A thermally-conductive structural adhesive for new energy power batteries, including: composition A including 3.3-14 wt. % of a block polymerized telechelic carboxyl compound and/or a block polymerized telechelic amino compound; 0.1-1.0 wt. % of a coupling agent and/or a modifier; 0-1.6 wt. % of curing accelerator; 84-92 wt. % of a thermally-conductive powder; and 0.3-3.0 wt. % of a flame retardant agent; and composition B including 3.3-14 wt. % of a block polymerized telechelic isocyanate compound and/or a block polymerized telechelic epoxy compound; 0-1.0 wt. % of a coupling agent and/or a modifier; 0-1.6 wt. % of a curing accelerator; 84-92 wt. % of a thermally-conductive powder; and 0.3-3 wt. % of a flame retardant agent. The composition A and the composition B are mixed evenly in a weight or volume ratio of 1:(0.25-2) and cured to obtain the thermally-conductive structural adhesive. A preparation of the thermally-conductive structural adhesive is also provided.

A thermally-conductive structural adhesive for new energy power batteries, including: composition A including 3.3-14 wt. % of a block polymerized telechelic carboxyl compound and/or a block polymerized telechelic amino compound; 0.1-1.0 wt. % of a coupling agent and/or a modifier; 0-1.6 wt. % of curing accelerator; 84-92 wt. % of a thermally-conductive powder; and 0.3-3.0 wt. % of a flame retardant agent; and composition B including 3.3-14 wt. % of a block polymerized telechelic isocyanate compound and/or a block polymerized telechelic epoxy compound; 0-1.0 wt. % of a coupling agent and/or a modifier; 0-1.6 wt. % of a curing accelerator; 84-92 wt. % of a thermally-conductive powder; and 0.3-3 wt. % of a flame retardant agent. The composition A and the composition B are mixed evenly in a weight or volume ratio of 1:(0.25-2) and cured to obtain the thermally-conductive structural adhesive. A preparation of the thermally-conductive structural adhesive is also provided.

A segmented diving suit includes a base layer and a plurality of composite plates arranged on the base layer in a configuration designed to avoid joints or other anatomical features that bend. The composite plates include a spheres or microspheres dispersed/embedded in a carrier polymer. The spheres or microspheres provide one or more of thermal protection, sonic/blast resistance, and ballistic protection.

A segmented diving suit includes a base layer and a plurality of composite plates arranged on the base layer in a configuration designed to avoid joints or other anatomical features that bend. The composite plates include a spheres or microspheres dispersed/embedded in a carrier polymer. The spheres or microspheres provide one or more of thermal protection, sonic/blast resistance, and ballistic protection.

A segmented diving suit includes a base layer and a plurality of composite plates arranged on the base layer in a configuration designed to avoid joints or other anatomical features that bend. The composite plates include a spheres or microspheres dispersed/embedded in a carrier polymer. The spheres or microspheres provide one or more of thermal protection, sonic/blast resistance, and ballistic protection.

An organopolysiloxane is provided. The organopolysiloxane is represented by a general formula.

In the general formula, R.sup.1 are the same or different aliphatic unsaturated monovalent hydrocarbon groups having 2 to 12 carbon atoms, R.sup.2s are the same or different monovalent hydrocarbon groups having 1 to 12 carbon atoms and not having an aliphatic unsaturated bond, R.sup.3s are the same or different alkyl groups having 1 to 3 carbon atoms, “n” is an integer of from 1 and 500, and “a” is 0 or 1. A thermally conductive silicone composition having the organopolysiloxane as a component is also provided. The organopolysiloxane can be used as a surface treatment agent for a thermally conductive filler. The organopolysiloxane provides for favorable handling/workability of compositions even if such compositions are highly loaded with a thermally conductive filler.

An organopolysiloxane is provided. The organopolysiloxane is represented by a general formula.

In the general formula, R.sup.1 are the same or different aliphatic unsaturated monovalent hydrocarbon groups having 2 to 12 carbon atoms, R.sup.2s are the same or different monovalent hydrocarbon groups having 1 to 12 carbon atoms and not having an aliphatic unsaturated bond, R.sup.3s are the same or different alkyl groups having 1 to 3 carbon atoms, “n” is an integer of from 1 and 500, and “a” is 0 or 1. A thermally conductive silicone composition having the organopolysiloxane as a component is also provided. The organopolysiloxane can be used as a surface treatment agent for a thermally conductive filler. The organopolysiloxane provides for favorable handling/workability of compositions even if such compositions are highly loaded with a thermally conductive filler.

A thermally-conductive silicone gel composition of the present invention contains A to D components below. A: a linear organopolysiloxane having one vinyl group at each terminal end of a molecular chain and a kinematic viscosity of 1 to 600 mm.sup.2/s, B: a linear organopolysiloxane having three or more Si—H groups in one molecule and an Si—H group content of 0.05 to 6 mol/kg, in an amount such that a ratio of the number of Si—H groups in B component to the number of vinyl groups in A component is 0.2 to 0.5, C: a platinum catalyst in a catalytic amount, and D: a thermally-conductive filler in an amount of 300 to 1000 parts by mass when a total amount of A and B is taken as 100 parts by mass.

A thermally-conductive silicone gel composition of the present invention contains A to D components below. A: a linear organopolysiloxane having one vinyl group at each terminal end of a molecular chain and a kinematic viscosity of 1 to 600 mm.sup.2/s, B: a linear organopolysiloxane having three or more Si—H groups in one molecule and an Si—H group content of 0.05 to 6 mol/kg, in an amount such that a ratio of the number of Si—H groups in B component to the number of vinyl groups in A component is 0.2 to 0.5, C: a platinum catalyst in a catalytic amount, and D: a thermally-conductive filler in an amount of 300 to 1000 parts by mass when a total amount of A and B is taken as 100 parts by mass.

This highly thermally-conductive silicone composition is obtained by blending, as thermally-conductive fillers at a specific ratio and in specific amounts in (A) a silicone composition containing an organopolysiloxane as a main agent, (B) a spherical magnesium oxide powder having an average sphericity of 0.8 or more, an average particle size of 80-150 μm, and a purity of 98 mass % or more, and (C) (C-I) a spherical aluminum oxide powder which has an average sphericity of 0.8 or more and an average particle size of 7-60 μm, and in which the proportion of rough particles of 96-150 μm is 0.1-30 mass % in the entire component (C-I) in a laser diffraction particle size distribution, and (C-II) a spherical or irregularly-shaped aluminum oxide powder having an average particle size of 0.1-4 μm. The thermal conductivity of the composition is 7.0 W/m.Math.K or more, and the viscosity of the composition at 25° C. is 30-800 Pa.Math.s. This highly thermally-conductive silicone composition has excellent electrical insulating properties and thermal conductivity.