Disclosed herein is an article comprising a substrate; an abrasive coating disposed on the substrate; where the abrasive coating comprises a matrix having abrasive grit particles dispersed therein; and a layer of material disposed on the abrasive coating; where the layer of material is a titanium nitride (TiN), boron nitride (BN), titanium-aluminum-nitrides [(TiAl)N], titanium-aluminum-silicon-nitrides [(TiAlSi)N], chromium nitrides (CrN), aluminum oxide (Al.sub.2O.sub.3), titanium oxide (TiO.sub.2), silicon carbo-nitride (SiCN), titanium carbo-nitride (TiCN), or a combination thereof.

A thermally conductive polysiloxane composition comprising: (A) a thermally conductive filler; (B) a polyorganosiloxane resin having a curable functional group in the polysiloxane molecule, the polyorganosiloxane resin comprising at least one polysiloxane (b1) having one curable functional group in the molecule thereof; (C) a siloxane compound having an alkoxysilyl group and a linear siloxane structure; (D) a hydrogenpolyorganosiloxane; and (E) a platinum catalyst, wherein the content of the polysiloxane (b1) having one curable functional group in the molecule thereof in the polyorganosiloxane resin (B) is more than 80% by mass.

A resin composition includes: (A) 100 parts by weight of a thermosetting resin, which includes a vinyl-containing polyphenylene ether resin, a maleimide resin, or a combination thereof; (B) 15 parts by weight to 50 parts by weight of a sintered body formed by aluminum nitride and boron nitride; and (C) 180 parts by weight to 280 parts by weight of titanium dioxide. Moreover, an article may be made from the resin composition, including a prepreg, a resin film, a laminate or a printed circuit board.

The thermally conductive resin composition containing: 5 to 95 parts by weight of a copolymer (a) having a (meth)acrylic monomer unit A having an anionic group, a (meth)acrylic monomer unit B having a cationic group, and a silicone (meth)acrylic monomer unit C; 95 to 5 parts by weight of a silicone resin (b); and 500 to 3000 parts by weight of a thermally conductive filler (c) having a thermal conductivity of 10 W/mK or more, wherein a total content of the copolymer (a) and the silicone resin (b) is 100 parts by weight.

Provided are a polymer film containing a polymer and a filler, in which the polymer film has a phase-separated structure including at least two phases, and all of the at least two phases have an elastic modulus of 0.01 GPa or more; and an application thereof.

Provided are a thermally conductive composition that exhibits high adhesive force to an adherend such as a heat-generating element or a heat-dissipating element after curing, and a thermally conductive member in which a cured product of the thermally conductive composition and the adherend are integrated with each other. The thermally conductive composition includes a mixture containing an addition-reaction-type silicone, a thermally conductive filler that includes a metal hydroxide in an amount of 80% by volume or more in terms of volume ratio, and an acryloyl-group-containing silane coupling agent. A thermally conductive member 21 includes a cured body 12 of the thermally conductive composition and an adherend 13 fixed to the cured body 12.

To provide a hexagonal boron nitride powder which contains agglomerates, has a maximum torque calculated by measuring in accordance with JIS-K-6217-4 of 0.20 to 0.50 Nm, a DBP absorption rate of 50 to 100 ml/100 g, a tap bulk density of 0.66 to 0.95 g/cm.sup.3 and reduced anisotropy of heat conduction and can provide high heat conductivity and dielectric strength to a resin composition produced by filling a resin therewith and a process for producing the powder by carrying out a reduction nitriding reaction using boron carbide.

An attachable self-resistance heating/super-hydrophobic integrated gradient film material. The film material is made of an adhesive resin, an electrically and thermally insulative resin, a thermally and electrically conductive filler, and a thermally conductive insulating filler. The adhesive resin and the electrically and thermally insulative resin respectively form an adhesive layer and a base body, and the two are bonded together. The thermally and electrically conductive filler and the thermally conductive insulating filler are respectively added to an intermediate layer and an upper layer of the base body, to divide the base body into three gradient regions from top to bottom, wherein a super-hydrophobic structure is constructed on the surface of the uppermost area.

In certain embodiments, the present disclosure relates to low emissivity films and articles comprising them. Other embodiments are directed to methods of reducing emissivity in an article comprising the use of low emissivity films. In some embodiments, the low emissivity films comprise a metal layer and a pair of layers, one comprising a metal oxide such as zinc tin oxide and the other layer comprising a silicon compound, adjacent each of the two sides of the metal layer. This type of assembly may serve various purposes, including being used as a sun control film. These constructions may be used, for example, as window films on glazing units for reducing transmission of infrared radiation across the film in both directions.

The present invention is a cured material of a thermal conductive silicone composition, the composition containing: 6 to 40 volume % of an organopolysiloxane as a component (A), and 60 to 94 volume % of a heat conductive filler as a component (B), the heat conductive filler containing; (B-i) unsintered crushed aluminum nitride having an average particle size of 40 μm or more and having 1 mass % or less of a fine powder with a particle size of 5 μm or less, and (B-ii) a heat conductive material other than the unsintered crushed aluminum nitride having an average particle size of 1 μm or more, where the component (B-ii) content is 30 to 65 volume %. This provides a cured material of a thermal conductive silicone composition excellent in handling properties and having a high thermal conductivity.