It could be helpful to provide a rubber composition that can achieve both reinforcement property and low loss property at a high level. In order to solve the aforementioned problems, the disclosure is a rubber composition comprising a rubber component, carbon black, and silica, wherein the silica has a CTAB adsorption specific surface area of 250 m.sup.2/g or more; the silica has a diameter in the form of aggregates (D.sub.CPS) and a primary particle diameter (D.sub.I), as measured by disk centrifugal particle size analysis, that satisfy: 700≥D.sub.CPS.sup.3/D.sub.I.sup.3≥300 (1); the rubber component contains at least one selected from natural rubber and polyisoprene rubber, and at least one selected from modified butadiene rubber and modified styrene butadiene rubber; and the carbon black is contained by a mass ratio of 70% or more with respect to the total mass content of the carbon black and the silica.

The introduction of graphene as an additive in rubber compounds is disclosed. The product shows increased barrier protection for tire sidewalls, with no tradeoffs in other characteristics.

The introduction of graphene as an additive in rubber compounds is disclosed. The product shows increased barrier protection for tire innerliners, with no tradeoffs in other characteristics.

The present invention provides a run-flat tire excellent in high-temperature softening inhibition, and a rubber composition from which the tire can be produced. The rubber composition contains a rubber component, a filler, a vulcanizing agent, and a vulcanization accelerator that contains a sulfenamide-based vulcanization accelerator and 1.0 to 2.0 parts by mass of tetrabenzylthiuramdisulfide based on 100 parts by mass of the rubber component, in which a mass ratio (a/b) of a content (a) of the tetrabenzylthiuramdisulfide to a content (b) of the sulfenamide-based vulcanization accelerator is 0.60 to 1.25.

An acrylic conductive paste is provided, based on 100 parts by weight, including: 30-84 parts of conductive particles, 15˜45 parts of acrylate, 0.5˜2.5 parts of adhesion promoter, 0.5˜3 parts of initiator. The conductive particles include three-dimensional dendritic conductive particles; and the adhesion promoter is a mixture of a silane coupling agent and a phosphate ester. The conductive paste of the present disclosure has good electrical conductivity, short curing time, strong adhesion, and can be used for a long-time room temperature operation. The present disclosure also provides a method for preparing the above-mentioned acrylic conductive paste, which is convenient for operation and industrial application; at the same time, it shows that the acrylic conductive paste of the present disclosure can be applied to semiconductor components for packaging a semiconductor device.

An epoxy conductive paste is disclosed, based on 100 parts by total mass, comprising the following raw material components: 30˜81 parts of conductive particles, 16˜30 parts of epoxy, 0.2˜3 parts of acrylic, 1˜15 parts of reactive diluent, 1˜15 parts of toughening agent, 0.4˜5 parts of silane coupling agent, and 0.4˜5 parts of cationic curing agent; wherein, the conductive particles include conductive particles with a three-dimensional dendritic microstructure. The conductive paste of the disclosure has the characteristics of good conductivity, short curing time, strong adhesion, and capability for long-term operation at room temperature.

In a first aspect, the present invention is directed to a rubber composition comprising 70 phr to 100 phr of styrene butadiene rubber including a first styrene butadiene rubber having a glass transition temperature within a range of −49° C. to −15° C. and a second styrene butadiene rubber having a glass transition temperature within a range of −50° C. to −89° C. Moreover, the rubber composition comprises 10 phr to 30 phr of one or more of natural rubber and synthetic polyisoprene rubber, 40 phr to 70 phr of silica, and 10 phr to 40 phr of at least one hydrocarbon resin selected from one or more of C5 resins, CPD resins, DCPD resins, C9 modified C5 resins, C9 modified CPD resins, and C9 modified DCPD resins. In another aspect, the present invention is directed to a tire comprising a tire tread with the aforementioned rubber composition.

A polymer composition comprises a polyethylene polymer having a Melt Relaxation Ratio of 1.5 or greater and a salt of a branched alkyl phosphonic acid. A method for molding a thermoplastic polymer composition comprises the steps of (a) providing an apparatus comprising a die and a mold cavity; (b) providing the polymer composition described above; (c) heating the polymer composition to melt the polymer composition; (d) extruding the molten polymer composition through the die to form a parison; (e) capturing the parison in the mold cavity; (f) blowing a pressurized fluid into the parison to inflate the parison and conform it to the interior surface of the mold cavity; (g) allowing the molded article to cool so that the molded article retains its shape; and (h) removing the molded article from the mold cavity.

Provided are a thermoplastic resin composition and a molded product manufactured therefrom, the thermoplastic resin composition including, based on 100 parts by weight of a base resin including (A) 75 to 85 wt % of a polycarbonate resin; (B) 7 to 15 wt % of an acrylic rubber-modified aromatic vinyl graft copolymer; and (C) 7 to 13 wt % of an aromatic vinyl-vinyl cyanide copolymer; (D) 0.7 to 5 parts by weight of zinc oxide (ZnO); and (E) 0.2 to 0.6 parts by weight of a phosphorus-based compound represented by Chemical Formula 1.

(RO).sub.nP(═O)(OH).sub.3-n  [Chemical Formula 1]

In Chemical Formula 1, n is an integer of 1 to 3, and R is selected from a substituted or unsubstituted C1 to C30 alkyl group, a C2 to C30 alkenyl group, a C2 to C30 alkynyl group, a substituted or unsubstituted C1 to C30 and a substituted or unsubstituted C3 to C30 heteroaryl group.

A modified epoxy acrylic resin conductive adhesive is disclosed, based on 100 parts by total mass, including the following components: 49-75 parts of conductive particles, 24-45 parts of modified epoxy propylene resin, 0.5-2.5 parts of silane coupling agent, and 0.5-3.0 parts of initiator. The conductive particles include at least 5% conductive particles with a three-dimensional dendritic microstructure among all the conductive particles. A preparation method and application of the modified epoxy acrylic resin conductive adhesive are disclosed. The modified epoxy acrylic resin conductive adhesive of the present disclosure has advantages in good electrical conductivity, short curing time, strong adhesion, and capability being used for a long-time room temperature operation.