Provided are a thermoplastic resin composition and a molded product manufactured therefrom, the thermoplastic resin composition including, based on 100 parts by weight of a base resin including (A) 75 to 85 wt % of a polycarbonate resin; (B) 7 to 15 wt % of an acrylic rubber-modified aromatic vinyl graft copolymer; and (C) 7 to 13 wt % of an aromatic vinyl-vinyl cyanide copolymer; (D) 0.7 to 5 parts by weight of zinc oxide (ZnO); and (E) 0.2 to 0.6 parts by weight of a phosphorus-based compound represented by Chemical Formula 1.

(RO).sub.nP(═O)(OH).sub.3-n  [Chemical Formula 1]

In Chemical Formula 1, n is an integer of 1 to 3, and R is selected from a substituted or unsubstituted C1 to C30 alkyl group, a C2 to C30 alkenyl group, a C2 to C30 alkynyl group, a substituted or unsubstituted C1 to C30 and a substituted or unsubstituted C3 to C30 heteroaryl group.

Provided are: a ferrite powder whereby, when the ferrite powder is applied in a composite material, dropping out of ferrite particles is suppressed without moldability and filling ability being compromised; a ferrite resin composite material; and an electromagnetic shielding material, an electronic material, or an electronic component. This ferrite powder includes at least spherical or polyhedral ferrite particles in which a step structure is provided on surfaces thereof, the step structure having a polyhedral outline in the surfaces of the ferrite particles.

To provide an epoxy resin composition capable of forming a polished surface with high flatness when polished after curing, and a method for producing an electronic component mounting structure having a polished surface with high flatness, the polished surface obtained by polishing the surface of an encapsulation body. Disclosed are an epoxy resin composition, an electronic component mounting structure including the epoxy resin composition, and a method for producing the electronic component mounting structure, wherein: the epoxy resin composition includes a fused silica possibly containing hollow particles, and a curing agent; on a polished surface obtained by polishing a cured product of the epoxy resin composition, the number of pores having a diameter of more than 5 μm observed within a 25-mm.sup.2 area is one or less, the pores derived from cross sections of the hollow particles; and the polished surface is coated with a coating material.

The present invention provides a resin composition having high heat-resisting properties, with which a shaping can be performed in accordance with designed sizes using a fused deposition modeling method-3D printer, and from which a shaped object having a small warpage and small changes in sizes due to water can be obtained. The present invention relates to a resin composition for a shaping material of a fused deposition modeling method-3D printer, comprising cellulose fibers in a polyamide.

Coating compositions comprising a polymer binder and a sphere selected from porous metal oxide spheres formed from metal oxide particles and having, e.g., an average porosity of from 0.10 to 0.90; polymer spheres formed from a multimodal distribution of polymer particles; or mixtures thereof, are described herein. The sphere enhances the reflective characteristics of the coating compositions with respect to electromagnetic radiation. In particular, the coating compositions when dried, can exhibit UV reflectance, visible light reflectance, IR reflectance, or a combination thereof.

Provided is a sheet-like prepreg that has both a low coefficient of linear thermal expansion and high flexibility and offers excellent anti-warpage performance and cracking resistance. The sheet-like prepreg according to the present invention includes a curable composition and a sheet-like porous support impregnated with the curable composition. The sheet-like porous support is made from a material having a coefficient of linear thermal expansion of 10 ppm/K or less. The sheet-like prepreg gives a cured product having a glass transition temperature of −60° C. to 100° C. The curable composition includes one or more curable compounds (A) and at least one of a curing agent (B) and a curing catalyst (C). The curable compounds (A) include an epoxide having a weight per epoxy equivalent of 140 to 3000 g/eq in an amount of 50 weight percent or more of the totality of the curable compounds (A).

The present invention provides a slurry composition in which magnetic material powder has excellent dispersibility and excellent dispersion stability and which enables production of a sheet having high surface smoothness and high adhesiveness to substrates. Provided is a slurry composition containing: a polyvinyl acetal resin; magnetic material powder; and a Na ion, the slurry composition having a Na ion content of 1,000 to 3,000 μg/g relative to the polyvinyl acetal resin.

A polypropylene resin composition according to the present invention contains 1 to 41 parts by mass of fibrous basic magnesium sulfate, 50 to 98 parts by mass of a propylene polymer, 0.02 to 1.6 parts by mass of a lubricant, and less than 0.5 times the amount of the basic magnesium sulfate and 0.1 to 20 parts by mass of an acid-modified elastomer.

A method, a device, and a composition are disclosed. The method includes providing a polyol blend that includes a polyol resin and an electromagnetic (EMA) additive, providing an isocyanate resin selected such that blending the isocyanate resin with the polyol blend results in an EMA spray foam. The device includes a first compartment containing an isocyanate resin and a second compartment containing a polyol blend, which includes a polyol resin and an EMA additive. The composition includes a polyurethane spray foam and an EMA additive blended into the polyurethane spray foam.

The claimed material relates to a mixed silica and silicate fiber and polymer composite having enhanced modulus, viscoelastic and rheological properties.