A pressure sensitive adhesive composition containing: a (meth)acrylic ester polymer including butyl methacrylate and a reactive functional group-containing monomer as monomer units that constitute the polymer; and an inorganic filler, a pressure sensitive adhesive obtained by crosslinking the pressure sensitive adhesive composition, and a pressure sensitive adhesive sheet comprising at least a pressure sensitive adhesive layer that is formed from the above pressure sensitive adhesive composition. The above pressure sensitive adhesive composition allows the inorganic filler to be uniformly dispersed in a short time even when a dispersant is not contained. Moreover, in the above pressure sensitive adhesive and the pressure sensitive adhesive layer of the pressure sensitive adhesive sheet, the inorganic filler is uniformly dispersed.

A double-sided pressure-sensitive adhesive tape includes an acrylic pressure-sensitive adhesive, wherein the acrylic pressure-sensitive adhesive is formed from an acrylic pressure-sensitive adhesive composition, wherein the acrylic pressure-sensitive adhesive composition contains an acrylic partially polymerized product obtained by polymerizing a monomer component (m1), a monomer component (m2), a cross-linking agent, and a photopolymerization initiator, wherein the monomer component (m2) contains an alkyl (meth)acrylate having, at an ester terminal thereof, an alkyl group having 4 to 10 carbon atoms, and a polymerizable monomer whose corresponding homopolymer has a Tg of 0° C. or more, wherein in the monomer component (m2), a content of the polymerizable monomer whose corresponding homopolymer has a Tg of 0° C. or more is from 10 parts by weight to 90 parts by weight with respect to 100 parts by weight of the alkyl (meth)acrylate having, at an ester terminal thereof, an alkyl group having 4 to 10 carbon atoms.

The present disclosure relates to a polycarbonate resin composition having excellent light-reflecting and light-shielding properties, and an automotive molded article produced using the same. The polycarbonate resin composition includes: 60 to 70 wt % of a polycarbonate resin; 4 to 10 wt % of a rubber-modified vinyl-based graft copolymer; 3 to 11 wt % of a styrene-based copolymer; 15 to 25 wt % of titanium dioxide; and 2 to 3 wt % of a mineral filler.

Provided is a composite material that shows a low specific dielectric constant, and that hardly causes an appearance failure or changes in characteristics when exposed to, for example, a treatment liquid to be used in the production of an electronic circuit board. Specifically, a plate-like composite material including polytetrafluoroethylene and a predetermined filler, and satisfying a predetermined condition serves as a composite material that shows a low specific dielectric constant, and that hardly causes an appearance failure or changes in characteristics even when exposed to, for example, a treatment liquid to be used in the production of an electronic circuit board.

In an embodiment the dielectric layer comprises a fluoropolymer, a plurality of boron nitride particles, a plurality of titanium dioxide particles, a plurality of silica particles; and a reinforcing layer. The dielectric layer can comprise at least one of 20 to 45 volume percent of the fluoropolymer, 15 to 35 volume percent of the plurality of boron nitride particles, 1 to 32 volume percent of the plurality of titanium dioxide particles, 10 to 35 volume percent of the plurality of silica particles, and 5 to 15 volume percent of the reinforcing layer; wherein the volume percent values are based on a total volume of the dielectric layer.

The present invention is related to a process for the production of a vinyl aromatic (co)polymer comprising the steps of: a) mixing a fraction (A) comprising one or more monomers selected from the group consisting of styrene, alpha-methyl styrene, acrylonitrile, methyl (meth)acrylate, (meth)acrylic acid and butadiene with a fraction (B) comprising post-consumer recycled vinyl aromatic (co)polymer, wherein the weight ratio of fraction (B) to fraction (A) is comprised between 0.01/1 and 1/1, preferably between 0.05/1 and 0.5/1 b) subjecting the resulting mixture to a free-radical polymerization and polymerizing to a monomer conversion up to 90%, to obtain a polymerized mixture comprising vinyl aromatic (co)polymer; c) vacuum devolatizing the polymerized mixture and recovering vinyl aromatic (co)polymer characterized by a weight average molecular weight comprised between 100,000 and 400,000 g/mol;
wherein one or more bromine derivative capture agents are added before, and/or during and/or after at least one of the steps a) to c); and
wherein 100 parts of one or more bromine derivative capture agents comprises at least 50 parts by weight of hydrotalcite of the formula:

[Mg.sub.1-x Al.sub.x(OH).sub.2].sup.x+(CO.sub.3).sub.x/2.mH.sub.2O

wherein: 0<x≤0.5, and m is a positive number.

The present invention is also related to expandable and extruded expanded vinyl aromatic (co)polymer compositions obtained from vinyl aromatic (co)polymers comprising post-consumer and/or post-industrial vinyl aromatic (co)polymer and to a process for the production of said expandable and extruded expanded vinyl aromatic (co)polymer compositions.

A conductive paste for an electrolytic capacitor used for connecting a cathode part and a cathode lead terminal of the electrolytic capacitor. The conductive paste includes a thermosetting resin, and conductive particles, and the conductive particles include flaky metal particles and acicular conductive particles. The content of the conductive particles in the conductive paste is, for example, 50 mass % or more and 70 mass % or less, and the mass ratio of the flaky metal particles to the total of the flaky metal particles and the acicular conductive particles is, for example, 60% or more and 80% or less.

An ablative composite material including a matrix and a reinforcement, characterised in that: the matrix is a phenolic resin or an epoxy resin and the reinforcement is formed of short carbon fibres with a length of between 0.5 mm and 20 mm, and a diameter of between 6 μm and 20 μm.

Described herein is a curable fluoropolymer composition comprising: an amorphous fluoropolymer; and particles of a metal fluoride, wherein the particles are not substantially surface treated and wherein the metal of the metal fluoride comprises at least one of an alkaline earth metal, a Group III transition metals, and a Lanthanide metals. Also described are cured articles made with the curable fluoropolymer composition.

Provided is an encapsulating resin composition that is used for collectively encapsulating a circuit board (10) and at least a part of a connector portion (20), in which the encapsulating resin composition contains a curing accelerator, the connector portion (20) includes a terminal (21) that electrically connects the circuit board (10) with the external device, and a housing (22) that is disposed on an outer periphery of the terminal (21) and is encapsulated by the encapsulating resin composition, the housing (22) contains a thermoplastic resin, and in a differential scanning calorimetry (DSC) curve of the encapsulating resin composition obtained in a case where a temperature is increased from 30° C. to 200° C. under conditions of a temperature increase rate of 10° C./min using a DSC meter, a maximum heat release peak temperature is equal to or higher than 100° C. and equal to or lower than 163° C., and a half-value width of a maximum heat release peak is equal to or higher than 5° C. and equal to or lower than 25° C.