A method of producing a sealed structure, the method including: preparing a substrate and a curable resin composition in a liquid form; and sealing the substrate with the curable resin composition, to form a sealed body including the substrate and a cured product of the curable resin composition. The sealing step includes: printing the curable resin composition onto the substrate, to cover the substrate with a first coating film of the curable resin composition; and compression-molding the first coating film and the substrate together using a mold, with a pressing surface of the mold abut against the first coating film, to convert the first coating film into a second coating film. A ratio of a projected area S1 of the first coating film onto the substrate to a projected area S2 of the second coating film onto the substrate: S1/S2 is 0.9 or more.

A method of producing a sealed structure, the method including: preparing a substrate and a curable resin composition in a liquid form; and sealing the substrate with the curable resin composition, to form a sealed body including the substrate and a cured product of the curable resin composition. The sealing step includes: printing the curable resin composition onto the substrate, to cover the substrate with a first coating film of the curable resin composition; and compression-molding the first coating film and the substrate together using a mold, with a pressing surface of the mold abut against the first coating film, to convert the first coating film into a second coating film. A ratio of a projected area S1 of the first coating film onto the substrate to a projected area S2 of the second coating film onto the substrate: S1/S2 is 0.9 or more.

A light-emitting device according to an embodiment is provided with: a light-emitting panel including a first board that is light transmissive and flexible, a plurality of conductor patterns formed on a surface of the first board, a plurality of light-emitting elements connected to one of the conductor patterns, and a second board that is light transmissive and flexible and that holds the light-emitting elements relative to the first board; and a flexible wiring board including a circuit pattern that is electrically connected via an anisotropic conductive layer to an exposed part of the conductor patterns formed on the first board, the exposed part being exposed by the end of the second board.

An alumina powder containing alumina particles, wherein among the alumina particles, an average sphericity of an alumina particle having a projected area equivalent circle diameter of 50 nm or more as determined by microscopy is 0.80 or more, a content ratio of an alumina particle having a particle diameter of 75 μm or more is 0.05% by mass or less, an average particle diameter of the alumina powder is 0.2 μm or more and 15 μm or less, the average particle diameter is a particle diameter measured using a laser light diffraction scattering particle size distribution analyzer, and an amount of water included in the alumina powder measured by a specific measurement method is 30 ppm or more and 500 ppm or less.

An alumina powder containing alumina particles, wherein among the alumina particles, an average sphericity of an alumina particle having a projected area equivalent circle diameter of 50 nm or more as determined by microscopy is 0.80 or more, a content ratio of an alumina particle having a particle diameter of 75 μm or more is 0.05% by mass or less, an average particle diameter of the alumina powder is 0.2 μm or more and 15 μm or less, the average particle diameter is a particle diameter measured using a laser light diffraction scattering particle size distribution analyzer, and an amount of water included in the alumina powder measured by a specific measurement method is 30 ppm or more and 500 ppm or less.

A thermoplastic composition includes a thermoplastic polymer and electrically conductive particles dispersed in the thermoplastic polymer.

A thermoplastic composition includes a thermoplastic polymer and electrically conductive particles dispersed in the thermoplastic polymer.

An electrically conductive paste includes: an elastic binder; and a conductive filler. The conductive filler includes: at least one spherical conductive filler, at least one plate-like conductive filler, and at least one rod-like conductive filler. In an embodiment, the spherical filler has a mean particle diameter, measured in accordance with ISO 21501-2:2019-11 of at most 200 μm.

A kind of plastic is provided. With a total of 100 parts by weight, the plastic includes the following components in parts by weight: 25 to 90 parts of matrix resin; 1 to 60 parts of laser reflecting agent; and 0 to 70 parts of inorganic filler, where the inorganic filler is capable of being chemically corroded. When the matrix resin includes a resin component capable of being chemically corroded, parts by weight of the inorganic filler are greater than or equal to 0 parts; or when the matrix resin is fully a resin component incapable of being chemically corroded, parts by weight of the inorganic filler are greater than 0 parts. For the plastic, a low roughness surface can be obtained through chemical roughening, to form a desirable coating binding surface, and help implement metallization.

Compounds having an elastomer material, a filler material, at least one additive material, and at least one accelerant material are disclosed. In various embodiments, the filler material comprises a graphene-based carbon material. In various embodiments, the graphene-based carbon material comprises graphene comprising up to 15 layers, carbon aggregates having a median size from 1 to 50 microns, a surface area of the carbon aggregates at least 50 m.sup.2/g, when measured via a Brunauer-Emmett-Teller (BET) method with nitrogen as the adsorbate, and no seed particles.