C08K2201/003

INSULATING FILLER AND PRODUCTION METHOD THEREFOR, INSULATING MATERIAL CONTAINING SAID INSULATING FILLER AND PRODUCTION METHOD THEREFOR
20230118996 · 2023-04-20 · ·

An insulating filler composed of a mixed powder in which a hydrophobic fumed oxide powder having an average primary particle size D.sub.1, which is smaller than an average primary particle size D.sub.2, is adhered to the surface of a magnesium oxide powder and/or a nitride-based inorganic powder having the average primary particle size D.sub.2, wherein: the ratio D.sub.1/D.sub.2 of the average primary particle size D.sub.1 to the average primary particle size D.sub.2 is 6×10.sup.−5 to 3×10.sup.−3; the volume resistivity of the mixed powder is 1×10.sup.11 Ω.Math.m or more; and the content ratio of the hydrophobic fumed oxide powder in the mixed powder is 5-30 mass %. Also provided is an insulating material in which the above-mentioned insulating filler is contained in a resin molded body.

COMPOSITE MATERIAL AND METHOD FOR MANUFACTURING COMPOSITE MATERIAL
20230124486 · 2023-04-20 ·

A composite material according to the present invention includes a solid portion including inorganic particles and a resin. The composite material has a porous structure including a plurality of voids facing a wall surface of the solid portion. At least a portion of the inorganic particles is present on a wall surface. The plurality of voids are in contact with each other directly or via the inorganic particle. A heat transmission path stretching through the plurality of voids is formed of the inorganic particles in contact with each other.

USE OF A REINFORCED THERMOPLASTIC COMPOSITION

The field of molded articles and fiber-reinforced thermoplastic compositions for obtaining them. The use of the reinforced thermoplastic composition for obtaining a thin molded article with reduced warpage. The composition may include: from 30 to 70% by weight of an amorphous polyamide matrix by total weight of the composition; from 30 to 70% by weight of glass fibers with a circular cross-section by total weight of the composition; and optionally additives.

ANTIGLARE FILM LAMINATE, POLARIZING PLATE, AND DISPLAY DEVICE
20230117581 · 2023-04-20 · ·

The present invention relates to an antiglare film laminate including a polymer substrate, and an antiglare layer containing a binder resin and organic fine particles or inorganic fine particles dispersed on the binder resin, wherein the number of pressed portions formed on an outer surface of the antiglare layer is 0.001 pieces/m.sup.2 or less, and the pressed portion has a diameter of 200 μm to 600 μm and a thickness of 80% or less of an average thickness of the antiglare layer, a polarizing plate including the antiglare film laminate, and a display device including the polarizing plate.

GLASS-FIBER-REINFORCED RESIN PLATE
20230118488 · 2023-04-20 ·

Provided is a glass-fiber-reinforced resin plate excellent in dimensional stability, strength, surface smoothness, and productivity even if having a thickness of 0.5 mm or less. The present invention is a glass-fiber-reinforced resin plate having a thickness of 0.5 mm or less, comprising glass fiber that has a flat cross-sectional shape with a minor axis D.sub.s in the range of 4.5 to 12.0 .Math.m and a major axis D.sub.L in the range of 20.0 to 50.0 .Math.m, and an amorphous thermoplastic resin, wherein the number average fiber length L of the glass fiber is in the range of 50 to 400 .Math.m, the glass fiber content C is in the range of 25.0 to 55.0% by mass, and the D.sub.s, D.sub.L, L, and C satisfy the following formula (1): 0.32 ≤ 1000 × D.sub.s × D.sub.L.sup.3 × (C/100).sup.4/L.sup.3 ≤ 1.22 ...(1).

ORGANIC PHOSPHOROUS COMPOUND FLAME RETARDANT, PREPARATION METHOD AND APPLICATIONS THEREOF

The invention relates to an organic phosphorous compound flame retardant, their preparation methods and applications. The organic phosphorous compound flame retardants are prepared by drop-wise adding at least one from the soluble salts of di-alkyl hypophosphorous acid or soluble salts of mono-alkyl hypophosphorous acid as well as at least one from the soluble salts of alkyl phosphorous acid or soluble salts of phosphorous acid into the solution of soluble non-halogen salt of II-IV valent metal to react, or drop-wise adding at least one from the di-alkyl hypophosphorous acid or mono-alkyl hypophosphorous acid, and at least one from the alkyl phosphorous acid or phosphorous acid into at least one from the active oxides or hydroxides of II-IV valent metal to react.

FLUORINE-CONTAINING ELASTOMER COMPOSITION AND SEALING MATERIAL
20230064853 · 2023-03-02 ·

This fluorine-containing elastomer composition contains a fluorine-containing elastomer and a filler that has a particle diameter of from 10 nm to 100 nm. The fluorine-containing elastomer is a perfluoro elastomer or a fluorine rubber. The filler is composed of silicon particles, and silicon particles each having an oxide film. This fluorine-containing elastomer composition contains no other substance as a filler.

EPOXY RESIN COMPOSITION AND HEAT DISSIPATION CIRCUIT BOARD USING SAME
20220325033 · 2022-10-13 · ·

The present disclosure relates to an epoxy resin composition having a thermal conductivity of at least 5 W/m.Math.k, which has a sufficient thermal emission effect when implementing a multilayer circuit and can replace a ceramic substrate used in automobiles, home appliances, electric vehicles and the like, and to a heat dissipation circuit board using the same. The epoxy resin composition according to one embodiment of the present disclosure, the epoxy resin composition includes an epoxy resin, a curing agent and an inorganic filler. The inorganic filler may include alumina having a maximum particle diameter of less than 32 μm and aluminum nitride having a mean particle diameter of 0.5 to 1.0 μm, in an amount of 85 wt % or more. The epoxy resin composition includes an inorganic filler having a mean particle diameter of 1.0 μm to form an insulating layer having excellent thermal conductivity and withstand voltage properties, thereby providing a high heat dissipation circuit board that is superior compared to existing single layer circuit boards.

COMPOSITE BODY HAVING HIGH THERMAL CONDUCTIVITY AND METHOD OF MAKING THE COMPOSITE BODY

A composite article can comprise a composite body including an organic polymer and ceramic particles comprising hexagonal boron nitride (hBN) particles distributed throughout the organic polymer, wherein an amount of the hBN particles ranges from 40 vol % to 90 vol % based on a total volume of the body; and the body comprises an in plane thermal conductivity of at least 15 W/mK. The hBN particles within the composite body can have a March-Dollase Orientation parameter η of at least 50%.

POWDER PARTICULATES COMPRISING A WATER-SOLUBLE POLYMER AND PRODUCTION THEREOF BY MELT EMULSIFICATION

Powder particulates comprising a water-soluble polymer may be formed by melt emulsification. Compositions comprising powder particulates may comprise a plurality of particulates comprising a water-soluble polymer and a plurality of nanoparticles, the water-soluble polymer defining at least an outer surface of the particulates and at least a majority of the plurality of nanoparticles being disposed upon the outer surface.