Patent classifications
C08K2003/282
THERMAL CONDUCTIVE SHEET AND METHOD FOR PRODUCING THE SAME, AND HEAT DISSIPATION STRUCTURE AND ELECTRONIC DEVICE
A thermal conductive sheet includes a cured product of a resin composition containing carbon fiber, an inorganic filler other than carbon fiber, and binder resin. The tack force of the sheet surface is 100 gf or greater, determined when the sheet between release films is subjected to press processing at 0.5 MPa for 30 sec, and after the films are peeled off, is indented by 50 μm at 2 mm/second with a probe 5.1 mm in diameter and the probe is pulled away at 10 mm/sec. Additionally, (B/A)×100≥80% is true, where A denotes the tack force of the sheet surface after the films are peeled off subsequent to press processing; and B denotes the tack force of the sheet surface when the sheet is indented by 50 μm at 2 mm/second with a probe 5.1 mm in diameter and the probe is pulled away at 10 mm/second after exposure to atmosphere for 1 hour subsequent to press processing.
Silicon-containing oxide-coated aluminum nitride particle and method of manufacturing the same
A method of manufacturing a silicon-containing oxide-coated aluminum nitride particle; a method of manufacturing a heat dispersing resin composition containing the silicon-containing oxide-coated aluminum nitride particle; and the silicon-containing oxide-coated aluminum nitride particle. The method of manufacturing includes: a first step of covering the surface of the aluminum nitride particle with an organic silicone compound including a specific structure; and a second step of heating the aluminum nitride particle covered with the organic silicone compound at a temperature of 300° C. or more and less than 1000° C., wherein the content of carbon atoms in the silicon-containing oxide-coated aluminum nitride particle is less than 1000 ppm by mass.
COMPOSITION INCLUDING A POLYTHIOL, A POLYEPOXIDE, AN AMINE CATALYST, AND A CONDUCTIVE FILLER AND METHODS RELATING TO THE COMPOSITION
A composition includes a polythiol having more than one thiol group, a polyepoxide having more than one epoxide group, an amine catalyst, and conductive filler. The conductive filler is at least one of thermally conductive or electrically conductive. The conductive filler is present in an amount to provide a thermal conductivity of at least 0.95 W/m′K, and/or the conductive filler is present in an amount of greater than 80 percent by weight, based on the total weight of the composition. A polymer network, which can be prepared from the composition, and a method for making the polymer network are also disclosed.
THERMALLY CONDUCTIVE COMPOSITION CONTAINING MGO FILLER AND METHODS AND DEVICES IN WHICH SAID COMPOSITION IS USED
A highly thermally conductive composition is provided, such composition comprising: (A) An organopolysiloxane composition; (B) a filler treating agent; (C) a thermal stabilizer; and (D) thermally conductive filler mixture, comprising: (D-1) a small-particulate thermally conductive filler having a mean size of up to 1 μm, (D-2) middle-sized filler having a mean size of from 1 to 10 μm, (D-3) large filler having a mean size of larger than 30 μm and comprising at least magnesium oxide.
HIGHLY THERMALLY CONDUCTIVE SILICONE COMPOSITION AND METHOD FOR PRODUCING SAME
The purpose of the present invention is to provide a highly thermally conductive silicone composition that exhibits excellent displacement resistance and coatability by forming a silicone composition that contains: an organopolysiloxane that is a product of a reaction between (A) an organopolysiloxane having an alkenyl group bonded to a silicon atom and (B) an organohydrogenpolysiloxane having a hydrogen atom bonded to a silicon atom (a Si—H group) at quantities whereby the (Si—H/Si-Vi) ratio is more than 8.0 and not more than 20.0; (C) an inorganic filler having an average particle diameter of 3 μm or less which is selected from among metal oxides and metal nitrides; and (D) a thermally conductive inorganic filler having an average particle diameter of 5 μm or more. The total amount of component (C) and component (D) is 3,500-12,000 parts by mass relative to a total of 100 parts by mass of component (A) and component (B), and the composition has a thermal conductivity of 4 W/m.Math.K or more and an absolute viscosity of 100-1,000 Pa.Math.s. A further purpose of the present invention is to provide a method for producing the highly thermally conductive silicone composition.
