A resin composition contains a thermosetting resin (A) and an inorganic filler (B). The inorganic filler (B) includes: a first filler (B1); and a second filler (B2) of a nanometer scale having a smaller particle size than the first filler (B1). The first filler (B1) includes an anhydrous magnesium carbonate filler (b1) and an alumina filler (b2). The proportion of the first filler (B1) relative to a total solid content in the resin composition is equal to or greater than 50% by volume and equal to or less than 90% by volume. The proportion of the second filler (B2) relative to the total solid content in the resin composition is equal to or greater than 0.1% by volume and equal to or less than 2.0% by volume.

A water-repellent structure includes: a base material; and a water-repellent layer located on a surface of the base material. The water-repellent layer contains water-repellent particles and filler particles having an average particle size that is 20 times or more as large as an average particle size of the water-repellent particles.

The use of at least one mono-substituted succinic anhydride is described before or during compounding of a polymer composition including at least one polymer as polymer component and at least one calcium carbonate-based material as filler. The use of the at least one mono-substituted succinic anhydride can reduce the polymer decomposition during processing and/or can decrease the melt flow rate of such a compounded polymer composition by at least 10%. The use can also increase the viscosity of such a compounded polymer composition by at least 10%, in comparison to the same polymer composition that has been treated the same way in the absence of any mono-substituted succinic anhydride, wherein the polymer composition does not include polylactic acid.

In the (meth)acrylic resin composition of the present invention, when a sealed container is used, it is possible to achieve both storage stability in an atmosphere at 25° C. and low temperature curability in an atmosphere at 60 to 140° C., and further, properties thereof can be exhibited even in an electroconductive adhesive including electroconductive particles. The present invention is a (meth)acrylic resin composition including the following components (A) to (C): component (A): a urethane modified oligomer having a (meth)acrylic group, component (B): a monomer having a hydroxyl group and/or a carboxylic group and one (meth)acrylic group in a molecule in which a surface tension is 25 to 45 mN/m, and component (C): an organic peroxide having a specific structure.

The present invention provides a compounding agent which, when used in a rubber composition containing a reinforcing filler, exhibits excellent dispersibility, workability, toughness, low heat build-up, and wear resistance; and a rubber composition containing the compounding agent. A modified butadiene polymer of the present invention has a functional group containing a nitrogen atom and silicon atom at a terminal, a weight average molecular weight of the modified butadiene polymer being from 1000 to 15000, and a molecular weight distribution of the modified butadiene polymer being 2.0 or less.

The present invention is characterized by including an aromatic vinyl-based copolymer, glass fiber, and zinc oxide, wherein the zinc oxide has an average particle size (D50) of about 0.5 to 3 μm as measured by a particle size analyzer, and a size ratio (B/A) of peak B, spanning the range of 450 to 600 nm, to peak A, spanning the range of 370 to 390 nm, of about 0.01 to 1.0 when measuring photoluminescence. The thermoplastic resin composition exhibits excellent rigidity, antibacterial properties, weather resistance, external appearance and the like.

Provided are a thermoplastic resin composition and a molded product produced therefrom, and the thermoplastic resin composition includes 100 parts by weight of a base resin including (A) 65 to 85 wt % of a polycarbonate resin, (B) 7 to 20 wt % of an acrylic rubber-modified aromatic vinyl-based graft copolymer, and (C) 7 to 20 wt % of an aromatic vinyl-vinyl cyanide copolymer; (D) 0.7 to 5 parts by weight of zinc oxide (ZnO); and (E) 7 to 15 parts by weight of a block copolymer including a polyether segment and a polyamide segment, wherein the (D) zinc oxide has an average particle diameter of 0.5 to 3 μm, a peak position 2 θ value obtained by X-ray diffraction (XRD) analysis of 35 to 37°, and a crystallite size according to Equation 1 of 1,000 to 2,000 Å. Equation 1 is the same as disclosed in the specification.

This invention relates to a coating composition. The coating composition may include hydrophobized aluminum silicate particles, a film-forming binder, and a solvent. the hydrophobized aluminum silicate particles comprise aluminum silicate particles having a pore diameter of about 50 Å or more and a hydrophobic coating on a surface of the aluminum silicate particles.

Provided is a paste for a secondary battery that can cause an electrode mixed material layer to display excellent adhesiveness and can reduce internal resistance of a secondary battery. The paste for a secondary battery contains a conductive additive, a polymer, and a dispersion medium. The conductive additive includes one or more carbon nanotubes having a surface acid content of not less than 0.01 mmol/g and not more than 0.15 mmol/g, a surface base content of not less than 0.005 mmol/g and not more than 0.500 mmol/g, a ratio of the surface acid content relative to the surface base content of not less than 1.3 and not more than 3.0, and a specific surface area of 150 m.sup.2/g or more.

A thermally conductive silicone composition contains a silicone polymer and a thermally conductive inorganic filler. The ratio X of the BET specific surface area (m.sup.2/g) to the average particle size (μm) of the thermally conductive inorganic filler is 0.1 or more. The thermally conductive inorganic filler is surface treated with a first surface treatment agent and further surface treated with a second surface treatment agent. The first surface treatment agent contains an organic silane compound represented by R.sup.11SiR.sup.12.sub.x(OR.sup.13).sub.3-x (where R.sup.11 is, e.g., a monovalent aliphatic hydrocarbon group having 1 to 4 carbon atoms or a monovalent aromatic hydrocarbon group having 6 to 30 carbon atoms, R.sup.12 is, e.g., a methyl group, and R.sup.13 is, e.g., a hydrocarbon group having 1 to 4 carbon atoms). The second surface treatment agent contains a silicone polymer that has a kinematic viscosity of 1000 mm.sup.2/s or less and does not have a hydrolyzable group. Thus, the present invention provides a thermally conductive silicone composition that has improved viscoelasticity and heat resistance, and a method for producing the thermally conductive silicone composition.