An object of the present invention is to provide a surface-modified inorganic nitride having excellent dispersibility. Furthermore, another object of the present invention is to provide a composition, a thermally conductive material, and a device with a thermally conductive layer which contain the surface-modified inorganic nitride. The surface-modified inorganic nitride of the present invention includes an inorganic nitride, and a compound which is represented by General Formula (I) and is adsorbed onto a surface of the inorganic nitride. ##STR00001##

A resin composition includes 100 parts by weight of a fluorine-containing compound, which includes tetrafluoroethylene homopolymer, perfluoroalkoxy alkane polymer or a combination thereof; 2 parts by weight to 6 parts by weight of a butyral copolymer, which includes a unit of Formula (I), a unit of Formula (II) and a unit of Formula (III), wherein 1 is an integer of 40 to 250, m is an integer of 5 to 380, n is an integer of 55 to 2500, and wherein the butyral copolymer has a content of hydroxyl group of 21 mol % to 80 mol %; and 20 parts by weight to 150 parts by weight of an inorganic filler. The resin composition may achieve improvements in at least one of the following properties of the article made therefrom including dielectric constant, dissipation factor, X-axis coefficient of thermal expansion, weight loss percentage, tensile strength and comparative tracking index. ##STR00001##

An electron package includes an interface member between an electronic component and a thermal dissipation member. The interface member is highly efficient in transmitting thermal energy and/or suppressing electromagnetic radiation, with a particle filler dispersion including a combination of substantially spherical particles and substantially platelet-shaped particles within dispersion attribute ranges.

Provided is a composition comprising: (A) a silicone polymer of the Formula (I):

M.sup.1.sub.aM.sup.2.sub.bM.sup.3.sub.cD.sup.1.sub.dD.sup.2.sub.eD.sup.3.sub.fT.sup.1.sub.gT.sup.2.sub.hT.sup.3.sub.iQ.sub.j. wherein: M.sup.1=R.sup.1R.sup.2R.sup.3SiO.sub.1/2 M.sup.2=R.sup.4R.sup.5R.sup.6SiO.sub.1/2 M.sup.3=R.sup.7R.sup.8R.sup.9SiO.sub.1/2 D.sup.1=R.sup.10R.sup.11SiO.sub.2/2 D.sup.2=R.sup.12R.sup.13SiO.sub.2/2 D.sup.3=R.sup.14R.sup.15SiO.sub.2/2 T.sup.1=R.sup.16SiO.sub.3/2 T.sup.2=R.sup.17SiO.sub.3/2 T.sup.3=R.sup.18SiO.sub.3/2 Q=SiO.sub.4/2 where R.sup.1, R.sup.2, R.sup.3, R.sup.5, R.sup.6, R.sup.8, R.sup.9, R.sup.10, R.sup.11, R.sup.13, R.sup.15, R.sup.16 are independently chosen from a hydrogen, a C.sub.1-C.sub.60 aliphatic or aromatic group or C.sub.1-C.sub.60 alkoxy group; R.sup.4, R.sup.12, R.sup.17 are independently chosen from a C1-C10 alkyl, a C1-C10 alkoxy, or R.sup.19-A-R.sup.20 where A is chosen from a group comprising an unsaturated cyclic moiety chosen from an aromatic group, a fused aromatic group, an unsaturated alicyclic group, an unsaturated heterocyclic group, or a combination of two or more thereof; R.sup.19 is chosen from a H, a C1-C10 alkyl, allyl, vinyl, alkoxy, allyloxy, vinyloxy, acrylate, or methacrylate; and R.sup.20 is chosen from a divalent organic group; R.sup.7, R.sup.14, R.sup.18 are independently selected from hydrogen or OR.sup.22 or unsaturated monovalent radicals or radicals containing heteroatom such as oxygen, nitrogen, sulfur or radicals containing organosilane groups; and
the subscripts a, b, c, d, e, f, g, h, i, j are zero or positive subject to the following limitations: 2a+b+c+d+e+f+g+h+i+j1000, b+e+h>0 and c+f+i0 and
B) a thermally conductive filler.

Provided are methods of forming thermally conductive flexible bonds for use in electronic boards of unmanned spacecraft and other types of aircraft. Also provided are methods of preparing adhesive materials to form these bonds including methods of preparing treated filler particles. In some aspects, an adhesive material includes filler particles having organofunctional groups, such as boron nitride particles treated in silane. These particles may be combined with a urethane modified epoxy to form the adhesive material. The weight ratio of the particles in the adhesive material may be about 40-60%. The adhesive material may be thermally cured using a temperature of less than 110 C. to prevent damage to bonded electronic components. The cured adhesive may have a thermal conductivity of at least about 2 W/m K measured in vacuum and may have a glass transition temperature if less than 40 C.

A method of preparing a thermally conductive composite including: a) mixing 15% to 60% by weight of a polymer matrix with 0% to 85% by weight of a high-aspect-ratio thermally conductive filler having an aspect ratio of at least 5:1; and (b) mixing a polymer melt obtained from step (a) with 0% to 85% by weight of a low-aspect-ratio thermally conductive filler having an aspect ratio of 2:1 or less. By changing the weight ratio, the structure and mechanical properties of the low-aspect-ratio thermally conductive filler and the high-aspect-ratio thermally conductive filler, thermal conductivity anisotropy can be tuned. A thermally conductive composite having thermal conductivity anisotropy in the range from 1 to 4 is also disclosed.

Provided are methods of forming thermally conductive flexible bonds for use in electronic boards of unmanned spacecraft and other types of aircraft. Also provided are methods of preparing adhesive materials to form these bonds including methods of preparing treated filler particles. In some aspects, an adhesive material includes filler particles having organofunctional groups, such as boron nitride particles treated in silane. These particles may be combined with a urethane modified epoxy to form the adhesive material. The weight ratio of the particles in the adhesive material may be about 40-60%. The adhesive material may be thermally cured using a temperature of less than 110 C. to prevent damage to bonded electronic components. The cured adhesive may have a thermal conductivity of at least about 2 W/m K measured in vacuum and may have a glass transition temperature if less than 40 C.

A thermally conductive resin is provided. The thermally conductive resin has the formula ##STR00001##
In the formula, X.sub.1 is ##STR00002##
X.sub.2 is ##STR00003##
m is an integer ranging from 0 to 95, n is an integer ranging from 1 to 50, and o is an integer ranging from 1 to 80. A thermal interface material including the thermally conductive resin is also provided.

A thermally conductive resin is provided. The thermally conductive resin has the formula ##STR00001##
In the formula, X.sub.1 is ##STR00002##
X.sub.2 is ##STR00003##
m is an integer ranging from 0 to 95, n is an integer ranging from 1 to 50, and o is an integer ranging from 1 to 80. A thermal interface material including the thermally conductive resin is also provided.

A foam material includes the reaction product of a polyol mixture and an isocyanate mixture and a boron nitride filler in an amount of ?0.01 wt. % to ?0.1 wt. %. In various forms, the boron nitride filler is of nanoparticles, is of hexagonal boron nitride, and/or is treated with a silane coupling agent.