The present disclosure relates to a dielectric substrate that may include a polymer based core film, and a fluoropolymer based adhesive layer. The polymer based core film may include a resin matrix component, and a ceramic filler component. The ceramic filler component may include a first filler material. The particle size distribution of the first filler material may have a D.sub.10 of at least about 1.0 microns and not greater than about 1.7, a D.sub.50 of at least about 1.0 microns and not greater than about 3.5 microns, and a D.sub.90 of at least about 2.7 microns and not greater than about 6 microns.

Compounds having an elastomer material, a filler material, at least one additive material, and at least one accelerant material are disclosed. In various embodiments, the filler material comprises a graphene-based carbon material. In various embodiments, the graphene-based carbon material comprises graphene comprising up to 15 layers, carbon aggregates having a median size from 1 to 50 microns, a surface area of the carbon aggregates at least 50 m.sup.2/g, when measured via a Brunauer-Emmett-Teller (BET) method with nitrogen as the adsorbate, and no seed particles.

Provided is a copper-based paste capable of bonding a chip component and a substrate more firmly and obtaining a copper-based bonding material having high thermal conductivity. This copper oxide paste includes copper-containing particles, a binder resin, and an organic solvent. The copper-containing particles contain Cu.sub.2O and CuO. The total amount of copper element constituting Cu.sub.2O and copper element constituting CuO is 90% or more of the copper element contained in the copper-containing particles. The copper-containing particles have a 50% cumulative particle size (D.sub.50) of 0.20-5.0 μm inclusive; the 50% cumulative particle size (D.sub.50) and the 10% cumulative particle size (D.sub.10) satisfy 1.3≤D.sub.50/D.sub.10≤4.9; the 50% cumulative particle size (D.sub.50) and the 90% cumulative particle size (D.sub.90) satisfy 1.2≤D.sub.90/D.sub.50≤3.7, and the BET specific surface area of the copper-containing particles is 1.0 m.sup.2/g to 8.0 m.sup.2/g inclusive.

A hot press cushioning material includes fluororubber. A composition of the fluororubber includes a fluororubber component, a vulcanizing agent, an acid acceptor, and a dehydrating agent.

An object of the present invention is to provide a technique capable of reducing the hydrolysis of a biodegradable resin at the time of molding with respect to a biodegradable resin-containing resin composition having a high water content. Provided is a resin composition comprising: a biodegradable resin and heavy calcium carbonate particles in a mass ratio of 50:50 to 10:90, in which 0.5% by mass or more and 3.5% by mass or less of calcium oxide is comprised relative to the resin composition, and 0.2% by mass or more of water is comprised relative to the resin composition.

Nanocellulose dispersion compositions containing a partitioning agent and a nanocellulose, and methods of making the nanocellulose dispersion compositions, are disclosed. These nanocellulose dispersion compositions can be used in tire formulations with carbon black and a suitable elastomer to produce articles of manufacture for use in tire and tread applications.

A rubber composition is prepared by mixing a specific hydrazide compound at a ratio of 0.5 to 3.0 parts by mass, zinc oxide at a ratio of 1 to 5 parts by mass, and carbon black having N.sub.2SA of 60 to 150 m.sup.2/g at a ratio of 30 to 60 parts by mass per 100 parts by mass of diene rubber containing 80 parts by mass or more of natural rubber. The rubber composition is prepared through (a) mixing the hydrazide compound and the carbon black to obtain a mixture, and (b) mixing the zinc oxide with the mixture obtained in step (a) to obtain a mixture. A maximum ultimate temperature during the mixture in step (a) is from 140 to 170° C. A storage modulus and elongation at break have a specific relationship.

A method for forming a golf ball core with a nanofiller masterbatch is disclosed herein. The method includes mixing the nanofiller masterbatch, a graphene masterbatch material with other materials to form a core mixture, wherein the masterbatch preferably comprises 1-80% by weight of nanofillers and 20-99% by weight of a carrier polymer.

Provided is a composite material that shows a low specific dielectric constant, and that hardly causes an appearance failure or changes in characteristics when exposed to, for example, a treatment liquid to be used in the production of an electronic circuit board. Specifically, a plate-like composite material including polytetrafluoroethylene and a predetermined filler, and satisfying a predetermined condition serves as a composite material that shows a low specific dielectric constant, and that hardly causes an appearance failure or changes in characteristics even when exposed to, for example, a treatment liquid to be used in the production of an electronic circuit board.

Described herein is an electrically dissipative polyurethane foam and a method of using the electrically dissipative polyurethane foam in trench breakers or pipeline pillows.