The purpose of the present invention is to provide: a molding material from which a carbon fiber reinforced composite material having excellent impact resistance and tensile strength is obtained; and a molding material from which a glass fiber reinforced composite material, that has high bending strength and impact resistance, has excellent weather resistance, and can suppress a decrease in bending strength after water absorption, is obtained. In order to achieve the purpose, the molding material according to the present invention is a molding material formed of an epoxy resin composition and a carbon fiber and/or a glass fiber, wherein the epoxy resin composition includes all of [A] to [C], the carbon fiber satisfies conditions [a] and [b], and the glass fiber has a surface functional group capable of forming a covalent bond with an isocyanate group. [A] Epoxy resin having at least two oxylan groups in molecule [B] Epoxy resin curing agent having at least two isocyanate groups in molecule [C] Catalyst [a] Having substantially perfect circular cross section [b] Average fiber diameter of 4.0-8.0 μm

A talc particulate, a polymer composition comprising said talc particulate, methods of making said talc particulate and said polymer composition, and the various uses of said talc particulate.

The dental restorative material of the present invention is a dental restorative material that contains a resin matrix and an inorganic filler in an amount of 25 to 1,000 parts by mass per 100 parts by mass of the resin matrix, and in the dental restorative material, the resin matrix contains a polyurethane resin, and the inorganic filler has an average particle diameter of 0.001 to 100 μm. According to the present invention, a dental restorative material that has a high bending strength and a high surface hardness, and is excellent in transparency and cutting workability, and a resin material for dental cutting work containing the same can be provided.

A thermoplastic resin composition of the present invention comprises: a polycarbonate resin; a rubber-modified vinyl-based graft copolymer; a large particle size rubbery polymer having an average particle size of about 400 to about 1,500 nm; an aromatic vinyl-based copolymer resin; a phosphorus-based flame retardant; talc; wollastonite; a maleic anhydride grafted rubbery polymer; and a black pigment. The thermoplastic resin composition is superior in terms of adhesion to metal, strength, flame retardancy, fluidity, and appearance.

The present invention relates to an epoxy resin composition for molding a semiconductor having excellent heat resistance and mechanical properties and also having improved visibility while having a low coefficient of thermal expansion and thus exhibiting improved warpage characteristics, and a molding film and a semiconductor package using such an epoxy resin composition for molding a semiconductor.

An object of the present invention is to provide a composition capable of forming a thermally conductive material having excellent thermally conductive properties and excellent handleability in a semi-cured state. In addition, another object of the present invention is to provide a thermally conductive material, a thermally conductive sheet, and a device with a thermally conductive layer.

The composition of the present invention contains a phenolic compound, an epoxy compound, a compound represented by Formula (1), and an inorganic nitride.

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A liquid repellent structure includes a surface to which liquid repellency is to be imparted, and a liquid repellent layer formed on the surface. In the structure: the liquid repellent layer contains a binder resin containing a fluorine-containing resin, and a filler dispersed in the binder resin; the filler contains a first filler having a BET specific surface area M of 100 m.sup.2/g to 400 m.sup.2/g; and the ratio M/F of the BET specific surface area M of the first filler to a mass F (mass %) of the fluorine-containing resin relative to the total mass of the liquid repellent layer is 4.1 to 20.0.

A curable particulate silicone composition is disclosed. The composition comprises: (A) hot-melt silicone fine particles having a specific reactive functional group; (B) an inorganic filler; and (C) a curing agent. The content of component (B) is in the range of from 87 to 95 vol. % of the total composition. The curable particulate silicone composition provides a cured product having an average linear expansion coefficient of not greater than 15 ppm/° C. in a range of from 25° C. to 200° C. The curable particulate silicone composition provides a cured product having a very low average linear expansion coefficient over a wide temperature range when cured and is particularly suitable for overmold molding and the like.

The present disclosure relates to a curing agent, an adhesive composition for a semiconductor device containing the curing agent, the adhesive composition exhibiting excellent adhesive strength and having excellent reliability because of being inhibited from cracking, an adhesive film for a semiconductor device, and a semiconductor package including the same.

Described are articles including treads and/or other tire components that are formed at least in part by rubber compositions having solid agglomerated material comprising disaggregated carbon nanotubes. Such rubber compositions include a diene rubber component and a solid agglomerated material comprising disaggregated carbon nanotubes that consist of a continuous network of carbon nanotubes that contains 1) voids and 2) aggregates of carbon nanotubes having a mean size d.sub.50 of less than 5 μm, the voids and the aggregates together in an amount that is less than 60% of a predetermined surface area, as determined by electron microscopy imagery analysis, the remainder being the disaggregated carbon nanotubes in the continuous network that do not comprise a clearly defined shape.