A thermoplastic resin composition of the present invention is characterized by comprising: a thermoplastic resin containing a rubber-modified vinyl-based graft copolymer and an aromatic vinyl-based copolymer resin; zinc oxide; zinc phosphate; a surface-coated zinc oxide, of which a portion or the entirety of a surface is coated with zinc phosphate. The thermoplastic resin composition has excellent acid resistance and antibacterial properties.

An acoustic damping material includes a binder matrix which includes a bitumen component or a polymer component, and a filler component that includes at least one solid particulate cellulose-containing filler. The acoustic damping material is suitable for use in damping of undesired vibrations and noise in mechanical structures and components of manufactured articles. The acoustic damping material may be applied to damping of vibrations and noise in transportation vehicles and white goods, to a vibration and noise damping element including a damping layer composed of the acoustic damping material, to a method for applying a vibration and noise damping element to a noise emitting surface of a substrate, and to a vibration damped system comprising a substrate and the vibration and noise damping element bonded to a noise emitting surface of the substrate.

A resin composition containing a bismaleimide compound (A) containing a constituent unit represented by the following formula (1) and maleimide groups at both ends of the molecular chain, a radical polymerizable resin or compound (B) other than the bismaleimide compound (A), and a curing accelerator (C), wherein the radical polymerizable resin or compound (B) contains at least one selected from the group consisting of a citraconimide group, a vinyl group, a maleimide group, a (meth)acryloyl group and an allyl group.

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Provided are a resin composition, which is used for transfer molding, including a resin (A), a magnetic powder (B) having a median diameter of 7.5 to 100 μm, and particles (C) having a median diameter of 0.2 to 5 μm, in which a saturation magnetic flux density of a molded article obtained by transfer molding the resin composition at 175° C. is equal to or more than 1.1 T; and a molded article formed of the resin composition. The particles (C) may include a magnetic powder or a non-magnetic powder.

A thermally conductive silicone composition that has high thermal conductivity and excellent workability and misalignment resistance, and contains, in specific ratios: a silicone gel cross-linked product (A); a silicone oil (B) not containing either aliphatic unsaturated bonds or SiH groups and being used as a surface treatment agent for components (C) and (D); an aluminum powder (C) including (C-1)-(C-3), (C-1) being an aluminum powder having an average particle diameter of 40-100 μm, (C-2) being an aluminum powder having an average particle diameter of at least 6 μm and less than 40 μm, and (C-3) being an aluminum powder having an average particle diameter of at least 0.4 μm and less than 6 μm; a zinc oxide powder (D) having an average particle diameter of 0.1-10 μm; and a volatile solvent (E).

Disclosed are a resin composition comprising 20 to 50 mass % of a polyphenylene ether-based resin (a), 0.1 to 9 mass % of a polyphenylene ether-based resin modified with an unsaturated carboxylic acid or acid anhydride thereof (b), 15 to 50 mass % of a homopolystyrene (c), 1 to 25 mass % of one or more selected from the group consisting of a hydrogenated block copolymer (d-1) and a rubber-modified polystyrene (d-2), and 5 to 35 mass % of glass fibers (e) which are surface-treated, a resin composition comprising 20 to 50 mass % of a polyphenylene ether-based resin (a), 15 to 50 mass % of a homopolystyrene (c), 5 to 35 mass % of glass fibers (e), and 0.01 to 1 mass % of compounds (f), a method of producing the same, a molded article, and a mechanical component and housing.

The present invention provides a resin composition capable of giving a molded body having a metallic color tone and excellent in surface hardness, surface glossiness, mechanical properties, and flow mark reducing property. The present invention relates to a polyamide resin composition comprising 100 parts by mass of a polyamide (A), 0.1 to 50 parts by mass of a cellulose fiber (B) having an average fiber diameter of 10 μm or less and 0.1 to 12 parts by mass of a metallic pigment (C).

An organopolysiloxane is provided. The organopolysiloxane is represented by a general formula.

In the general formula, R.sup.1 are the same or different aliphatic unsaturated monovalent hydrocarbon groups having 2 to 12 carbon atoms, R.sup.2s are the same or different monovalent hydrocarbon groups having 1 to 12 carbon atoms and not having an aliphatic unsaturated bond, R.sup.3s are the same or different alkyl groups having 1 to 3 carbon atoms, “n” is an integer of from 1 and 500, and “a” is 0 or 1. A thermally conductive silicone composition having the organopolysiloxane as a component is also provided. The organopolysiloxane can be used as a surface treatment agent for a thermally conductive filler. The organopolysiloxane provides for favorable handling/workability of compositions even if such compositions are highly loaded with a thermally conductive filler.

Provided is a liquid crystal polymer composition having a low coefficient of static friction and a low coefficient of kinetic friction both during sliding between a liquid crystal polymer molded body and a metallic material and during sliding between liquid crystal polymer molded bodies. The liquid crystal polymer composition contains a liquid crystal polymer (A), a polytetrafluoroethylene resin (B), and barium sulfate (C).

A polyurethane film comprising a polyurethane resin and graphene, wherein the graphene is present in an amount of 1 to 30% by weight on the total weight of the film and consists of graphene nano-platelets, wherein at least 90% has a lateral dimension (x, y) of 50 to 50000 nm and a thickness (z) of 0.34 to 50 nm, wherein the lateral dimension is always greater than the thickness (x, y>z), wherein the C/O ratio is ≥100:1, and a preparation process thereof.