A present invention related to a method for manufacturing a dot bonding shoe insole using an adhesive resin containing hydrophobic nano-silica, including: melting adhesive resin made of any one selected from thermoplastic polyurethane (TPU) or ethylene vinyl acetate (EVA) containing hydrophobic nano-silica in the range of 0.2 to 5 phr and applying to the surface of the transfer roller in which the intaglio dot pattern is formed in a mesh shape in the shape of the shoe insole;

removing the adhesive resin applied other area than the intaglio dot pattern of the surface of the transfer roller;
transferring the adhesive resin applied to the intaglio dot pattern of the surface of the transfer roller to either one of the foam or the fabric;
bonding the foam and the fabric by compressing; and
cutting a shoe insole shape in a package in which the foam and the fabric are bonded.

A present invention related to a method for manufacturing a dot bonding shoe insole using an adhesive resin containing hydrophobic nano-silica, including: melting adhesive resin made of any one selected from thermoplastic polyurethane (TPU) or ethylene vinyl acetate (EVA) containing hydrophobic nano-silica in the range of 0.2 to 5 phr and applying to the surface of the transfer roller in which the intaglio dot pattern is formed in a mesh shape in the shape of the shoe insole;

removing the adhesive resin applied other area than the intaglio dot pattern of the surface of the transfer roller;
transferring the adhesive resin applied to the intaglio dot pattern of the surface of the transfer roller to either one of the foam or the fabric;
bonding the foam and the fabric by compressing; and
cutting a shoe insole shape in a package in which the foam and the fabric are bonded.

A composition formed from a calcium or magnesium carbonate-including material and a surface-treatment composition including at least one cross-linkable compound, a dry process for the preparation of such a composition, a curable elastomer mixture comprising an elastomer resin and the composition, a cured elastomer product formed from the curable elastomer mixture, a process for preparing the cured elastomer product, the use of at least one cross-linkable compound including at least two functional groups, wherein at least one functional group is suitable for cross-linking an elastomer resin and wherein at least one functional group is suitable for reacting with the calcium or magnesium carbonate-including material in the compounding of an elastomer formed from an elastomer resin and at least one calcium or magnesium carbonate-comprising material as filler as well as an article formed from the cured elastomer product.

A curable particulate silicone composition is disclosed. The composition comprises: (A) hot-melt silicone fine particles having a specific reactive functional group; (B) an inorganic filler; and (C) a curing agent. The content of component (B) is in the range of from 87 to 95 vol. % of the total composition. The curable particulate silicone composition provides a cured product having an average linear expansion coefficient of not greater than 15 ppm/° C. in a range of from 25° C. to 200° C. The curable particulate silicone composition provides a cured product having a very low average linear expansion coefficient over a wide temperature range when cured and is particularly suitable for overmold molding and the like.

A curable particulate silicone composition is disclosed. The composition comprises: (A) hot-melt silicone fine particles having a specific reactive functional group; (B) an inorganic filler; and (C) a curing agent. The content of component (B) is in the range of from 87 to 95 vol. % of the total composition. The curable particulate silicone composition provides a cured product having an average linear expansion coefficient of not greater than 15 ppm/° C. in a range of from 25° C. to 200° C. The curable particulate silicone composition provides a cured product having a very low average linear expansion coefficient over a wide temperature range when cured and is particularly suitable for overmold molding and the like.

A resin composition includes a prepolymer and an additive, wherein: the prepolymer is prepared from a mixture subjected to a prepolymerization reaction, and the mixture includes 100 parts by weight of a maleimide resin, 15 to 30 parts by weight of a siloxane compound and 4 to 16 parts by weight of a diamine compound; the maleimide resin includes bisphenol A diphenyl ether bismaleimide, 3,3′-dimethyl-5,5′-diethyl-4,4′-diphenylmethane bismaleimide or a combination thereof; the siloxane compound includes a compound of Formula (I), wherein n is an integer of 5 to 40; and the diamine compound includes a compound of Formula (II) or Formula (III). The resin composition is made by using a preparation method. The resin composition may be used to make various articles, such as a prepreg, a resin film, a laminate or a printed circuit board. ##STR00001##

A resin composition includes a prepolymer and an additive, wherein: the prepolymer is prepared from a mixture subjected to a prepolymerization reaction, and the mixture includes 100 parts by weight of a maleimide resin, 15 to 30 parts by weight of a siloxane compound and 4 to 16 parts by weight of a diamine compound; the maleimide resin includes bisphenol A diphenyl ether bismaleimide, 3,3′-dimethyl-5,5′-diethyl-4,4′-diphenylmethane bismaleimide or a combination thereof; the siloxane compound includes a compound of Formula (I), wherein n is an integer of 5 to 40; and the diamine compound includes a compound of Formula (II) or Formula (III). The resin composition is made by using a preparation method. The resin composition may be used to make various articles, such as a prepreg, a resin film, a laminate or a printed circuit board. ##STR00001##

The present invention relates to a water-based coating composition, the preparation and use of the composition, a two-component coating system comprising the composition and use thereof, and an article obtained by coating with the composition or the two-component coating system. The water-based coating composition comprises a water-based UV resin; a silane-treated nanosized silicon oxide compound; and a photoinitiator; wherein per kilogram of the solid constituent of the water-based UV resin contains not less than 3 mol of ethylenically unsaturated groups, and wherein the weight ratio of the solid constituent of the nanosized silicon oxide compound to the solid constituent of the water-based UV resin is 11:20 to 73:100. The coating layer formed by the water-based coating composition of the present invention has high hardness and good adhesion, and is particularly suitable for electronic, electrical and communication equipment in the 5G field.

The present invention relates to a water-based coating composition, the preparation and use of the composition, a two-component coating system comprising the composition and use thereof, and an article obtained by coating with the composition or the two-component coating system. The water-based coating composition comprises a water-based UV resin; a silane-treated nanosized silicon oxide compound; and a photoinitiator; wherein per kilogram of the solid constituent of the water-based UV resin contains not less than 3 mol of ethylenically unsaturated groups, and wherein the weight ratio of the solid constituent of the nanosized silicon oxide compound to the solid constituent of the water-based UV resin is 11:20 to 73:100. The coating layer formed by the water-based coating composition of the present invention has high hardness and good adhesion, and is particularly suitable for electronic, electrical and communication equipment in the 5G field.

A thermally conductive addition-curable silicone composition includes: a heat-treated mixture including (A) an organopolysiloxane having at least two alkenyl groups bonded to a silicon atom in one molecule, (B) an organohydrogenpolysiloxane having at least three hydrogen atoms bonded to a silicon atom in one molecule, and (C) aluminum oxide; (D) an organohydrogenpolysiloxane having at least two hydrogen atoms bonded to a silicon atom in one molecule; (E) a platinum-based metal catalyst; and (F) a cation-exchange type and/or both-ions-exchange type ion trap agent. A thermally conductive addition-curable silicone composition can be applied on electric and electronic components and in a module including a circuit substrate mounting these components thereon and can exhibit excellent stress relaxation property and thermal conductivity after cured. In addition, a method for producing the same.