The present invention provides an acrylic damping adhesive. The acrylic damping adhesive comprises a crosslinked structure of a carboxy-containing acrylic polymer with a glass transition temperature less than or equal to −20° C. and a carboxy-containing acrylic polymer with a glass transition temperature ranging from 20° C. to 50° C. The acrylic damping adhesive according to technical solutions of the present invention exhibits double damping peaks in a rheological curve, and thus has a wider damping temperature range (the damping temperature range is greater than or equal to 50° C., and preferably greater than or equal to 90° C.), a higher frequency response of damping, and higher system stability.

There are provided self-healing elastomeric materials and compositions and skin-like materials for use in a wide range of applications, particularly medical training simulators and mannequins. The self-healing elastomeric material comprises polysiloxane or poly ether soft segments connected via carbonate, urethane and/or urea bonds. The self-healing elastomeric material is intrinsically and/or thermally self- healing. Reusable devices, apparatuses and articles comprising the elastomeric materials as skin-like materials are disclosed.

There are provided self-healing elastomeric materials and compositions and skin-like materials for use in a wide range of applications, particularly medical training simulators and mannequins. The self-healing elastomeric material comprises polysiloxane or poly ether soft segments connected via carbonate, urethane and/or urea bonds. The self-healing elastomeric material is intrinsically and/or thermally self- healing. Reusable devices, apparatuses and articles comprising the elastomeric materials as skin-like materials are disclosed.

Provided is a pressure-sensitive adhesive sheet capable of allowing a small electronic part (e.g., a chip having a size of 50 μm/□ or less) to be temporarily fixed in a satisfactory manner and satisfactorily peeled. The pressure-sensitive adhesive sheet of the present invention includes a gas-generating layer configured to generate a gas by being irradiated with laser light, wherein a modulus of elasticity Er(gas) [unit: MPa] of the gas-generating layer measured by a nanoindentation method and a thickness h(gas) [unit: μm] thereof satisfy the following expression (1):

Log(Er(gas)×10.sup.6)≥8.01×h(gas).sup.−0.116  (1).

In one embodiment, the pressure-sensitive adhesive sheet has a transmittance of from 0% to 35% for light having a wavelength of 360 nm. In one embodiment, the pressure-sensitive adhesive sheet has a transmittance of from 10% to 100% for light having a wavelength of 380 nm.

Provided is a pressure-sensitive adhesive sheet capable of allowing a small electronic part (e.g., a chip having a size of 50 μm/□ or less) to be temporarily fixed in a satisfactory manner and satisfactorily peeled. The pressure-sensitive adhesive sheet of the present invention includes a gas-generating layer configured to generate a gas by being irradiated with laser light, wherein a modulus of elasticity Er(gas) [unit: MPa] of the gas-generating layer measured by a nanoindentation method and a thickness h(gas) [unit: μm] thereof satisfy the following expression (1):

Log(Er(gas)×10.sup.6)≥8.01×h(gas).sup.−0.116  (1).

In one embodiment, the pressure-sensitive adhesive sheet has a transmittance of from 0% to 35% for light having a wavelength of 360 nm. In one embodiment, the pressure-sensitive adhesive sheet has a transmittance of from 10% to 100% for light having a wavelength of 380 nm.

The present disclosure provides an adhesive composition that contains a polyester resin (A), wherein the polyester resin (A) contains a structural unit derived from at least one compound (a1) selected from the group consisting of a dimer acid compound and a dimer diol, and a structural unit derived from an aromatic compound (a2).

The present disclosure provides an adhesive composition that contains a polyester resin (A), wherein the polyester resin (A) contains a structural unit derived from at least one compound (a1) selected from the group consisting of a dimer acid compound and a dimer diol, and a structural unit derived from an aromatic compound (a2).

The present disclosure provides an adhesive composition that contains a polyester resin (A), wherein the polyester resin (A) contains a structural unit derived from at least one compound (a1) selected from the group consisting of a dimer acid compound and a dimer diol, and a structural unit derived from an aromatic compound (a2).

An electrophotographic photosensitive member includes: a conductive support; a charge generation layer disposed on the conductive support, the charge generation layer including a charge generating material and a vinyl copolymer, the vinyl copolymer including a structural unit including a chlorine atom, a structural unit including an acyloxy group, and a structural unit including an aromatic polycarboxylic acid structure, a proportion of the structural unit including a chlorine atom to all the structural units being 80% by mass or more, a proportion of the structural unit including an aromatic polycarboxylic acid structure to all the structural units being 0.5% by mass or more; and a charge transport layer disposed on the charge generation layer, the charge transport layer including a charge transporting material and a binder resin.

Adhesives comprising rubber, tackifier, oil, and optionally absorbent and active ingredient are described. The adhesives are suitable for medical applications as they are repositionable on skin. Also described are medical articles using the adhesives.