Patent classifications
C08K9/06
THERMALLY CONDUCTIVE ADDITION-CURABLE SILICONE COMPOSITION AND METHOD FOR PRODUCING THE SAME
A thermally conductive addition-curable silicone composition includes: a heat-treated mixture including (A) an organopolysiloxane having at least two alkenyl groups bonded to a silicon atom in one molecule, (B) an organohydrogenpolysiloxane having at least three hydrogen atoms bonded to a silicon atom in one molecule, and (C) aluminum oxide; (D) an organohydrogenpolysiloxane having at least two hydrogen atoms bonded to a silicon atom in one molecule; (E) a platinum-based metal catalyst; and (F) a cation-exchange type and/or both-ions-exchange type ion trap agent. A thermally conductive addition-curable silicone composition can be applied on electric and electronic components and in a module including a circuit substrate mounting these components thereon and can exhibit excellent stress relaxation property and thermal conductivity after cured. In addition, a method for producing the same.
Multicomponent-curable thermally-conductive silicone gel composition, thermally-conductive member and heat dissipation structure
Provided is: a multicomponent curable thermally conductive silicone gel composition which has a high thermal conductivity, has excellent gap-filling ability and repairability, and has superior storage stability; a thermally conductive member comprising the composition; and a heat dissipating structure using the same. The thermally conductive silicone gel composition comprises: (A) an alkenyl group-containing organopolysiloxane; (B) an organohydrogenpolysiloxane; (C) a catalyst for hydrosilylation reaction; (D) a thermally conductive filler; (E) a silane-coupling agent or a hydrolysis condensation product thereof; and (F) a specific organopolysiloxane having a hydrolyzable silyl group at one end thereof. The thermally conductive silicone gel composition includes (I) a liquid composition that includes components (A), (C), (D), (E), and (F), but does not include component (B) and (II) a liquid composition that includes components (B), (D), (E), and (F), but does not include component (C) which are individually stored.
Footwear and rubber sole containing dual silica moieties
The invention relates to footwear with a rubber sole and to such rubber sole where the sole is provided with a rubber composition which contains dual precipitated silica moieties. The dual precipitated silica moieties are provided in a sense of being comprised of hydrophilic precipitated silica and hydrophobic precipitated silica.
Footwear and rubber sole containing dual silica moieties
The invention relates to footwear with a rubber sole and to such rubber sole where the sole is provided with a rubber composition which contains dual precipitated silica moieties. The dual precipitated silica moieties are provided in a sense of being comprised of hydrophilic precipitated silica and hydrophobic precipitated silica.
Footwear and rubber sole containing dual silica moieties
The invention relates to footwear with a rubber sole and to such rubber sole where the sole is provided with a rubber composition which contains dual precipitated silica moieties. The dual precipitated silica moieties are provided in a sense of being comprised of hydrophilic precipitated silica and hydrophobic precipitated silica.
Modified silicon particles for silicon-carbon composite electrodes
Methods of forming a composite material film can include providing a mixture comprising a precursor and silane-treated silicon particles. The methods can also include pyrolysing the mixture to convert the precursor into one or more carbon phases to form the composite material film with the silicon particles distributed throughout the composite material film.
Modified silicon particles for silicon-carbon composite electrodes
Methods of forming a composite material film can include providing a mixture comprising a precursor and silane-treated silicon particles. The methods can also include pyrolysing the mixture to convert the precursor into one or more carbon phases to form the composite material film with the silicon particles distributed throughout the composite material film.
Dispersion liquid, composition, sealing member, light-emitting device, illumination tool, display device, and method for producing light-emitting device
Provided is a dispersion liquid for sealing a light-emitting element containing metal oxide particles having a refractive index of 1.7 or higher and a surface-modifying material at least partially attached to the metal oxide particles, in which a particle diameter D50 of the metal oxide particles when a cumulative percentage of a scattering intensity distribution obtained by a dynamic light scattering method is 50% is 30 nm or more and 100 nm or less, and a content of the surface-modifying material not attached to the metal oxide particles is 60% by mass or less with respect to a total content of the metal oxide particles and the surface-modifying material.
Dispersion liquid, composition, sealing member, light-emitting device, illumination tool, display device, and method for producing light-emitting device
Provided is a dispersion liquid for sealing a light-emitting element containing metal oxide particles having a refractive index of 1.7 or higher and a surface-modifying material at least partially attached to the metal oxide particles, in which a particle diameter D50 of the metal oxide particles when a cumulative percentage of a scattering intensity distribution obtained by a dynamic light scattering method is 50% is 30 nm or more and 100 nm or less, and a content of the surface-modifying material not attached to the metal oxide particles is 60% by mass or less with respect to a total content of the metal oxide particles and the surface-modifying material.
Resin composition, method for producing three-dimensional molding using same, and three-dimensional molding
Provided is a resin composition from which a three-dimensional molding can be produced at an appropriate speed and with high dimensional accuracy, wherein the obtained three-dimensional molding has high strength. This resin composition is used in a method for producing a three-dimensional molding composed of a cured product of a liquid resin composition by selectively irradiating the liquid resin composition with active energy rays. The resin composition includes at least: a first polymerizable compound, in a liquid state at room temperature, having radical polymerizability; a second polymerizable compound, in a liquid state at room temperature, having no radical polymerizability; and a filler, wherein the surface of the filler is covered with the second polymerizable compound.