A composition exhibits excellent heat resistance and mounting reliability when bonding a semiconductor power element to a metal lead frame, which is also free of lead and thereby places little burden on the environment. An electrically conductive composition contains at least a sulfide compound represented by R—S—R′ (wherein R is an organic group containing at least carbon; R′ is an organic group that is the same as or different from R; and R and R′ may be bonded to each other to form a so-called cyclic sulfide) and metal particles containing at least Cu, Sn or Ni as its essential component. Further, a conductive paste and a conductive bonding film each are produced using the electrically conductive composition. A dicing die bonding film is obtained by bonding the conductive bonding film with an adhesive tape.

A composition exhibits excellent heat resistance and mounting reliability when bonding a semiconductor power element to a metal lead frame, which is also free of lead and thereby places little burden on the environment. An electrically conductive composition contains at least a sulfide compound represented by R—S—R′ (wherein R is an organic group containing at least carbon; R′ is an organic group that is the same as or different from R; and R and R′ may be bonded to each other to form a so-called cyclic sulfide) and metal particles containing at least Cu, Sn or Ni as its essential component. Further, a conductive paste and a conductive bonding film each are produced using the electrically conductive composition. A dicing die bonding film is obtained by bonding the conductive bonding film with an adhesive tape.

A composition exhibits excellent heat resistance and mounting reliability when bonding a semiconductor power element to a metal lead frame, which is also free of lead and thereby places little burden on the environment. An electrically conductive composition contains at least a sulfide compound represented by R—S—R′ (wherein R is an organic group containing at least carbon; R′ is an organic group that is the same as or different from R; and R and R′ may be bonded to each other to form a so-called cyclic sulfide) and metal particles containing at least Cu, Sn or Ni as its essential component. Further, a conductive paste and a conductive bonding film each are produced using the electrically conductive composition. A dicing die bonding film is obtained by bonding the conductive bonding film with an adhesive tape.

Provided are a powdery diacetal clarifying agent and a method of preparing the same. The powdery diacetal clarifying agent comprises a diacetal compound and an inorganic silicon-containing compound having a pH value equal to or more than 6 and equal to or less than 12. The powdery diacetal clarifying agent of the composition can have excellent flowability, dispersability, thermal resistance, and color stability. Accordingly, the powdery diacetal clarifying agent does not release stinking odor and incur yellowing at high temperature, allowing the plastic articles to have improved appearance and visual appeal.

Provided are a powdery diacetal clarifying agent and a method of preparing the same. The powdery diacetal clarifying agent comprises a diacetal compound and an inorganic silicon-containing compound having a pH value equal to or more than 6 and equal to or less than 12. The powdery diacetal clarifying agent of the composition can have excellent flowability, dispersability, thermal resistance, and color stability. Accordingly, the powdery diacetal clarifying agent does not release stinking odor and incur yellowing at high temperature, allowing the plastic articles to have improved appearance and visual appeal.

The present invention provides compounds of formula ##STR00001##
a process for their preparation, a solution comprising these compounds, a process for the preparation of a device using the solution, devices obtainable by the process and the use of the bis-azide-type compounds as cross-linkers.

The present invention provides compounds of formula ##STR00001##
a process for their preparation, a solution comprising these compounds, a process for the preparation of a device using the solution, devices obtainable by the process and the use of the bis-azide-type compounds as cross-linkers.

Provided herein is a method of making a clear or translucent object by additive manufacturing, comprising (a) providing a clear or translucent light polymerizable resin, the resin comprising: (i) light-polymerizable monomers, prepolymers, or a combination thereof; (ii) a photoinitiator; and (iii) a polysubstituted linear polyacene ultraviolet light absorbing compound which compound is polysubstituted with bromo, chloro, —Se—R′, —S—R′ or combinations thereof, where each R′ is independently selected from alkyl, aryl, and arylalkyl; and then (b) producing by stereolithography with ultraviolet light a clear or translucent object from said light polymerizable resin.

Provided herein is a method of making a clear or translucent object by additive manufacturing, comprising (a) providing a clear or translucent light polymerizable resin, the resin comprising: (i) light-polymerizable monomers, prepolymers, or a combination thereof; (ii) a photoinitiator; and (iii) a polysubstituted linear polyacene ultraviolet light absorbing compound which compound is polysubstituted with bromo, chloro, —Se—R′, —S—R′ or combinations thereof, where each R′ is independently selected from alkyl, aryl, and arylalkyl; and then (b) producing by stereolithography with ultraviolet light a clear or translucent object from said light polymerizable resin.

A composite material made of an amorphous (bi)metal sulfide nanoparticles directly linked, through coordinate covalent bonds, to a sulfur-containing polymer and a method of preparation of the composite material. The composite material can also be used as a catalyst for hydrogen production. Finally, a proton-exchange membrane (PEM) electrolyser and a photoelectrochemical cell, can both including the composite material.