The present application provides a curable composition having appropriate viscosities and thixotropy before and after curing even if an excessive amount of filler is included and without any sedimentation phenomenon of particles even in long-term storage, wherein the curable composition comprises a polyolefin binder having an acid anhydride unit, a filler and a dispersant, and the dispersant comprise a polymer compound containing a unit of Formula 1 below:

##STR00001## wherein L.sub.1, L.sub.2, p and q are described herein.

A hot melt moisture cure adhesive composition that includes a polyurethane prepolymer that includes the reaction product of diisocyanate, a polyester triol first polyol, a crystalline polyester second polyol, and a third polyol different from the first and second polyols.

Described herein are polyamide polymers having improved glass transition temperatures (“Tg”) and relatively small values of Tm-Tg, where Tm is the melting temperature of the polyamide polymer. The polyamide polymers are semi-aromatic, semi-crystalline polyamide polymers that include recurring units formed the polycondensation of (1) a linear aliphatic diamine and a cycloaliphatic diamine with (2) an aromatic dicarboxylic acid. Due at least in part to the improved Tg, the polyamide polymers can be desirably incorporated into application settings including, but not limited to, mobile electronic devices, automotive, aerospace, building and construction, oil and gas, industrial, electrical and electronics, consumer goods, medical and healthcare. Furthermore, the polyamide polymers have relatively small values of Tm-Tg and, therefore, articles including the polyamide polymers can be more efficiently produced due to relatively small cycle times.

A method for manufacturing electrically conductive structures, preferably conductive pathway structures using laser beams on a non-conductive carrier (LDS method), wherein a non-conductive carrier material is provided which contains at least one inorganic metal phosphate compound and at least one stabiliser finely distributed or dissolved therein, the carrier material is irradiated in regions by laser beams generating the electrically conductive structures in the irradiated regions.

Disclosed is a one component, liquid, moisture curable polyurethane adhesive composition comprising the reaction products of a mixture including at least one polyol with an excess of one or more polyisocyanates and an acid component. The adhesive composition has enhanced bond strength to metals such as aluminum compared to currently available adhesives. The composition finds special use in panel lamination applications.

A polyphenylene sulfide resin composition exhibits excellent initial toughness and toughness after a long-term high temperature treatment typified by a tensile elongation at break after a dry heat treatment without impairing mechanical strength, chemical resistance and electrical insulation properties. The polyphenylene sulfide resin composition includes 0.01 to 10 parts by weight of an organosilane compound and 0.01 to 5 parts by weight of a metal salt of phosphorus oxoacid based on 100 parts by weight of a polyphenylene sulfide resin, and a tensile elongation at break, which is measured in accordance with ASTM-D638 under the conditions of a tensile speed of 10 mm/min and an ambient temperature of 23° C. after treating at 200° C. for 500 hours using an ASTM No. 4 dumbbell test piece obtained by injection molding the composition, is 10% or more.

A thermoplastic molding composition is disclosed. The thermoplastic molding composition includes A) from 20 to 96.9% by weight of a thermoplastic polyamide, B) from 1 to 20% by weight of an inorganic phosphinate salt, C) from 1 to 15% by weight of an organic phosphinate salt, D) from 1 to 15% by weight of melamine cyanurate, E) from 0.1 to 10% by weight of a polyvinylpyrrolidone homopolymer, and F) from 0 to 50% by weight of other additives. The total of the percentages by weight of A) to F) is 100%.

A method for manufacturing an electrical steel sheet product according to an exemplary embodiment of the present invention includes: preparing an adhesive coating composition; forming an adhesive coating layer by applying and then curing the adhesive coating composition onto a surface of an electrical steel sheet; forming a heat-fused layer by laminating and heat-fusing a plurality of electrical steel sheets on which the adhesive coating layers are formed; and cooling the heat-fused electrical steel sheets at a cooling rate of 0.05 to 20° C./min.

The present invention relates to a multilayer structure including a base (X) and a layer (Y), wherein the layer (Y) includes an aluminum-containing compound (A) and a phosphorus compound (BH) in which a phosphorus atom having at least one hydroxy group and a polar group are bonded via an alkylene chain having 3 to 20 carbon atoms or a polyoxyalkylene chain based on an alkylene having 3 to 20 carbon atoms, and the aluminum-containing compound (A) is a compound (Ab) including a reaction product (D) of an aluminum-containing metal oxide (Aa) and an inorganic phosphorus compound (BI).

A package with a coating composition deposited on at least a portion thereof is disclosed. The coating composition comprises: (a) a latex polymer comprising the emulsion polymerization product of (i) an emulsion monomer component comprising at least one ethylenically unsaturated monomer polymerized in the presence of (ii) a surfactant that is polymerizable with the at least one ethylenically unsaturated monomer.
Also disclosed is a method for applying the coating composition to the package.