Methods and systems for 3D printing with powders
A method of printing a three dimensional article (201) can include forming a bottom layer of the three dimensional article (201) by spraying a dry build material powder (210) onto a build platform (230) while heating the dry build material powder (210). The dry build material powder (210) can include metal or ceramic particles mixed with a polymeric binder having a softening point temperature. The dry build material powder (210) can be heated to a temperature above the softening point temperature such that the dry build material powder (210) adheres to the build platform (230). Subsequent layers can be formed by spraying dry build material powder (210) onto a lower layer while heating the dry build material powder (210) such that the dry build material powder (210) adheres to the lower layer.
Thermal Interface Materials Based on Two-Part Polyurethanes
Disclosed herein are thermal interface materials based on two-part polyurethane resins comprising a polyurethane resin and a thermally conductive filler dispersed throughout the polyurethane resin, wherein the polyurethane resin is formed from two parts comprising: a first part comprising a triol, and a second part comprising an isocyanate-functionalized component, wherein at least one of the first part and the second part comprises a thermally conductive filler material.
THERMALLY CONDUCTIVE SILICONE COMPOSITION, SHEET USING THE SAME, AND METHOD FOR PRODUCING THE SHEET
A composition of the present invention contains the following components A to C: A. a linear terminal-reactive polydimethylsiloxane; B. a thermally conductive filler including the following B1, B2, and B3 in an amount of 800 to 2500 parts by mass with respect to 100 parts by mass of the component A; and C. a curing catalyst in a catalytic amount. The component B includes the following: B1. a thermally conductive filler that has an average particle size of 0.1 to 1.0 μm and is surface treated with a surface treatment agent containing a reactive group having no unsaturated bond; B2. a thermally conductive filler that has an average particle size of 1.0 to 10 μm and is surface treated with a surface treatment agent containing a reactive group having an unsaturated bond; and B3. a thermally conductive filler that has an average particle size of 10 to 100 μm and is surface treated with the surface treatment agent containing a reactive group having no unsaturated bond or the surface treatment agent containing a reactive group having an unsaturated bond. Thus, the thermally conductive silicone composition and the sheet formed by using this composition have a high strength.
ELECTRICALLY INSULATING, THERMALLY CONDUCTIVE COATINGS FOR ELECTRICAL SYSTEMS AND DEPOSITION METHODS THEREOF
An electric machine includes a rotor assembly having a rotor core that extends in an axial direction and a stator assembly surrounding and coaxial with the rotor assembly. The stator assembly includes a stator core having slots extending in a radial direction into an inner surface of the stator core and extending axially from a first end surface to a second end surface of the stator core. The stator assembly includes stator coil windings disposed within the respective slots of the stator core and a first electrically insulating conformal coating disposed between the stator core and the stator coil windings. The conformal coating includes a polymer matrix impregnated with an effective amount of thermally conductive ceramic materials, above a percolation threshold, that form continuous thermal pathways across a thickness of the first coating.
THERMAL-CONDUCTIVE SILICONE COMPOSITION, PRODUCTION METHOD THEREFOR, AND SEMICONDUCTOR DEVICE
A thermal-conductive silicone composition containing: (A) a hydrolysable organopolysiloxane having an alkoxysilyl group; and (B) aluminum nitride particles having an average particle size of 0.5 μm or more and 2.0 μm or less and contained in an amount of 50 to 70 volume %. A content of coarse particles in the aluminum nitride particles is 1.0 volume % or less relative to the entire aluminum nitride particles, the coarse particles having particle sizes of 10 μm or more according to a particle size distribution measurement method by laser diffraction. The thermal-conductive silicone composition has a heat conductivity of 1.3 W/mK or more according to a hot disc method. The present invention provides: a thermal-conductive silicone composition having high heat conductivity and being compressible to 10 μm or less; and a production method of the thermal-conductive silicone composition.