Curable compositions, cured compositions, articles containing the curable or cured compositions, and methods of making the articles are provided. More particularly, the curable compositions contain a (meth)acrylate-based polymer having pendant (meth)acryloyl groups, at least one monomer having a single ethylenically unsaturated group, a photoinitiator that includes an acyl phosphine oxide, and a thixotropic agent. The curable compositions can be printed or dispensed, if desired, and the cured compositions are pressure-sensitive adhesives.

Disclosed are a resin composite having excellent soundproofing and mechanical properties, and a molded product including the same. The resin composite may include a resin composition, porous particles and a reinforcing material, and the molded product including the same include no volatile organic compounds (VOCs). As consequence, displeasure caused by generation of the VOCs and exhaust of toxic gas during combustion may be reduced thereby being environmentally friendly. Further, the resin composite and the molded product including the same demonstrate sufficient mechanical strength and may thus be directly applied to a housing or the like of an apparatus which generates noise without introduction of any additional soundproofing material. For example, the resin composite and the molded product may include a specific content of the porous particles having pores having a specific size to secure an appropriate volume fraction and may thus efficiently and economically block noise transmission.

Disclosed are a resin composite having excellent soundproofing and mechanical properties, and a molded product including the same. The resin composite may include a resin composition, porous particles and a reinforcing material, and the molded product including the same include no volatile organic compounds (VOCs). As consequence, displeasure caused by generation of the VOCs and exhaust of toxic gas during combustion may be reduced thereby being environmentally friendly. Further, the resin composite and the molded product including the same demonstrate sufficient mechanical strength and may thus be directly applied to a housing or the like of an apparatus which generates noise without introduction of any additional soundproofing material. For example, the resin composite and the molded product may include a specific content of the porous particles having pores having a specific size to secure an appropriate volume fraction and may thus efficiently and economically block noise transmission.

Provided are a thermosetting epoxy resin composition and a prepreg, laminated board and printed circuit board using the thermosetting epoxy resin composition. The thermosetting epoxy resin composition comprises the following components in parts by weight: 2-10 parts of a phosphorus-containing anhydride, 5-40 parts of a phosphorus-free anhydride, 5-45 parts of an epoxy resin, 40-70 parts of a filler, and 0-15 parts of a phosphorus-containing flame retardant, with the total part by weight of all these components being 100 parts, wherein the phosphorus-containing anhydride has a structure as represented by formula I or II, and the epoxy resin is selected from one of or a combination of at least two of a bisphenol A epoxy resin, a bisphenol F epoxy resin and a biphenyl epoxy resin. The thermosetting epoxy resin composition also has good heat resistance, discoloration resistance and dimensional stability after curing while ensuring V-0 grade flame resistance, and can be used for the preparation of printed circuit board substrates in the field of LEDs.

Provided are a thermosetting epoxy resin composition and a prepreg, laminated board and printed circuit board using the thermosetting epoxy resin composition. The thermosetting epoxy resin composition comprises the following components in parts by weight: 2-10 parts of a phosphorus-containing anhydride, 5-40 parts of a phosphorus-free anhydride, 5-45 parts of an epoxy resin, 40-70 parts of a filler, and 0-15 parts of a phosphorus-containing flame retardant, with the total part by weight of all these components being 100 parts, wherein the phosphorus-containing anhydride has a structure as represented by formula I or II, and the epoxy resin is selected from one of or a combination of at least two of a bisphenol A epoxy resin, a bisphenol F epoxy resin and a biphenyl epoxy resin. The thermosetting epoxy resin composition also has good heat resistance, discoloration resistance and dimensional stability after curing while ensuring V-0 grade flame resistance, and can be used for the preparation of printed circuit board substrates in the field of LEDs.

A sugar-based binder composition for manufacturing a composite product, notably a wood board, comprises at least one further particulate additive selected from the group consisting of:—particulate additive(s) having a BET specific surface area which is ≥50 m.sup.2/g;—amorphous silica particles;—fumed silica particles; and—untreated fumed silica particles.

A sugar-based binder composition for manufacturing a composite product, notably a wood board, comprises at least one further particulate additive selected from the group consisting of:—particulate additive(s) having a BET specific surface area which is ≥50 m.sup.2/g;—amorphous silica particles;—fumed silica particles; and—untreated fumed silica particles.

Provided is a novel polishing composition. The polishing composition comprises a water-soluble polymer that at least comprises a vinyl alcohol-based resin of which a 4% aqueous solution has a viscosity of 15 mPa.Math.s or more at 20° C.

The invention relates to a laminate comprising a first layer and a second layer directly covering the first layer, the first layer being a layer of a silicone rubber composition comprising a micrometric silicone powder and a mixture of crosslinkable organopolysiloxanes, the second layer being a layer of a silicone rubber composition comprising a hydrophobic silica and a mixture of crosslinkable organopolysiloxanes, the first layer and the second layer being crosslinked. The laminate, in particular when it is used as a coating for the outer surface of an expandable bladder for a tyre curing mould, makes it possible to eliminate moulding defects on the inner liner of the tyre.

The invention relates to a laminate comprising a first layer and a second layer directly covering the first layer, the first layer being a layer of a silicone rubber composition comprising a micrometric silicone powder and a mixture of crosslinkable organopolysiloxanes, the second layer being a layer of a silicone rubber composition comprising a hydrophobic silica and a mixture of crosslinkable organopolysiloxanes, the first layer and the second layer being crosslinked. The laminate, in particular when it is used as a coating for the outer surface of an expandable bladder for a tyre curing mould, makes it possible to eliminate moulding defects on the inner liner of the tyre.