclosure is drawn to particulate mixtures, material sets and methods of forming porous 3-dimensional printed parts. The particulate mixtures can include 5 wt % to 40 wt % of a salt having an average particle size from 5 m to 100 m. The mixture can also include 60 wt % to 95 wt % of a build material for 3-dimensional printing. The build material can include a particulate polymer having an average particle size from 5 m to 100 m and a melting point from 100 C. to 400 C. The melting point of the particulate polymer can be lower than the melting point of the salt.

The present disclosure is drawn to particulate mixtures, material sets and methods of forming porous 3-dimensional printed parts. The particulate mixtures can include 5 wt % to 40 wt % of a salt having an average particle size from 5 m to 100 m. The mixture can also include 60 wt % to 95 wt % of a build material for 3-dimensional printing. The build material can include a particulate polymer having an average particle size from 5 m to 100 m and a melting point from 100 C. to 400 C. The melting point of the particulate polymer can be lower than the melting point of the salt.

Hydrogel compositions, and corresponding methods of making, are provided. The hydrogels do not freeze, or only partially freeze, over a wide range of temperatures below the freezing temperature of water. Concurrently, these hydrogels also retain their room temperature mechanical properties (e.g., strength, modulus, elasticity) over a wide range of temperatures, including temperatures below the freezing temperature of water. The hydrogels are synthesized by adding a suitable amount of a salt together with previously cross-linked polymer gel. Hydration of the gel with aqueous solutions containing the prescribed salts not only depresses the hydrogel freezing point but protects the structure. For example, the salts do not allow the hydrogel to completely freeze, thus protecting the hydrogel from brittle failure. Whether the hydrogels partially freeze or remain non-frozen when chilled below the freezing temperature of water is determined by concentration of salt within the hydrogel.

An adhesive, and an encapsulated product and method of encapsulating an organic electronic device (OED) using the same are provided. The adhesive film serves to encapsulate the OED and includes a curable resin and a moisture absorbent, and the adhesive includes a first region coming in contact with the OED upon encapsulation of the OED and a second region not coming in contact with the OED. Also, the moisture absorbent is present at contents of 0 to 20% and 80 to 100% in the first and second regions, respectively, based on the total weight of the moisture absorbent in the adhesive.

A water-soluble composition may include: a solution of polyvinyl alcohol (PVA) or of polyvinylpyrrolidone (PVP); CaCl.sub.2 and/or MgCl.sub.2 in a range of from 10 to 50 wt. %. The composition may include: polyvinyl alcohol or polyvinylpyrrolidone in a range of from 10 to 20 wt. % in an aqueous solution; glycerol in a range of from 20 to 40 wt. %; and CaCl.sub.2 and/or MgCl.sub.2 in a range of from 10 to 30 wt. %.

Disclosed is an aqueous bonding composition comprises: (A) a saccharide; (B) an inorganic acid ammonium salt; and (C) a metal salt, wherein the metal salt (C) comprises at least one selected from potassium salts, calcium salts, sodium salts, and magnesium salts. The aqueous bonding composition is excellent in balance among bending strength, bending strength under wet condition, water-absorption thickness expansion coefficient, and peeling strength. The aqueous bonding composition can be usefully used to produce a wood-based material. Further, a wood-based material obtainable by using the aqueous bonding composition is provided.

Metal-containing polymeric materials and metal complex-containing polymeric materials are provided. The polymeric materials are divinylbenzene/maleic anhydride polymers, partially hydrolyzed divinylbenzene/maleic anhydride polymers, or fully hydrolyzed divinylbenzene/maleic anhydride polymers. Additionally, methods of making the metal-containing polymeric materials, methods of using the metal-containing polymeric materials to capture volatile, basic, nitrogen-containing compounds, and methods of using a zinc-containing polymeric material to detect the presence of water vapor are provided.

A water-soluble film comprising a mixture of a polyvinyl alcohol (PVOH) resin, a plasticizer, and a metal salt, wherein the metal salt is present in the water-soluble film in an amount sufficient to reduce the enthalpy of melting of the film by at least 20% compared to the enthalpy of melting of an otherwise identical film not comprising the metal salt.

There are provided a hydrogel having a highly strengthened self-supporting property, which can be prepared by simply mixing at room temperature, and a method for producing the hydrogel. A hydrogel-formable composition capable of forming a hydrogel having a self-supporting property characterized by comprising: a water-soluble organic polymer having an organic acid structure, an organic acid salt structure, or an organic acid anion structure; a silicate; a compound having a diphosphonic acid structure of Formula (I):

##STR00001##

wherein R.sub.1 and R.sub.2 each are independently specific substituents, X.sub.1 and X.sub.2 each are independently a single bond or a linking group, and n is an integer of 1 to 5; or a salt thereof; and a compound having or generating a positive charge of divalent or more, a hydrogel which is formed from the composition, and a method for producing the hydrogel.