Composite resin granules 5 contain a binder resin 2 and a thermally conductive filler. The thermally conductive filler includes a non-anisotropic thermally conductive filler 3 and an anisotropic thermally conductive filler 4. The composite resin granules containing the binder resin and the thermally conductive filler are formed into a spherical shape. The particles of the anisotropic thermally conductive filler 4 are oriented in random directions. A thermally conductive rein molded body 6 of the present invention is obtained by compressing the composite resin granules 5. Thus, the present invention provides the thermally conductive resin molded body that has relatively high thermal conductivities in the in-plane direction and the thickness direction, well-balanced directional properties of thermal conduction, and a low specific gravity, the composite resin granules suitable for the thermally conductive resin molded body, and methods for producing them.

A tableted epoxy resin composition for encapsulation of semiconductor devices and a semiconductor device encapsulated using the tableted epoxy resin composition, the tableted epoxy resin composition satisfying the following conditions (i) a proportion of tablets of the tableted epoxy resin composition having a diameter of greater than or equal to 0.1 mm and less than 2.8 mm and a height of greater than or equal to 0.1 mm and less than 2.8 mm is about 97 wt % or more, as measured by sieve analysis using ASTM standard sieves; (ii) the tablets have a packed density of greater than about 1.7 g/mL; and (iii) a ratio of packed density to cured density of the tablets is about 0.6 to about 0.87.

To provide an inorganic filler dispersion stabilizer capable of reducing the viscosity of a composition containing an inorganic filler and improving the storage stability of the composition containing an inorganic filler. An inorganic filler dispersion stabilizer which is a polyester having carboxyl groups at both terminals.

A high temperature resistant polyimide film and its preparation method. The present invention relates to a polyimide film and its preparation method and solves the problems of honeycomb's and skin panel's core adhesive-polyimide film with insufficient heat resistance, no climbing of bonding core structure and adhesive fillet formation. The high temperature resistant polyimide film is made by polyimide solution, inorganic filler modifier and interface coupling agent by the steps of: under specific temperature and stirring conditions, adding inorganic filler modifier and interface coupling agent to polyimide solution, stirring to obtain the adhesive agent; filtering and degassing the adhesive agent, casting to a stainless steel drum with carrier cloth and release paper to obtain a self-supporting film; then heating and annealing to obtain the final polyimide film. The present invention is applied to high temperature resistant polyimide film and its preparation method.

A high temperature low outgas thermal interface material is provided. The thermal interface material includes a plurality of heat conducting particles dispersed within a fluorine containing fluid such as perfluoropolyether. The high temperature low outgas thermal interface material provides thermal conductivity between a heat source and a heat sink at temperatures greater than 200° C.

A phthalonitrile-based composite material has a thermally conductive filler. The thermally conductive filler is distributed in the phthalonitrile matrix resin, or the thermally conductive filler is distributed in a thermally conductive filler layer at least partially covering the surface of the phthalonitrile-based microspheres. The phthalonitrile-based composite material has good application prospects in the fields of heat conduction and heat conductive insulation.

A thermal conductive silicone composition includes (A) 100 parts by mass of an organopolysiloxane having a kinematic viscosity at 25° C. of 10 to 500,000 mm.sup.2/s; (B) 10 to 2,000 parts by mass of a thermal conductive filler having an average particle size of 0.01 to 100 μm; and (C) 1,000 to 10,000 parts by mass of gallium or a gallium alloy having a melting point of −20 to 100° C. The resulting thermal conductive silicone composition has excellent thermal conduction property.

Disclosed herein is a composition comprising a thiol-terminated compound; an oxidant; and a thermally conductive filler package comprising thermally conductive, electrically insulative filler particles. The thermally conductive, electrically insulative filler particles have a thermal conductivity of at least 5 W/m.Math.K (measured according to ASTM D7984) and a volume resistivity of at least 1 Ω.Math.m (measured according to ASTM D257, C611, or B193) and may be present in an amount of at least 50% by volume based on total volume of the filler package. The thermally conductive filler package may be present in an amount of 15% by volume to 90% by volume based on total volume of the composition. The present invention also is directed to a method for treating a substrate and to substrates comprising a layer formed from a composition disclosed herein.

An integrated silicone for protecting electronic devices includes a base resin, a thermal initiator, and a photoinitiator.

The method for producing a thermally conductive sheet according to the present invention comprises: a step (1) of obtaining a liquid composition comprising a curable silicone composition including an alkenyl group-containing organopolysiloxane and a hydrogen organopolysiloxane, a thermally conductive filler, and a volatile compound; a step (2) of sandwiching the liquid composition between two resin sheets at least one of which is a gas-permeable film and pressurizing these to obtain a sheet-shaped formed product; and a step (3) of heating the sheet-shaped formed product to volatilize at least a part of the volatile compound. According to the present invention, it is possible to provide a method for producing a thermally conductive sheet having a good sheet condition and a low thermal resistance value.